公开(公告)号：JP2000091271A

公开(公告)日：2000-03-31

申请号：JP14860499

申请日：1999-05-27

Applicant: IBM

Inventor： DEHAVEN PATRICK W ,  GOLDSMITH CHARLES C ,  HURD JEFFERY L ,  SAAYANARAYANA KAJA ,  MICHAEL S REGARE ,  FRED D PERFECT

IPC: H01L21/28 ,  C25D5/50 ,  C25D7/00 ,  H01L21/288 ,  H01L21/3205 ,  H01L23/52 ,  H05K1/09 ,  H05K3/22

Abstract: PROBLEM TO BE SOLVED: To obtain a method for manufacturing an electronic circuit by controlling growth of particle structures of a thin film after deposited on a substrate. SOLUTION: The present invention provides a method for depositingly forming a metallic thin film having different micro-structures on a substrate. The method, which controls particle growth in the micro-structures, includes steps of (a) depositingly forming the metallic thin film having the micro- structures of fine particles on the substrate, and (b) heating the metallic thin film at 70-100 deg.C for at least 5 minutes to change the fine particle micro- structures to stable micro-structures of large particles. A result of X-ray diffraction of an electroplated copper thin film having micro-structures of large particles is illustrated.