公开(公告)号：EP1391651A4

公开(公告)日：2005-10-12

申请号：EP01274160

申请日：2001-12-21

Applicant: IBM

Inventor： HORIBE AKIHIRO ,  NISHIKAI AKIKO

IPC: F21V8/00

CPC classification number: G02B6/0028 ,  G02B6/0046 ,  G02B6/0071 ,  G02B6/009

Abstract: An illuminator, a liquid crystal display and a lamp socket in which a dark part, so-called angular irregularities, is improved. The illuminator comprises a light guide plate (28) including a light beam incidence face (46) and an emission face (46) for radiating a light beam from the incident face, a light source (30) including a light emitting part and a non-light emitting part disposed contiguously to the light guide plate (28) in order to irradiate it with a light beam, a lamp socket (34) for containing at least one end of the light source (30), and a reflector (32) extending along the light source (30)and reflecting the light beam from the light source (30). The lamp socket (34) scatters light having wavelength of 300-900 nm and has a transmittance of 20-90%. The invention also relates to a display comprising the aforementioned side light apparatus.

公开(公告)号：JP2013093507A

公开(公告)日：2013-05-16

申请号：JP2011235876

申请日：2011-10-27

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation

Inventor： HORIBE AKIHIRO

IPC: H01L21/60 ,  H01L23/12

CPC classification number: B23K1/0016 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029

Abstract: PROBLEM TO BE SOLVED: To provide a solder bonding process for forming semiconductor chips in multistage into a three-dimensional stack assembly, as a process having a resistance against electromigration (EM) and applicable even to a high end semiconductor chip.SOLUTION: When making a three-dimensional stack assembly by stacking two kinds of solder having different melting points at an electrical joint, chips are stacked (primary) by melting only a low temperature solder and sealed by underfill. A high temperature solder is melted at the time of stacking on a mother board (secondary). The gap and the bump shape can be held even during secondary mounting on the mother board.

Abstract translation: 要解决的问题：提供一种用于将多层半导体芯片形成三维堆叠组件的焊接接合工艺，作为具有抗电迁移（EM）的工艺，甚至可应用于高端半导体芯片。

解决方案：通过在电接头处堆叠具有不同熔点的两种焊料来制造三维堆叠组件时，通过仅熔化低温焊料并通过底部填充而密封芯片（初级）。 在母板（次级）堆叠时，高温焊料熔化。 即使在二次安装在母板上的情况下，也可以保持间隙和凸起形状。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2013091093A

公开(公告)日：2013-05-16

申请号：JP2011235915

申请日：2011-10-27

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation

Inventor： HORIBE AKIHIRO

IPC: B23K35/363 ,  B23K1/00 ,  B23K101/40 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide no-clean flux generating solventless thermoplastic residue and forming thermosetting resin by the thermoplastic residue reacting with an underfill component.SOLUTION: The no-clean flux includes dicarboxylic acid as a flux activator, an epoxy prepolymer having an average function group number of around 2.0 as a resin component, and a solvent with its boiling point equal to or lower than 260°C as a viscosity modifier. The no-clean flux eliminates an oxide film of solder during reflow, and forms a thermoplastic epoxy cured material which becomes a liquid form when coating the underfill at glass transition temperature of 100°C or lower. Regarding the solvent as a viscosity modifier, almost the total amount volatilizes during the reflow. After the reflow, when coating the underfill without cleaning, the cured material is compatibilized with the underfill and reacts with the curing agent contained in the underfill, which can form a three-dimensional cross-linked structure together with the underfill.

Abstract translation: 要解决的问题：提供无清洁的助熔剂产生无溶剂的热塑性残留物并通过热塑性残留物与底部填充剂组分反应形成热固性树脂。 解决方案：无清洁助焊剂包括作为助熔剂活化剂的二羧酸，作为树脂组分的平均官能团数为约2.0的环氧预聚物和沸点等于或低于260℃的溶剂 作为粘度调节剂。 免清洗助焊剂在回流时消除了焊料的氧化膜，形成了在100℃或更低的玻璃化转变温度下涂覆底部填料时成为液态的热塑性环氧树脂固化物。 关于溶剂作为粘度调节剂，在回流期间几乎总量挥发。 在回流之后，当没有清洁地涂覆底部填料时，固化材料与底部填充剂相容，并与底层填料中所含的固化剂反应，其可与底部填充物一起形成三维交联结构。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012253193A

公开(公告)日：2012-12-20

申请号：JP2011124548

申请日：2011-06-02

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： HORIBE AKIHIRO ,  YAMADA FUMIAKI

IPC: H01L21/66 ,  H01L21/3205 ,  H01L21/768 ,  H01L23/522

CPC classification number: H01L21/76898 ,  G01N29/0681 ,  G01N29/11 ,  G01N2291/2697 ,  H01L22/12 ,  H01L22/20 ,  H01L22/34 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/014

Abstract: PROBLEM TO BE SOLVED: To detect a defect in a three-dimensional integrated structure by ultrasound scanning and to non-destructively detect the presence of a void that can occur in a process in a through silicon via (TSV) arranged in a board, such as a silicon wafer.SOLUTION: To prevent measurement by ultrasound scanning over a board surface from being impeded by physical obstructions such as a (solder) bump which scatter ultrasound, one or more TSVs belonging to a test element group (TEG) are selected from among a plurality of TSVs so as to have fewer physical obstructions.

Abstract translation: 要解决的问题：通过超声波扫描来检测三维一体化结构中的缺陷，并且非破坏性地检测可能发生在通过硅通孔（TSV）中布置的通孔硅过孔（TSV）中的过程中的空隙的存在 板，例如硅晶片。 解决方案：为了防止超声波扫描在板表面上的测量被物理障碍物（例如散射超声波的（焊料）凸块）阻碍，属于测试元件组（TEG）的一个或多个TSV选自 多个TSV，以便具有较少的物理障碍物。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2002277875A

公开(公告)日：2002-09-25

申请号：JP2001084432

申请日：2001-03-23

Applicant: IBM

Inventor： HORIBE AKIHIRO ,  SUZUKI MASARU ,  FUJITA TAKASHI ,  KUSHIDA NAOYA

IPC: G02B5/20 ,  G02F1/1335 ,  G02F1/13357 ,  G02F1/1343 ,  G09F9/00

Abstract: PROBLEM TO BE SOLVED: To obtain a color liquid crystal display which secures sufficient luminance, while realizing high NTSC ratio. SOLUTION: The liquid crystal display is provided with a cold cathode fluorescent tube as a light source and a liquid crystal display panel, which controls transmission of light from the cold cathode fluorescent tube to display an image. The liquid crystal display panel has a color filter substrate, having red, green, and blue color filter layers, a TFT array substrate, and a liquid crystal material, which is sealed between the TFT array substrate and the color filter substrate. The cold cathode fluorescent tube is a three-wavelength fluorescent tube, and Zn2 SiO4 :Mn is used as its green phosphor. The cold cathode fluorescent tube and the color filter layers are optimized so that the color reproducing area of light emitted from the cold cathode fluorescent tube through the color filter layers have >=85% for NTSC ratio.

公开(公告)号：JP2002277870A

公开(公告)日：2002-09-25

申请号：JP2001061120

申请日：2001-03-06

Applicant: IBM

Inventor： HORIBE AKIHIRO ,  SUZUKI MASARU ,  FUJITA TAKASHI ,  KUSHIDA NAOYA

IPC: G02B5/20 ,  G02F1/1335 ,  G02F1/13357 ,  G09F9/30

Abstract: PROBLEM TO BE SOLVED: To obtain a color liquid crystal display which secures sufficient luminance, while realizing a high NTSC ratio. SOLUTION: The liquid crystal display is provided with a cold cathode fluorescent tube as a light source and a liquid crystal display panel, which controls transmission of light from the cold cathode fluorescent tube to display an image. The liquid crystal display panel has a color filter substrate having red, green, and blue color filter layers, a TFT array substrate, and a liquid crystal material, which is sealed between the TFT array substrate and the color filter substrate. The cold cathode fluorescent tube is a three-wavelength fluorescent tube, and Zn2 SiO4 :Mn is used as its green phosphor. The cold cathode fluorescent tube and the color filter layers are optimized so that the color reproducing area of light emitted from the cold cathode fluorescent tube through the color filter layers has >=85% for the NTSC ratio.

公开(公告)号：HK1062321A1

公开(公告)日：2004-10-29

申请号：HK04105321

申请日：2004-07-21

Applicant: IBM

Inventor： HORIBE AKIHIRO ,  NISHIKAI AKIKO

IPC: F21V20060101 ,  F21V8/00 ,  G02F20060101

Abstract: To provide a lighting system that resolves the problems presented by dark areas, so called shading at the corner, and a liquid crystal display device and a lamp socket therefor. According to the present invention, a lighting system comprises: a light guide plate 28, having a plane 46 of incidence into which light enters and a plane 48 of emission from which the light is emitted, a light source 30, having a luminous portion and a non-luminous portion, that is located adjacent to the light guide plate 28 so that the light guide plate 28 is irradiated by light, a lamp socket 34, for holding at least one end of the light source 30, and a reflector 32, which is extended along the light source 30 for reflecting the light produced by the light source 30, and wherein the lamp socket 34 exhibits a transmittance of 20 to 90% in wavelengths of from 300 to 900 nm, and the light is scattered through the lamp socket. The present invention also relates to a display device using the above described side light device.

公开(公告)号：DE112018003103T5

公开(公告)日：2020-03-26

申请号：DE112018003103

申请日：2018-08-01

Applicant: IBM

Inventor： OKAMOTO KEISHI ,  HORIBE AKIHIRO ,  MORI HIROYUKI

IPC: H05K3/06

Abstract: Eine Technik zum Verbinden von Chips mithilfe eines Verbindungssubstrats wird offenbart. Das Verbindungssubstrat enthält ein Basissubstrat, eine erste Gruppe von Elektroden auf dem Basissubstrat für einen ersten zu montierenden Chip und eine zweite Gruppe von Elektroden auf dem Basissubstrat für einen zweiten zu montierenden Chip. Das Verbindungssubstrat enthält des Weiteren eine Verbindungsschicht, die einen ersten Satz von Kontaktflächen für den ersten Chip, einen zweiten Satz von Kontaktflächen für den zweiten Chip, Leiterbahnen und ein organisches Isolationsmaterial enthält. Die Verbindungsschicht ist auf dem Basissubstrat angeordnet und befindet sich innerhalb eines definierten Bereichs auf dem Basissubstrat zwischen der ersten Gruppe von Elektroden und der zweiten Gruppe der Elektroden.

公开(公告)号：BRPI0917363A2

公开(公告)日：2012-05-02

申请号：BRPI0917363

申请日：2009-11-03

Applicant: IBM

Inventor： HORIBE AKIHIRO ,  YAMADA FUMIAKI ,  TAIRA YOICHI

IPC: G02B6/42 ,  G02B6/036

Abstract: The present invention relates to a method of aligning circular multi-core fibers, wherein the method utilized independent and individually selected cores to receive, transmit, and emit light from input devices. The present invention further relates to positioning the ends of a multi-core fiber in order to detect and determine the precise locations of individually selected core fibers.

公开(公告)号：DE60138770D1

公开(公告)日：2009-07-02

申请号：DE60138770

申请日：2001-12-21

Applicant: IBM

Inventor： HORIBE AKIHIRO ,  NISHIKAI AKIKO

IPC: F21V8/00

Abstract: To provide a lighting system that resolves the problems presented by dark areas, so called shading at the corner, and a liquid crystal display device and a lamp socket therefor. According to the present invention, a lighting system comprises: a light guide plate 28, having a plane 46 of incidence into which light enters and a plane 48 of emission from which the light is emitted, a light source 30, having a luminous portion and a non-luminous portion, that is located adjacent to the light guide plate 28 so that the light guide plate 28 is irradiated by light, a lamp socket 34, for holding at least one end of the light source 30, and a reflector 32, which is extended along the light source 30 for reflecting the light produced by the light source 30, and wherein the lamp socket 34 exhibits a transmittance of 20 to 90% in wavelengths of from 300 to 900 nm, and the light is scattered through the lamp socket. The present invention also relates to a display device using the above described side light device.