中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.015 seconds)

    POLISHING PAD GROOVING METHOD AND APPARATUS
    1.
    发明公开
    POLISHING PAD GROOVING METHOD AND APPARATUS 有权
    方法和设备对于Groove波兰垫

    公开(公告)号：EP1299210A4

    公开(公告)日：2004-11-17

    申请号：EP01952272

    申请日：2001-06-27

    Applicant: IBM ,  FREUDENBERG NON WOVENS

    Inventor： CHEN SHYNG-TSONG ,  CHUNG ALEX SIU KEUNG ,  DAVIS KENNETH M ,  HSU OSCAR KAI CHI ,  RODBELL KENNETH P

    IPC: B24B37/26 ,  B24D13/14 ,  H01L21/304 ,  B24B1/00 ,  B23C3/28 ,  B24B37/04 ,  B24D18/00 ,  B26D7/01

    CPC classification number: B24B37/26 ,  Y10T409/303808 ,  Y10T409/306608 ,  Y10T409/308624

    Abstract: Grooves (70, 76, 78, & 80-82) are formed in a CMP pad (12) by positioning the pad (12) on a supporting surface (10) with a working surface (22) of the pad (12) in spaced relation opposite to a router bit (24) and at least one projecting stop member (33) adjacent to the router bit (24), an outer end portion of the bit (24) projecting beyond the stop (33). When the bit (24) is rotated, relative axial movement between the bit (24) and the pad (12) causes the outer end portion of the bit (24) to cut an initial recess in the pad (12). Relative lateral movement between the rotating bit (24) and the pad (12) then forms a groove (70) which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove (70) are limited by applying a vacuum to the working surface (22) of the pad (12) to keep it in contact with the stop member(s) (33). Different lateral movements between the bit (24) and the pad (12) are used to form a variety of groove patterns (76, 78, & 80-82), the depths of which are precisely controlled by the stop member(s) (33).

    POLISHING PAD GROOVING METHOD AND APPARATUS
    3.
    发明专利
    POLISHING PAD GROOVING METHOD AND APPARATUS 未知

    公开(公告)号：CA2413803A1

    公开(公告)日：2002-01-10

    申请号：CA2413803

    申请日：2001-06-27

    Applicant: FREUDENBERG NON WOVENS ,  IBM

    Inventor： DAVIS KENNETH M ,  HSU OSCAR KAI CHI ,  CHUNG ALEX SIU KEUNG ,  CHEN SHYNG-TSONG ,  RODBELL KENNETH P

    IPC: B24B37/26 ,  B24D13/14 ,  H01L21/304 ,  B24B1/00

    Abstract: Grooves (70, 76, 78, & 80-82) are formed in a CMP pad (12) by positionin g the pad (12) on a supporting surface (10) with a working surface (22) of the pad (12) in spaced relation opposite to a router bit (24) and at least one projecting stop member (33) adjacent to the router bit (24), an outer end portion of the bit (24) projecting beyond the stop (33). When the bit (24) i s rotated, relative axial movement between the bit (24) and the pad (12) cause s the outer end portion of the bit (24) to cut an initial recess in the pad (12). Relative lateral movement between the rotating bit (24) and the pad (1 2) then forms a groove (70) which extends laterally away from the recess and ha s a depth substantially the same as that of the recess. The depths of the initial recess and the groove (70) are limited by applying a vacuum to the working surface (22) of the pad (12) to keep it in contact with the stop member(s) (33). Different lateral movements between the bit (24) and the pad (12) are used to form a variety of groove patterns (76, 78, & 80-82), th e depths of which are precisely controlled by the stop member(s) (33).

    6.
    发明专利
    未知

    公开(公告)号：AT307006T

    公开(公告)日：2005-11-15

    申请号：AT01952272

    申请日：2001-06-27

    Applicant: IBM

    Inventor： CHEN SHYNG-TSONG ,  CHUNG ALEX SIU KEUNG ,  DAVIS KENNETH M ,  HSU OSCAR KAI CHI ,  RODBELL KENNETH P

    IPC: B24B37/26 ,  B24D13/14 ,  H01L21/304 ,  B24B1/00 ,  B24B37/04 ,  B24D18/00 ,  B23C3/28 ,  B26D7/01

    Abstract: Grooves are formed in a COD pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove are limited by applying a vacuum to the working surface of the pad to keep it in contact with the stop member(s). Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s).

    Polishing pad grooving method and apparatus
    8.
    发明专利
    Polishing pad grooving method and apparatus 未知

    公开(公告)号：AU7304501A

    公开(公告)日：2002-01-14

    申请号：AU7304501

    申请日：2001-06-27

    Applicant: IBM ,  FREUDENBERG NON WOVENS

    Inventor： CHEN SHYNG-TSONG ,  CHUNG ALEX SIU KEUNG ,  DAVIS KENNETH M ,  HSU OSCAR KAI CHI ,  RODBELL KENNETH P

    IPC: B24B37/26 ,  B24D13/14 ,  H01L21/304 ,  B24B1/00

    Abstract: Grooves are formed in a COD pad by positioning the pad on a supporting surface with a working surface of the pad in spaced relation opposite to a router bit and at least one projecting stop member adjacent to the router bit, an outer end portion of the bit projecting beyond the stop. When the bit is rotated, relative axial movement between the bit and the pad causes the outer end portion of the bit to cut an initial recess in the pad. Relative lateral movement between the rotating bit and the pad then forms a groove which extends laterally away from the recess and has a depth substantially the same as that of the recess. The depths of the initial recess and the groove are limited by applying a vacuum to the working surface of the pad to keep it in contact with the stop member(s). Different lateral movements between the bit and the pad are used to form a variety of groove patterns, the depths of which are precisely controlled by the stop member(s).

Patent Agency Ranking