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    Apparatus and method for remakeable connection to optical waveguide
    1.
    发明专利
    Apparatus and method for remakeable connection to optical waveguide 有权
    用于可重复连接到光波导的装置和方法

    公开(公告)号：JP2011008268A

    公开(公告)日：2011-01-13

    申请号：JP2010153551

    申请日：2010-07-06

    Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

    Inventor： FEGER CLAUDIUS ,  HOBBS PHILIP C D ,  MCGLASHAN-POWELL MAURICE

    IPC: G02B6/00 ,  G02B6/036 ,  G02B6/02 ,  G02B6/26 ,  G02B6/28 ,  G02B6/34 ,  G02B6/42

    CPC classification number: G02B6/2821 ,  G02B6/02 ,  G02B6/02033 ,  G02B6/03622 ,  G02B6/283 ,  G02B6/29316 ,  G02B6/421 ,  G02B6/4249

    Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a remakeable connection for a single-mode optical waveguide.SOLUTION: The single-mode optical waveguide 10 includes a core 12 surrounded by a cladding consisting of an inner soft layer 14 and an outer harder layer 16. The outer layer 18 has a grating structure on its inner surface, whose spatial frequency is the same as that of the guided mode. The thickness of the inner cladding is sufficient to keep the grating outside the mode field in undeformed regions of the waveguide, so that normally no out-coupling of the light occurs. Connections are made by crossing two such waveguides 10 at an angle and pressing them together. This results in deformation of the two waveguides such that the gratings are brought into proximity with the cores. Light is coupled out of one waveguide and into the other in the deformed region, resulting in a self-aligning optical connection. The out-coupled light propagates normal to the waveguide axis, so that errors in the crossing angle cause little change in efficiency. Because the cladding system is sufficiently resilient to recover after deformation, the connection is remakeable.

    Abstract translation: 要解决的问题：提供一种用于制造用于单模光波导的可重新连接的装置和方法。解决方案：单模光波导10包括由包含内软层14和 外部层18在其内表面上具有光栅结构，其空间频率与引导模式的空间频率相同。 内包层的厚度足以将光栅保持在波导的未变形区域中的模场外，从而通常不发生光的外耦合。 通过将两个这样的波导10以一定角度交叉并将它们压在一起而形成连接。 这导致两个波导的变形，使得光栅与芯接近。 光从一个波导耦合到变形区域中的另一个，导致自对准光学连接。 输出耦合光垂直于波导轴传播，因此交叉角的误差几乎不会导致效率的变化。 因为包层系统具有足够的弹性以在变形后恢复，所以连接是可重新制造的。

    METHOD AND SYSTEM FOR DETECTING PARALLEL MARKETING OF ITEMS
    8.
    发明专利
    METHOD AND SYSTEM FOR DETECTING PARALLEL MARKETING OF ITEMS 失效

    公开(公告)号：JP2000153842A

    公开(公告)日：2000-06-06

    申请号：JP26971999

    申请日：1999-09-24

    Applicant: IBM

    Inventor： AFZALI-ARDAKANI ALI ,  FEGER CLAUDIUS ,  MARTENS MARCO ,  MOSKOWITZ PAUL A ,  SCHROTT ALEJANDRO GABRIEL ,  TRESSER CHARLES P ,  GUTFELD ROBERT JACOB VON

    IPC: B65D23/00 ,  B44F1/12 ,  G06K19/06 ,  G09F3/00

    Abstract: PROBLEM TO BE SOLVED: To prevent illegal resale by forming at least one of coat and code on an item and determining whether the item has been resold from an authorized merchant to an unauthorized merchant by checking the coat or code. SOLUTION: This identifier is extremely difficult if not impossible to remove. The identifier has its allocation and encoded code known only to a manufacturer. When the manufacturer suspects that parallel commercial transaction is occurring, he easily identifies an unauthorized reseller and can take appropriate countermeasures to prevent unauthorized activity. The system 50 includes a processor 51, a special coat/ruled code to be attached onto an item of interest and a detector 53 for determining information contents of the special coat/ scribing code. Although the detector 53 is shown separately from the processor 51, the detector can incorporate the processor therein.

    MUTUAL CONNECTING STRUCTURE WITH ORGANIC BARRIER LAYER
    9.
    发明专利
    MUTUAL CONNECTING STRUCTURE WITH ORGANIC BARRIER LAYER 失效

    公开(公告)号：JP2000082716A

    公开(公告)日：2000-03-21

    申请号：JP19583399

    申请日：1999-07-09

    Applicant: IBM

    Inventor： FEGER CLAUDIUS ,  HUMMEL JOHN PATRICK

    IPC: H01L21/60 ,  H01L21/312 ,  H01L23/00

    Abstract: PROBLEM TO BE SOLVED: To protect wiring such as Cu wiring, a semiconductor substrate of an IC and other mutually connecting structure by forming a polymer scratch proof/stress relaxation layer on an organic dielectric mutual connecting structure for embedding a metal vias, metal wirings and metal pads, and forming a polymer barrier layer thereon. SOLUTION: An organic dielectric mutual connecting structure 52 constituted of a semiconductor material processed from Si, Ge, GaAS, InAs, InP or the like and embedding bias 54, metal wiring 56 and metal pads 58 on an upper surface of a substrate 50 containing an active element region such as a transistor or the like is formed. The structure 52 is capped with a polymer layer 60 constituted of a material operating as a scratchproof/stress relaxation layer, and a polymer barrier layer 62 containing a polymer selected from the group consisting of fluoropolymer, polychlorofluoropolymer and hydrocarbon polymer is formed on the layer 60.

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