公开(公告)号：MY108408A

公开(公告)日：1996-09-30

申请号：MYPI19920456

申请日：1992-03-19

Applicant: IBM

Inventor： THOMAS LEDDY MCDEVITT ,  PEI-ING PAUL LEE ,  THOMAS JOHN LICATA ,  PAUL CHRISTIAN PARRIES ,  SCOTT LEWIS PENNINGTON ,  JAMES GARDNER RYAN ,  DAVID CRAIG STRIPPE

IPC: C23C14/46 ,  C23C14/04 ,  H01L21/441 ,  H01L21/203 ,  H01L21/28 ,  H01L21/285 ,  H01L21/768 ,  H05K3/40

Abstract: A SPUTTERING DEPOSITION WHEREIN HIGH ASPECT RATIO APERTURES ARE COATED WITH CONDUCTIVE FILMS EXHIBITING LOW BULK RESISTIVITY, LOW IMPURITY CONCENTRATIONS, AND REGULAR MORPHOLOGIES. A COLLIMATOR IS USED HAVING AN ASPECT RATIO THAT APPROXIMATES THE ASPECT RATIO OF THE APERTURES. THE RESULTING FILM THICKNESS AT THE BOTTOM OF THE APERTURE IS AT LEAST 2X WHAT CAN BE ACHIEVED USING CONVENTIONAL SPUTTERING METHODS. (FIG. 1)

公开(公告)号：SG102613A1

公开(公告)日：2004-03-26

申请号：SG200100695

申请日：2001-02-08

Applicant: IBM

Inventor： JUDITH M RUBINO ,  CHRISTOPHER JAHNES ,  ERIC G LINIGER ,  JAMES GARDNER RYAN ,  CARLOS J SAMBUCETTI ,  FRANK CARDONE ,  SAMPATH PURUSHOTHAMAN ,  JOHN ANTHONY FITZSIMMONS ,  STEPHEN MCCONNELL GATES

IPC: C22F1/10 ,  C22C19/00 ,  C22F1/00 ,  H01L21/28 ,  H01L21/31 ,  H01L21/314 ,  H01L21/316 ,  H01L21/3205 ,  H01L21/324 ,  H01L21/76 ,  H01L21/768 ,  H01L23/52 ,  H01L23/522 ,  H01L23/532