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公开(公告)号:EP1483419A4
公开(公告)日:2005-07-06
申请号:EP03707862
申请日:2003-02-11
Applicant: IBM
Inventor: CHOI WON K , GOLDSMITH CHARLES C , GOSSELIN TIMOTHY A , HENDERSON DONALD W , KANG SUNG K , PUTTLITZ KARL J SR , SHIH DA-YUAN
CPC classification number: C22C13/00 , B23K35/262 , B23K2201/36 , H01L24/11 , H01L24/16 , H01L2224/05568 , H01L2224/05573 , H01L2924/01322 , H01L2924/14 , H05K3/3436 , H05K3/3463 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722 , H01L2924/00
Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90 %. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates (57, 58) is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling δT relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0 % or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate (57, 58) formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5 %.
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公开(公告)号:JP2000091271A
公开(公告)日:2000-03-31
申请号:JP14860499
申请日:1999-05-27
Applicant: IBM
Inventor: DEHAVEN PATRICK W , GOLDSMITH CHARLES C , HURD JEFFERY L , SAAYANARAYANA KAJA , MICHAEL S REGARE , FRED D PERFECT
IPC: H01L21/28 , C25D5/50 , C25D7/00 , H01L21/288 , H01L21/3205 , H01L23/52 , H05K1/09 , H05K3/22
Abstract: PROBLEM TO BE SOLVED: To obtain a method for manufacturing an electronic circuit by controlling growth of particle structures of a thin film after deposited on a substrate. SOLUTION: The present invention provides a method for depositingly forming a metallic thin film having different micro-structures on a substrate. The method, which controls particle growth in the micro-structures, includes steps of (a) depositingly forming the metallic thin film having the micro- structures of fine particles on the substrate, and (b) heating the metallic thin film at 70-100 deg.C for at least 5 minutes to change the fine particle micro- structures to stable micro-structures of large particles. A result of X-ray diffraction of an electroplated copper thin film having micro-structures of large particles is illustrated.
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公开(公告)号:CA2475491A1
公开(公告)日:2003-08-28
申请号:CA2475491
申请日:2003-02-11
Applicant: IBM
Inventor: CHOI WON K , GOLDSMITH CHARLES C , GOSSELIN TIMOTHY A , HENDERSON DONALD W , KANG SUNG K , PUTTLITZ KARL SR , SHIH DA-YUAN
IPC: B23K1/00 , B23K35/26 , B23K101/42 , C22C13/00 , H01L21/60 , H01L23/12 , H05K3/34 , H01L23/488
Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn) , silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90 %. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates (57, 58 ) is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phas e is nucleated. This lower temperature corresponds to an undercooling .delta.T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0 % or less, wherein the liquefied alloy is cooled at a cooli ng rate that is high enough to substantially suppress Ag3Sn plate (57, 58) formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5 %.
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公开(公告)号:MY128248A
公开(公告)日:2007-01-31
申请号:MYPI20030490
申请日:2003-02-13
Applicant: IBM
Inventor: CHOI WON K , GOLDSMITH CHARLES C , GOSSELIN TIMOTHY A , HENDERSON DONALD W , KANG SUNG K , PUTTLITZ KARL SR , SHIH DA-YUAN
Abstract: A SOLDER COMPOSITION AND ASSOCIATED METHOD OF FORMATION. THE SOLDER COMPOSITION COMPRISES A SUBSTANTIALLY LEAD-FREE ALLOY THAT INCLUDES TIN (Sn), SILVER (Ag), AND COPPER. THE TIN HAS A WEIGHT PERCENT CONCENTRATION IN THE ALLOY OF AT LEAST ABOUT 90% THE SILVER HAS A WEIGHT PERCENT CONCENTRATION X IN THE ALLOY. X IS SUFFICIENTLY SMALL THAT FORMATION OF Ag3Sn PLATES IS SUBSTANTIALLY SUPPRESSED WHEN THE ALLOY INA LIQUEFIED STATE IS BEING SOLIDIFIED BY BEING COOLED TO A LOWER TEMPERATURE AT WHICH THE SOLID Sn PHASE IS NUCLEATED. THIS LOWER TEMPERATURE CORRESPONDS TO AN UNDERCOOLING oT RELATIVE TO THE EUTECTIC MELTING TEMPERATURE OF THE ALLOY. ALTERNATIVELY, X MAY BE ABOUT 4.0% OR LESS , WHEREIN THE LIQUIFIED ALLOY IS COOLED AT A COOLING RATE THAT IS HIGH ENOUGH TO SUBSTANTIALLY SUPPRESS Ag3Sn PLATE FORMATION IN THE ALLOY. THE COPPER HAS A WEIGHT PERCENT CONCENTRATION IN THE ALLOY NOT EXCEEDING ABOUT 1.5%.(FIG 16)
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公开(公告)号:BR0307719A
公开(公告)日:2005-04-26
申请号:BR0307719
申请日:2003-02-11
Applicant: IBM
Inventor: CHOI WON K , GOLDSMITH CHARLES C , GOSSELIN TIMOTHY A , HENDERSON DONALD W , KANG SUNG K , SHIH DA-YUAN , PUTTLITZ KARL SR
IPC: B23K1/00 , B23K35/26 , B23K101/42 , C22C13/00 , H01L21/60 , H01L23/12 , H05K3/34 , H01L23/488
Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling deltaT relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.
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公开(公告)号:CA2475491C
公开(公告)日:2012-03-27
申请号:CA2475491
申请日:2003-02-11
Applicant: IBM
Inventor: CHOI WON K , GOLDSMITH CHARLES C , GOSSELIN TIMOTHY A , HENDERSON DONALD W , KANG SUNG K , PUTTLITZ KARL SR , SHIH DA-YUAN
IPC: B23K1/00 , C22C13/00 , B23K35/26 , B23K101/42 , H01L21/60 , H01L23/12 , H01L23/488 , H05K3/34
Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90 %. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates (57, 58) is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling .delta.T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0 % or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate (57, 58) formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5 %.
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公开(公告)号:AU2003209129A8
公开(公告)日:2003-09-09
申请号:AU2003209129
申请日:2003-02-11
Applicant: IBM
Inventor: KANG SUNG K , GOSSELIN TIMOTHY A , CHOI WON K , PUTTLITZ KARL SR , HENDERSON DONALD W , GOLDSMITH CHARLES C , SHIH DA-YUAN
IPC: B23K1/00 , B23K35/26 , B23K101/42 , C22C13/00 , H01L21/60 , H01L23/12 , H05K3/34 , H01L23/488
Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling deltaT relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.
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公开(公告)号:AU2003209129A1
公开(公告)日:2003-09-09
申请号:AU2003209129
申请日:2003-02-11
Applicant: IBM
Inventor: CHOI WON K , GOLDSMITH CHARLES C , GOSSELIN TIMOTHY A , HENDERSON DONALD W , KANG SUNG K , PUTTLITZ KARL SR , SHIH DA-YUAN
Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling deltaT relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.
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