-
公开(公告)号:JPH08231863A
公开(公告)日:1996-09-10
申请号:JP145196
申请日:1996-01-09
Applicant: IBM
Inventor: MARII ANGEROPUUROSU , BURUUSU KEI FUAAMAN
-
公开(公告)号:JPH08231862A
公开(公告)日:1996-09-10
申请号:JP137196
申请日:1996-01-09
Applicant: IBM
Inventor: MARII ANGEROPUUROSU , BURUUSU KEI FUAAMAN
-
公开(公告)号:JPH06125519A
公开(公告)日:1994-05-06
申请号:JP8450393
申请日:1993-04-12
Applicant: IBM
Inventor: ARII AFUZAARI ARUDAKAANI , MARII ANGEROPUUROSU , JIYATSUKU ARUBUIN DEITSUKAASON , TOOMASU BEAADO PIRUSUBERII , KAARU JIYOOZEFU PATORITSUTSU , JIEEN MAAGARETSUTO SHIYOO , JIEFURII DONARUDO JIEROOMU
IPC: C08K3/22 , B05D5/02 , B05D5/12 , C08G61/12 , C08L101/00 , C09D5/24 , H01B1/12 , H01J29/86 , H01L23/29 , H01L23/498 , H01L23/60 , H04N5/65 , H05K9/00
Abstract: PURPOSE: To provide an abrasion-resistant and scratch-resistant conductive polymer composition which can be used as an electrostatic discharge layer having an abrasion resistance and light transmittance and, at the same time, can prevent the deposition of dusts and scratches due to static electricity. CONSTITUTION: An abrasion-resistant and scratch-resistant conductive polymer composition is manufactured by mixing an abrasion-resistant material with a conductive polymer material. The abrasion-resistant polymer material is composed of silicone, polysiloxane, acrylate, epoxy, methacrylate, epoxy acrylate, epoxy methacrylate, and styrene and a conductive polymer material is selected out of a group composed of substituted and nonsubstituted polyaniline, polyparaphenylene vinylene, substituted and nonsubstituted polythiophene, substituted and nonsubstituted poly-p-phenylene sulfide, substituted and nonsubstituted polyfuran, substituted and nonsubstituted polypyrrole, substituted and nonsubstituted polyselenophene, polyacetylene prepared from a soluble precursor, and their combinations. It is also possible to constitute the composition in such a laminated structure that an abrasion-resistance layer is provided on a layer of the conductive polymer.
-
公开(公告)号:JPH0683049A
公开(公告)日:1994-03-25
申请号:JP2114693
申请日:1993-02-09
Applicant: IBM
Inventor: MARII ANGEROPUUROSU , DANIERU JII BAAGAA , JIEFURII DABURIYUU RABADEI , ERITSUKU DEII PAAFUEKUTO , MAASA AI SANCHIESU , SARII EI SUWANSON , UIRII FUORUKUSEN
IPC: G03F7/027 , C08F283/04 , C08G73/10 , G03F7/028 , G03F7/038 , G03F7/38 , G03F7/40 , H01L21/027
Abstract: PURPOSE: To provide an improved method for forming a negative image of a photosensitive polyimide having an improved wall surface angle on a substrate. CONSTITUTION: This forming method of the negative image of the polyimide includes (a) a process for coating the substrate with a coating film containing a polyamine acid ester and a photoinitiator, (b) a process for exposing the coating film corresponding to an image with radiation to make a polyamine acid ester insoluble corresponding to the image, (c) a process for developing the image, (d) a process for allowing the coating film to contact with a base and (e) a process for making the polyamine acid ester to an imide by heating the coating film.
-
-
-