公开(公告)号：JP2003218177A

公开(公告)日：2003-07-31

申请号：JP2003008636

申请日：2003-01-16

Applicant: IBM

Inventor： MAGERLEIN JOHN HAROLD ,  MCKNIGHT SAMUEL ROY ,  PETRARCA KEVIN SHAWN ,  PURUSHOTHAMAN SAMPATH ,  SAMBUCETTI CARLOS JUAN ,  VAN HORN JOSEPH J ,  VOLANT RICHARD PAUL ,  WALKER GEORGE FREDERICK

IPC: G01R31/26 ,  G01R1/04 ,  H01L21/60 ,  H01L21/66 ,  H05K3/24 ,  H05K3/32

Abstract: PROBLEM TO BE SOLVED: To provide an ability to test and 'burn in' device chips that require ultra high pitch I/O pads. SOLUTION: A system for testing a collection of the device chips by temporarily attaching them to a carrier having a plurality of receptacles with microdendritic features; the receptacles matching with and pushed in contact with a matching set of contact pads on the device chips; the carrier additionally having test pads connected to the receptacles through interconnect wiring. The system allows connecting the chips together and testing the collection as a whole by probing the test pads on the carrier. Burn-in of the collection of chips can also be performed on the temporary carrier, which is reusable. COPYRIGHT: (C)2003,JPO