公开(公告)号：JP2002229857A

公开(公告)日：2002-08-16

申请号：JP2001369492

申请日：2001-12-04

Applicant: IBM

Inventor： FARQUHAR DONALD S ,  FEGER CLAUDIUS ,  MARKOVICH VOYA ,  PAPATHOMAS KONSTANTINOS I ,  MARK D PORIKUSU ,  SHAW JANE M ,  SZEPAROWYCZ GEORGE ,  WEINGART STEVE H

IPC: G06F12/14 ,  G06F1/00 ,  G06F21/00 ,  G06F21/06 ,  G06F21/22 ,  H01L23/58 ,  H05K1/00 ,  H05K1/02 ,  H05K1/09 ,  H05K1/16

Abstract: PROBLEM TO BE SOLVED: To provide a structure and a method of forming a fraudulent intrusion sensing electronic circuit enclosure including an integrated circuit structure, a mesh structure surrounding the integrated circuit, and a sealing enclosure surrounding the mesh structure. SOLUTION: The mesh structure includes a flexible dielectric layer having a first side and a second side, a screen print pattern of a first flexible conductive circuit line forming a first resistor network on the first side, and a photolithography forming pattern of a second flexible conductive circuit line forming a second resistor network on the second side.

公开(公告)号：AU549136B2

公开(公告)日：1986-01-16

申请号：AU6298280

申请日：1980-10-06

Applicant: IBM

Inventor： AVIRAM ARI ,  HOFER DONALD C ,  KAURMAN FRANK B ,  KRAMER STEVEN R ,  SHAW JANE M

IPC: G03C1/00 ,  G03C5/16 ,  G03F7/26 ,  G03C1/727

公开(公告)号：DE69313954D1

公开(公告)日：1997-10-23

申请号：DE69313954

申请日：1993-07-30

Applicant: IBM

Inventor： AFZALI ARDAKANI ALI ,  GOTRO JEFFREY T ,  HEDRICK JEFFREY C ,  PAPATHOMAS KONSTANTINOS ,  PATEL NIRANJAN M ,  SHAW JANE M ,  VIEHBECK ALFRED

IPC: B32B27/06 ,  C08G65/40 ,  C08G73/06 ,  C08G75/00 ,  C08G75/20 ,  C08G79/02 ,  C08G79/04 ,  C08J5/24 ,  C08L79/04 ,  C08L101/00 ,  C08L101/02 ,  C08L101/04 ,  H05K1/03

Abstract: A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

公开(公告)号：DE69106956D1

公开(公告)日：1995-03-09

申请号：DE69106956

申请日：1991-06-11

Applicant: IBM

Inventor： CUOMO JEROME J ,  GELORME JEFFREY D ,  HATZAKIS MICHAEL ,  LEWIS DAVID A ,  SHAW JANE M ,  WHITEHAIR STANLEY J

IPC: B01J19/12 ,  C08G73/10 ,  G01N22/00 ,  H01L21/312 ,  H05B6/68 ,  H05B6/80 ,  H05K1/03 ,  H05K3/46

Abstract: A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance. The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material. In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity (2) that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction.

公开(公告)号：CA1111699A

公开(公告)日：1981-11-03

申请号：CA319302

申请日：1979-01-09

Applicant: IBM

Inventor： CANAVELLO BENJAMIN J ,  HATZAKIS MICHAEL ,  SHAW JANE M

IPC: G03C1/72 ,  G03F7/00 ,  G03F7/022 ,  G03F7/30 ,  G03F7/32 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027 ,  H01L21/30 ,  G03C5/00

Abstract: METHOD OF MODIFYING THE DEVELOPMENT PROFILE OF PHOTORESISTS The cross-sectional profile which is produced upon development of a layer of alkali soluble resin-diazo ketone photoresist is modified by treating the layer with a solvent or solvent mixture which is different from but miscible with the solvent or solvent mixture used to form the resist layer. The treating solvent is believed to dilute the resist solvent in a surface layer portion of the resist thereby modifying the alkaline developer solubility of this portion. Undercut resist profiles may be obtained by this method with normal optical exposure of the resist.

公开(公告)号：DE69313954T2

公开(公告)日：1998-03-26

申请号：DE69313954

申请日：1993-07-30

Applicant: IBM

Inventor： AFZALI ARDAKANI ALI ,  GOTRO JEFFREY T ,  HEDRICK JEFFREY C ,  PAPATHOMAS KONSTANTINOS ,  PATEL NIRANJAN M ,  SHAW JANE M ,  VIEHBECK ALFRED

IPC: B32B27/06 ,  C08G65/40 ,  C08G73/06 ,  C08G75/00 ,  C08G75/20 ,  C08G79/02 ,  C08G79/04 ,  C08J5/24 ,  C08L79/04 ,  C08L101/00 ,  C08L101/02 ,  C08L101/04 ,  H05K1/03

Abstract: A composition having enhanced fracture resistance comprising curable dicyanate ester resins having incorporated therein at least one thermoplastic polymer modifier which is soluble in the dicyanate ester resin. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase-separated multiphase thermoset material.

公开(公告)号：CA2168285A1

公开(公告)日：1996-09-04

申请号：CA2168285

申请日：1996-01-29

Applicant: IBM

Inventor： NARAYAN CHANDRASEKHAR ,  SHAW JANE M

IPC: H05K3/46 ,  H05K1/00 ,  H05K3/00 ,  H05K1/02 ,  H05K1/03

Abstract: The present invention provides a wiring module containing a plurality of laminated polymer layers containing defined electronic circuitry which can be thermoformed into desired three dimensional shapes without damaging the internal wiring at the region of thermoform stress. More particularly, the invention provides a thermoformed, three dimensional wiring module prepared by thermoforming a laminate comprising a plurality of laminated, thermoformable polymer insulating layers containing conductive wiring circuitry on at least one surface of the layers, the layers being assembled to form conductive interconnect paths within the module, the module further characterized in that the conductive wiring circuitry is present only on internal low stress layers of the laminate at the region of thermoformed bends present in the module.

公开(公告)号：DE69023958T2

公开(公告)日：1996-06-20

申请号：DE69023958

申请日：1990-05-23

Applicant: IBM

Inventor： BABICH EDWARD D ,  HATZAKIS MICHAEL ,  MCGOUEY RICHARD P ,  NUNES SHARON ,  PARASZCZAK JURIJ R ,  SHAW JANE M

IPC: B32B7/02 ,  C08L83/14 ,  H01B3/18 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L21/312

公开(公告)号：DE69023958D1

公开(公告)日：1996-01-18

申请号：DE69023958

申请日：1990-05-23

Applicant: IBM

Inventor： BABICH EDWARD D ,  HATZAKIS MICHAEL ,  MCGOUEY RICHARD P ,  NUNES SHARON ,  PARASZCZAK JURIJ R ,  SHAW JANE M

IPC: B32B7/02 ,  C08L83/14 ,  H01B3/18 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L21/312

公开(公告)号：DE69106956T2

公开(公告)日：1995-08-10

申请号：DE69106956

申请日：1991-06-11

Applicant: IBM

Inventor： CUOMO JEROME J ,  GELORME JEFFREY D ,  HATZAKIS MICHAEL ,  LEWIS DAVID A ,  SHAW JANE M ,  WHITEHAIR STANLEY J

IPC: B01J19/12 ,  C08G73/10 ,  G01N22/00 ,  H01L21/312 ,  H05B6/68 ,  H05B6/80 ,  H05K1/03 ,  H05K3/46

Abstract: A method and apparatus are disclosed for conducting a physical process and a chemical reaction by exposing a material containing a volatile substance to microwave radiation where the morphology of said material will change when exposed to such radiation. The power of said radiation is adjusted over time as the morphology of the material changes to maximize the effect of the radiation in order to produce a product in a minimum amount of time that is substantially free of said volatile substance. The method and apparatus can also be used to conduct such a process or reaction with materials that do not contain a volatile material. In one embodiment a method and apparatus are disclosed for manufacturing a polyimide from a precursor in a solvent by exposing the precursor to microwave radiation in a tuneable microwave resonant cavity (2) that is tuned during imidization to achieve critical coupling of the system. Microwave power is controlled to remove the solvent and obtain the desired level of reaction.