公开(公告)号：GB2627899B

公开(公告)日：2025-02-12

申请号：GB202408555

申请日：2022-09-04

Applicant: IBM

Inventor： AKIHIRO HORIBE ,  QIANWEN CHEN ,  RISA MIYAZAWA ,  MICHAEL BELYANSKY ,  JOHN KNICKERBOCKER ,  TAKASHI HISADA

IPC: H01L21/683

Abstract: Handler wafers and methods of handling a wafer include positioning a handler, which is attached to a wafer by a bonding layer that comprises a debonding layer, an optical enhancement layer, and an anti-reflection layer. The handler is debonded from the wafer using a laser that emits laser energy at a wavelength that is absorbed by the debonding layer and that is confined to the debonding layer by the optical enhancement layer, such that the material of the debonding layer ablates when exposed to the laser energy to release the wafer.