公开(公告)号：GB2562941B

公开(公告)日：2020-12-16

申请号：GB201812268

申请日：2016-12-02

Applicant: IBM

Inventor： JEFFREY GELORME ,  LI-WEN HUNG ,  PAUL ANDRY ,  BING DANG ,  CORNELIA TSANG YANG ,  JOHN KNICKERBOCKER

IPC: H01L21/673

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

公开(公告)号：GB2600857A

公开(公告)日：2022-05-11

申请号：GB202201625

申请日：2020-06-23

Applicant: IBM

Inventor： BING DANG ,  RAJEEV NARYANAN

IPC: G06K19/07

Abstract: A device for detecting a tampering of a product in a product packaging material. The device comprises a network of sensors integrated into the product packaging material; a microcontroller, the microcontroller configured to detect, by accessing the sensors of the sensor network, the tampering of the product packaging material; and a communication device for relaying information regarding a status of the product packaging material.

公开(公告)号：GB2609127B

公开(公告)日：2025-04-30

申请号：GB202214682

申请日：2021-02-01

Applicant: IBM

Inventor： BING DANG ,  LEANNA PANCOAST ,  JAE-WOONG NAH ,  JOHN KNICKERBOCKER

IPC: H01M10/0525 ,  H01M10/04 ,  H01M10/052 ,  H01M10/0562 ,  H01M10/0585

Abstract: Microbatteries and methods for forming microbatteries are provided. The microbatteries and methods address at least one or both of edge sealing issues for edges of a stack forming part of a microbatteries and overall sealing for individual cells for microbatteries in a batch process. A transferable solder molding apparatus and sealing structure are proposed in an example to provide a metal casing for a solid-state thin-film microbattery. An exemplary proposed process involves deposition or pre-forming low-temperature solder casing separately from the microbatteries. Then a thermal compression may be used to transfer the solder casing to each battery cell, with a handler apparatus in a batch process in an example. These exemplary embodiments can address the temperature tolerance constrain for solid state thin film battery during handling, metal sealing, and packaging.

公开(公告)号：GB2551298A

公开(公告)日：2017-12-13

申请号：GB201714391

申请日：2016-02-15

Applicant: IBM

Inventor： BING DANG ,  DUIXIAN LIU ,  JEAN-OLIVER PLOUCHART ,  ALBERTO VALDES-GARCIA

IPC: H01L23/66 ,  H01L25/065 ,  H01P3/12 ,  H05K1/02

Abstract: A package structure includes a package substrate (130) having an integrated waveguide, and first and second integrated circuit chips (110,120) mounted to the package substrate (130). The first integrated circuit chip (110) is coupled to the integrated waveguide (132) using a first transmission line (116) to waveguide transition, and the second integrated circuit chip (120) is coupled to the integrated waveguide (132) using a second transmission line (126) to waveguide transition. The first and second integrated circuit chips (110,120) are configured to communicate by transmitting signals using the integrated waveguide (132) within the package carrier. The package structure enables high data rate communication between package components.

公开(公告)号：GB2562941A

公开(公告)日：2018-11-28

申请号：GB201812268

申请日：2016-12-02

Applicant: IBM

Inventor： JOHN KNICKERBOCKER ,  JEFFREY GELORME ,  LI-WEN HUNG ,  PAUL ANDRY ,  BING DANG ,  CORNELIA TSANG YANG

IPC: H01L21/673

Abstract: Various embodiments process semiconductor devices (202, 302). In one embodiment, a release layer (210) is applied to a handler (204). The release layer (210) comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer (210). The additive comprises, for example, a 355nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600nm to 740nm. The at least one singulated semiconductor device (202) is bonded to the handler (204). The at least one singulated semiconductor device (202) is packaged while it is bonded to the handler (204). The release layer (210) is ablated by irradiating the release layer (210) through the handler (204) with a laser (214). The the at least one singulated semiconductor device (202) is removed from the transparent handler (204) after the release layer (210) has been ablated.

公开(公告)号：GB2547297A

公开(公告)日：2017-08-16

申请号：GB201616755

申请日：2016-10-03

Applicant: IBM

Inventor： ERIC PETER LEWANDOWSKI ,  GREGORY MICHAEL FRITZ ,  STEVEN LORENZ WRIGHT ,  JOANA SOFIA BRANQUINHO TERESA MARIA ,  BING DANG ,  BUCKNELL WEBB

IPC: A61K9/00 ,  A61M5/142

Abstract: A digital biomedical device includes a substrate forming a cavity, a seal formed around the cavity, a lid coupled to the substrate by the seal, a reactive metal structure comprising a plurality of metal layers, wherein the reactive metal structure is a component of at least one of the substrate and the lid, a metal trace configured to initiate a self-propagating reaction between the plurality of metal layers of the reactive metal structure and release contents of the cavity, and a power supply configured to apply an electric current to the metal trace. The device is used to deliver substances to the body in a controlled manner. Also disclosed is a method of activating said device to release its contents.

公开(公告)号：GB2603839A

公开(公告)日：2022-08-17

申请号：GB202117435

申请日：2021-12-02

Applicant: IBM

Inventor： QIANWEN CHEN ,  JAE-WOONG NAH ,  BING DANG ,  LEANNA PANCOAST ,  JOHN KNICKERBOCKER

IPC: H01M10/04 ,  H01M6/40 ,  H01M10/0585 ,  H01M50/119

Abstract: A microbattery includes a first micro-battery device including a substrate 102 having a metal anode via 104 and a metal cathode via 104. A battery element 112 formed on the substrate includes a cathode current collector 114 electrically connected to a cathode through the metal cathode via and an anode current collector 106 electrically connected to an anode 110 through the metal anode via. A metal sealing layer 124 is formed on at least sidewall surfaces of the battery element and is electrically connected to the cathode. A method of forming a microbattery device involves forming a metal anode via and a metal cathode via in a substrate, forming a metal layer 108 on a bottom side of the substrate, forming a battery element on a top side of the substrate, forming an encapsulation layer 116 around the battery element, forming trenches (150, Figure 1F) through the encapsulation layer and the substrate on different sides of the battery element, and forming a metal sealing layer in the trenches to cover at least sidewall surfaces of the battery element. The metal sealing layer is electrically connected to the battery element through the metal layer and the metal cathode via.

公开(公告)号：GB2547297B

公开(公告)日：2018-08-01

申请号：GB201616755

申请日：2016-10-03

Applicant: IBM

Inventor： ERIC PETER LEWANDOWSKI ,  GREGORY MICHAEL FRITZ ,  STEVEN LORENZ WRIGHT ,  JOANA SOFIA BRANQUINHO TERESA MARIA ,  BING DANG ,  BUCKNELL WEBB

IPC: A61K9/00 ,  A61M5/142

Abstract: A digital biomedical device includes a substrate forming a cavity, a seal formed around the cavity, a lid coupled to the substrate by the seal, a reactive metal structure comprising a plurality of metal layers, wherein the reactive metal structure is a component of at least one of the substrate and the lid, a metal trace configured to initiate a self-propagating reaction between the plurality of metal layers of the reactive metal structure and release contents of the cavity, and a power supply configured to apply an electric current to the metal trace.

公开(公告)号：GB2551298B

公开(公告)日：2018-04-25

申请号：GB201714391

申请日：2016-02-15

Applicant: IBM

Inventor： BING DANG ,  DUIXIAN LIU ,  JEAN-OLIVIER PLOUCHART ,  ALBERTO VALDES-GARCIA

IPC: H01L23/66 ,  H01L25/065 ,  H01P3/12 ,  H05K1/02

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.