公开(公告)号：JP2002229857A

公开(公告)日：2002-08-16

申请号：JP2001369492

申请日：2001-12-04

Applicant: IBM

Inventor： FARQUHAR DONALD S ,  FEGER CLAUDIUS ,  MARKOVICH VOYA ,  PAPATHOMAS KONSTANTINOS I ,  MARK D PORIKUSU ,  SHAW JANE M ,  SZEPAROWYCZ GEORGE ,  WEINGART STEVE H

IPC: G06F12/14 ,  G06F1/00 ,  G06F21/00 ,  G06F21/06 ,  G06F21/22 ,  H01L23/58 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16

Abstract: PROBLEM TO BE SOLVED: To provide a structure and a method of forming a fraudulent intrusion sensing electronic circuit enclosure including an integrated circuit structure, a mesh structure surrounding the integrated circuit, and a sealing enclosure surrounding the mesh structure. SOLUTION: The mesh structure includes a flexible dielectric layer having a first side and a second side, a screen print pattern of a first flexible conductive circuit line forming a first resistor network on the first side, and a photolithography forming pattern of a second flexible conductive circuit line forming a second resistor network on the second side.

公开(公告)号：JP2001085572A

公开(公告)日：2001-03-30

申请号：JP2000192204

申请日：2000-06-27

Applicant: IBM

Inventor： DONALD S FAAKUHAA ,  CONSTANTINOS I PAPATHOMAS ,  MARK D PORIKUSU

IPC: B32B15/082 ,  C08K3/00 ,  C08L27/12 ,  C08L101/00 ,  H01L23/14 ,  H05K1/02 ,  H05K1/03 ,  H05K3/38 ,  B32B15/08

Abstract: PROBLEM TO BE SOLVED: To provide a low-permittivity dielectric layer which is has satisfactory adhesive property to a conductive layer and is easy to processing. SOLUTION: A printed circuit board has dielectric layers 16, 19, and 23 and dielectric layers 9, 10A, and 12. The dielectric layer 9 is polytetrafluoroethylene in unfillburyl conditions where inorganic particles are dispersed, and it is bonded with thermosetting resin between the conductive layers 19 and 16. A dielectric layer 10A has a structure with the dielectric layer 9 impregnated with thermosetting resin. The thermosetting resin 22 is bonded between the structure 10A and the conductive layer 23 to enhance adhesive property. Since thermosetting resin is formed between the polytetrafluoorethylene, where inorganic particles are dispersed, and the conductive layer, the adhesive property is improved, and stacking at low temperature and low pressure becomes possible.