公开(公告)号：GB2609127B

公开(公告)日：2025-04-30

申请号：GB202214682

申请日：2021-02-01

Applicant: IBM

Inventor： BING DANG ,  LEANNA PANCOAST ,  JAE-WOONG NAH ,  JOHN KNICKERBOCKER

IPC: H01M10/0525 ,  H01M10/04 ,  H01M10/052 ,  H01M10/0562 ,  H01M10/0585

Abstract: Microbatteries and methods for forming microbatteries are provided. The microbatteries and methods address at least one or both of edge sealing issues for edges of a stack forming part of a microbatteries and overall sealing for individual cells for microbatteries in a batch process. A transferable solder molding apparatus and sealing structure are proposed in an example to provide a metal casing for a solid-state thin-film microbattery. An exemplary proposed process involves deposition or pre-forming low-temperature solder casing separately from the microbatteries. Then a thermal compression may be used to transfer the solder casing to each battery cell, with a handler apparatus in a batch process in an example. These exemplary embodiments can address the temperature tolerance constrain for solid state thin film battery during handling, metal sealing, and packaging.

公开(公告)号：GB2603839A

公开(公告)日：2022-08-17

申请号：GB202117435

申请日：2021-12-02

Applicant: IBM

Inventor： QIANWEN CHEN ,  JAE-WOONG NAH ,  BING DANG ,  LEANNA PANCOAST ,  JOHN KNICKERBOCKER

IPC: H01M10/04 ,  H01M6/40 ,  H01M10/0585 ,  H01M50/119

Abstract: A microbattery includes a first micro-battery device including a substrate 102 having a metal anode via 104 and a metal cathode via 104. A battery element 112 formed on the substrate includes a cathode current collector 114 electrically connected to a cathode through the metal cathode via and an anode current collector 106 electrically connected to an anode 110 through the metal anode via. A metal sealing layer 124 is formed on at least sidewall surfaces of the battery element and is electrically connected to the cathode. A method of forming a microbattery device involves forming a metal anode via and a metal cathode via in a substrate, forming a metal layer 108 on a bottom side of the substrate, forming a battery element on a top side of the substrate, forming an encapsulation layer 116 around the battery element, forming trenches (150, Figure 1F) through the encapsulation layer and the substrate on different sides of the battery element, and forming a metal sealing layer in the trenches to cover at least sidewall surfaces of the battery element. The metal sealing layer is electrically connected to the battery element through the metal layer and the metal cathode via.