中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

11 records (took 0.016 seconds)

    METAL SUBSTRATE HAVING AN IC CHIP AND CARRIER MOUNTING
    2.
    发明专利
    METAL SUBSTRATE HAVING AN IC CHIP AND CARRIER MOUNTING 未知

    公开(公告)号：MY127468A

    公开(公告)日：2006-12-29

    申请号：MYPI9706030

    申请日：1997-12-12

    Applicant: IBM

    Inventor： MACQUARRIE STEPHEN WESLEY ,  STORR WAYNE RUSSELL ,  WILSON JAMES WARREN

    IPC: H01L21/60 ,  H01L23/34 ,  H01L21/58 ,  H01L21/70 ,  H01L23/00 ,  H01L23/053 ,  H01L23/12 ,  H01L23/14 ,  H01L23/28 ,  H01L23/32 ,  H01L23/36 ,  H01L23/495 ,  H01L27/00 ,  H01L27/12 ,  H05K3/34

    Abstract: A PACKAGE FOR MOUNTING AN INTEGRATED CIRCUIT CHIP (30, 52) TO A CIRCUIT BOARD (48) OR THE LIKE IS PROVIDED. THE PACKAGE INCLUDES A CHIP CARRIER (10) WHICH HAS A METAL SUBSTRATE (12) INCLUDING FIRST AND SECOND OPPOSED FACES. A DIELECTRIC COATING (20) IS PROVIDED ON AT LEAST ONE OF THE FACES, WHICH PREFERABLY IS LESS THAN ABOUT 20 MICRONS IN THICKNESS, AND PREFERABLY HAS A DIELECTRIC CONSTANT FROM ABOUT 35 TO ABOUT 4.0. ELECTRICAL CIRCUITRY IS DISPOSED ON THE DIELECTRIC COATING, SAID CIRCUITRY INCLUDING CHIP MOUNTING PADS (22), CONNECTION PADS (24) AND CIRCUIT TRACES (26) CONNECTING THE CHIP MOUNTING PADS TO THE CONNECTION PADS. AN IC CHIP IS MOUNTED BY FLIP CHIP OR WIRE BONDING OR ADHESIVE CONNECTION ON THE FACE OF THE METAL SUBSTRATE WHICH HAS THE DIELECTRIC COATING THEREON. IN ANY CASE, THE IC CHIP IS ELECTRICALLY CONNECTED TO THE CHIP MOUNTING PADS EITHER BY THE SOLDER BALL (54) OR WIRE BOND (36) CONNECTIONS. ELECTRICAL LEADS (38, 60) EXTEND FROM THE CONNECTION PADS ON THE CHIP CARRIER AND ARE CONNECTED TO CORRESPONDING PADS ON A CIRCUIT BOARD OR THE LIKE TO PROVIDE I/O SIGNALS FOR THE IC CHIP. IN CERTAIN EMBODIMENTS, ADDITIONAL HEAT SINKS (62) CAN BE ATTACHED TO THE CHIP CARRIER AND, ALSO IN CERTAIN EMBODIMENTS, CHIPS CAN BE MOUNTED ON BOTH SIDES OF THE CHIP CARRIER TO INCREASE THE CAPACITY OF THE CHIP CARRIER. (FIG. 1)

    METALLIC SUBSTRATE HAVING IC CHIP AND SUPPORTING STRUCTURE
    4.
    发明专利
    METALLIC SUBSTRATE HAVING IC CHIP AND SUPPORTING STRUCTURE 未知

    公开(公告)号：CZ3498A3

    公开(公告)日：1998-11-11

    申请号：CZ3498

    申请日：1998-01-07

    Applicant: IBM

    Inventor： MACQUARRIE STEPHEN WESLEY ,  STORR WAYNE ROUSSELL ,  WILSON JAMES WARREN

    IPC: H01L21/60 ,  H01L21/58 ,  H01L21/70 ,  H01L23/00 ,  H01L23/053 ,  H01L23/12 ,  H01L23/14 ,  H01L23/28 ,  H01L23/32 ,  H01L23/36 ,  H01L23/495 ,  H01L27/00 ,  H01L27/12

    Abstract: A PACKAGE FOR MOUNTING AN INTEGRATED CIRCUIT CHIP (30, 52) TO A CIRCUIT BOARD (48) OR THE LIKE IS PROVIDED. THE PACKAGE INCLUDES A CHIP CARRIER (10) WHICH HAS A METAL SUBSTRATE (12) INCLUDING FIRST AND SECOND OPPOSED FACES. A DIELECTRIC COATING (20) IS PROVIDED ON AT LEAST ONE OF THE FACES, WHICH PREFERABLY IS LESS THAN ABOUT 20 MICRONS IN THICKNESS, AND PREFERABLY HAS A DIELECTRIC CONSTANT FROM ABOUT 35 TO ABOUT 4.0. ELECTRICAL CIRCUITRY IS DISPOSED ON THE DIELECTRIC COATING, SAID CIRCUITRY INCLUDING CHIP MOUNTING PADS (22), CONNECTION PADS (24) AND CIRCUIT TRACES (26) CONNECTING THE CHIP MOUNTING PADS TO THE CONNECTION PADS. AN IC CHIP IS MOUNTED BY FLIP CHIP OR WIRE BONDING OR ADHESIVE CONNECTION ON THE FACE OF THE METAL SUBSTRATE WHICH HAS THE DIELECTRIC COATING THEREON. IN ANY CASE, THE IC CHIP IS ELECTRICALLY CONNECTED TO THE CHIP MOUNTING PADS EITHER BY THE SOLDER BALL (54) OR WIRE BOND (36) CONNECTIONS. ELECTRICAL LEADS (38, 60) EXTEND FROM THE CONNECTION PADS ON THE CHIP CARRIER AND ARE CONNECTED TO CORRESPONDING PADS ON A CIRCUIT BOARD OR THE LIKE TO PROVIDE I/O SIGNALS FOR THE IC CHIP. IN CERTAIN EMBODIMENTS, ADDITIONAL HEAT SINKS (62) CAN BE ATTACHED TO THE CHIP CARRIER AND, ALSO IN CERTAIN EMBODIMENTS, CHIPS CAN BE MOUNTED ON BOTH SIDES OF THE CHIP CARRIER TO INCREASE THE CAPACITY OF THE CHIP CARRIER. (FIG. 1)

    Metal substrate having an ic chip and carrier mounting
    5.
    发明专利
    Metal substrate having an ic chip and carrier mounting 未知

    公开(公告)号：SG60170A1

    公开(公告)日：1999-02-22

    申请号：SG1997004458

    申请日：1997-12-15

    Applicant: IBM

    Inventor： MACQUARRIE STEPHEN WESLEY ,  STORR WAYNE RUSSELL ,  WILSON WARREN

    IPC: H01L21/60 ,  H01L21/58 ,  H01L21/70 ,  H01L23/00 ,  H01L23/053 ,  H01L23/12 ,  H01L23/14 ,  H01L23/28 ,  H01L23/32 ,  H01L23/36 ,  H01L23/495 ,  H01L27/00 ,  H01L27/12

    Abstract: A PACKAGE FOR MOUNTING AN INTEGRATED CIRCUIT CHIP (30, 52) TO A CIRCUIT BOARD (48) OR THE LIKE IS PROVIDED. THE PACKAGE INCLUDES A CHIP CARRIER (10) WHICH HAS A METAL SUBSTRATE (12) INCLUDING FIRST AND SECOND OPPOSED FACES. A DIELECTRIC COATING (20) IS PROVIDED ON AT LEAST ONE OF THE FACES, WHICH PREFERABLY IS LESS THAN ABOUT 20 MICRONS IN THICKNESS, AND PREFERABLY HAS A DIELECTRIC CONSTANT FROM ABOUT 35 TO ABOUT 4.0. ELECTRICAL CIRCUITRY IS DISPOSED ON THE DIELECTRIC COATING, SAID CIRCUITRY INCLUDING CHIP MOUNTING PADS (22), CONNECTION PADS (24) AND CIRCUIT TRACES (26) CONNECTING THE CHIP MOUNTING PADS TO THE CONNECTION PADS. AN IC CHIP IS MOUNTED BY FLIP CHIP OR WIRE BONDING OR ADHESIVE CONNECTION ON THE FACE OF THE METAL SUBSTRATE WHICH HAS THE DIELECTRIC COATING THEREON. IN ANY CASE, THE IC CHIP IS ELECTRICALLY CONNECTED TO THE CHIP MOUNTING PADS EITHER BY THE SOLDER BALL (54) OR WIRE BOND (36) CONNECTIONS. ELECTRICAL LEADS (38, 60) EXTEND FROM THE CONNECTION PADS ON THE CHIP CARRIER AND ARE CONNECTED TO CORRESPONDING PADS ON A CIRCUIT BOARD OR THE LIKE TO PROVIDE I/O SIGNALS FOR THE IC CHIP. IN CERTAIN EMBODIMENTS, ADDITIONAL HEAT SINKS (62) CAN BE ATTACHED TO THE CHIP CARRIER AND, ALSO IN CERTAIN EMBODIMENTS, CHIPS CAN BE MOUNTED ON BOTH SIDES OF THE CHIP CARRIER TO INCREASE THE CAPACITY OF THE CHIP CARRIER. (FIG. 1)

    CASE AND METHOD FOR MOUTING AN IC CHIP ONTO A CARRIER BOARD OR SIMILAR
    6.
    发明专利
    CASE AND METHOD FOR MOUTING AN IC CHIP ONTO A CARRIER BOARD OR SIMILAR 未知

    公开(公告)号：HU9701377A2

    公开(公告)日：1998-08-28

    申请号：HU9701377

    申请日：1997-08-11

    Applicant: IBM

    Inventor： MACQUARRIE STEPHEN WESLEY ,  STORR WAYNE RUSSEL ,  WILSON JAMES WARREN

    IPC: H01L21/60 ,  H01L21/58 ,  H01L21/70 ,  H01L23/00 ,  H01L23/053 ,  H01L23/12 ,  H01L23/14 ,  H01L23/28 ,  H01L23/32 ,  H01L23/36 ,  H01L23/495 ,  H01L27/00 ,  H01L27/12

    Abstract: A PACKAGE FOR MOUNTING AN INTEGRATED CIRCUIT CHIP (30, 52) TO A CIRCUIT BOARD (48) OR THE LIKE IS PROVIDED. THE PACKAGE INCLUDES A CHIP CARRIER (10) WHICH HAS A METAL SUBSTRATE (12) INCLUDING FIRST AND SECOND OPPOSED FACES. A DIELECTRIC COATING (20) IS PROVIDED ON AT LEAST ONE OF THE FACES, WHICH PREFERABLY IS LESS THAN ABOUT 20 MICRONS IN THICKNESS, AND PREFERABLY HAS A DIELECTRIC CONSTANT FROM ABOUT 35 TO ABOUT 4.0. ELECTRICAL CIRCUITRY IS DISPOSED ON THE DIELECTRIC COATING, SAID CIRCUITRY INCLUDING CHIP MOUNTING PADS (22), CONNECTION PADS (24) AND CIRCUIT TRACES (26) CONNECTING THE CHIP MOUNTING PADS TO THE CONNECTION PADS. AN IC CHIP IS MOUNTED BY FLIP CHIP OR WIRE BONDING OR ADHESIVE CONNECTION ON THE FACE OF THE METAL SUBSTRATE WHICH HAS THE DIELECTRIC COATING THEREON. IN ANY CASE, THE IC CHIP IS ELECTRICALLY CONNECTED TO THE CHIP MOUNTING PADS EITHER BY THE SOLDER BALL (54) OR WIRE BOND (36) CONNECTIONS. ELECTRICAL LEADS (38, 60) EXTEND FROM THE CONNECTION PADS ON THE CHIP CARRIER AND ARE CONNECTED TO CORRESPONDING PADS ON A CIRCUIT BOARD OR THE LIKE TO PROVIDE I/O SIGNALS FOR THE IC CHIP. IN CERTAIN EMBODIMENTS, ADDITIONAL HEAT SINKS (62) CAN BE ATTACHED TO THE CHIP CARRIER AND, ALSO IN CERTAIN EMBODIMENTS, CHIPS CAN BE MOUNTED ON BOTH SIDES OF THE CHIP CARRIER TO INCREASE THE CAPACITY OF THE CHIP CARRIER. (FIG. 1)

    INTEGRAL DESIGN FEATURES FOR HEATSINK ATTACH FOR ELECTRONIC PACKAGES
    7.
    发明专利
    INTEGRAL DESIGN FEATURES FOR HEATSINK ATTACH FOR ELECTRONIC PACKAGES 未知

    公开(公告)号：MY117421A

    公开(公告)日：2004-06-30

    申请号：MYPI9804474

    申请日：1998-09-30

    Applicant: IBM

    Inventor： JOHNSON ERIC ARTHUR ,  KOSTEVA STEPHEN JOHN ,  MACQUARRIE STEPHEN WESLEY

    IPC: H05K7/20 ,  H01L23/40

    Abstract: AN APPARATUS AND METHOD ATTACHING A HEATSINK (214) TO A SURFACE OF AN ELECTRONIC PACKAGE (200, 300, 300, 500, 600) COMPRISING A SUBSTRATE (202), AN INTEGRATED CIRCUIT CHIP (204) ATTACHED TO THE SURFACE OF THE SUBSTRATE, AN ENCAPSULANT (206, 226, 306, 326, 406, 506, 606) ENCAPSULATING THE INTEGRATED CIRCUIT CHIP AND CONTACTING AT LEAST A PORTION OF THE SURFACE OF THE SUBSTRATE, AND AN ORIFICE (208, 308) FORMED IN THE TOP PORTION OF THE ENCAPSULANT TO ATTACH THE HEATSINK TO THE SURFACE OF THE ELECTRONIC PACKAGE. THE HEATSINK MAY BE ATTACHED AND REMOVED AS DESIRED TO ALLOW FOR PACKAGE IDENTIFICATION OR REWORK.

    METHOD OF MOUNTING AND INTEGRATED CIRCUIT ON ITS ASSOCIATED CIRCUIT BOARD AND MOUNTING UNIT THEREFOR
    10.
    发明专利
    METHOD OF MOUNTING AND INTEGRATED CIRCUIT ON ITS ASSOCIATED CIRCUIT BOARD AND MOUNTING UNIT THEREFOR 未知

    公开(公告)号：PL324177A1

    公开(公告)日：1998-07-20

    申请号：PL32417798

    申请日：1998-01-08

    Applicant: IBM

    Inventor： MACQUARRIE STEPHEN WESLEY ,  STORR WAYNE RUSSELL ,  WILSON JAMES WARREN

    IPC: H01L21/60 ,  H01L21/58 ,  H01L21/70 ,  H01L23/00 ,  H01L23/053 ,  H01L23/12 ,  H01L23/14 ,  H01L23/28 ,  H01L23/32 ,  H01L23/36 ,  H01L23/495 ,  H01L27/00 ,  H01L27/12

    Abstract: A PACKAGE FOR MOUNTING AN INTEGRATED CIRCUIT CHIP (30, 52) TO A CIRCUIT BOARD (48) OR THE LIKE IS PROVIDED. THE PACKAGE INCLUDES A CHIP CARRIER (10) WHICH HAS A METAL SUBSTRATE (12) INCLUDING FIRST AND SECOND OPPOSED FACES. A DIELECTRIC COATING (20) IS PROVIDED ON AT LEAST ONE OF THE FACES, WHICH PREFERABLY IS LESS THAN ABOUT 20 MICRONS IN THICKNESS, AND PREFERABLY HAS A DIELECTRIC CONSTANT FROM ABOUT 35 TO ABOUT 4.0. ELECTRICAL CIRCUITRY IS DISPOSED ON THE DIELECTRIC COATING, SAID CIRCUITRY INCLUDING CHIP MOUNTING PADS (22), CONNECTION PADS (24) AND CIRCUIT TRACES (26) CONNECTING THE CHIP MOUNTING PADS TO THE CONNECTION PADS. AN IC CHIP IS MOUNTED BY FLIP CHIP OR WIRE BONDING OR ADHESIVE CONNECTION ON THE FACE OF THE METAL SUBSTRATE WHICH HAS THE DIELECTRIC COATING THEREON. IN ANY CASE, THE IC CHIP IS ELECTRICALLY CONNECTED TO THE CHIP MOUNTING PADS EITHER BY THE SOLDER BALL (54) OR WIRE BOND (36) CONNECTIONS. ELECTRICAL LEADS (38, 60) EXTEND FROM THE CONNECTION PADS ON THE CHIP CARRIER AND ARE CONNECTED TO CORRESPONDING PADS ON A CIRCUIT BOARD OR THE LIKE TO PROVIDE I/O SIGNALS FOR THE IC CHIP. IN CERTAIN EMBODIMENTS, ADDITIONAL HEAT SINKS (62) CAN BE ATTACHED TO THE CHIP CARRIER AND, ALSO IN CERTAIN EMBODIMENTS, CHIPS CAN BE MOUNTED ON BOTH SIDES OF THE CHIP CARRIER TO INCREASE THE CAPACITY OF THE CHIP CARRIER. (FIG. 1)

Patent Agency Ranking