公开(公告)号：EP1483419A4

公开(公告)日：2005-07-06

申请号：EP03707862

申请日：2003-02-11

Applicant: IBM

Inventor： CHOI WON K ,  GOLDSMITH CHARLES C ,  GOSSELIN TIMOTHY A ,  HENDERSON DONALD W ,  KANG SUNG K ,  PUTTLITZ KARL J SR ,  SHIH DA-YUAN

IPC: B23K1/00 ,  B23K35/26 ,  B23K101/42 ,  C22C13/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/34 ,  C22C1/00

CPC classification number: C22C13/00 ,  B23K35/262 ,  B23K2201/36 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3463 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  H01L2924/00

Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90 %. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates (57, 58) is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling δT relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0 % or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate (57, 58) formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5 %.

公开(公告)号：JP2000091271A

公开(公告)日：2000-03-31

申请号：JP14860499

申请日：1999-05-27

Applicant: IBM

Inventor： DEHAVEN PATRICK W ,  GOLDSMITH CHARLES C ,  HURD JEFFERY L ,  SAAYANARAYANA KAJA ,  MICHAEL S REGARE ,  FRED D PERFECT

IPC: H01L21/28 ,  C25D5/50 ,  C25D7/00 ,  H01L21/288 ,  H01L21/3205 ,  H01L23/52 ,  H05K1/09 ,  H05K3/22

Abstract: PROBLEM TO BE SOLVED: To obtain a method for manufacturing an electronic circuit by controlling growth of particle structures of a thin film after deposited on a substrate. SOLUTION: The present invention provides a method for depositingly forming a metallic thin film having different micro-structures on a substrate. The method, which controls particle growth in the micro-structures, includes steps of (a) depositingly forming the metallic thin film having the micro- structures of fine particles on the substrate, and (b) heating the metallic thin film at 70-100 deg.C for at least 5 minutes to change the fine particle micro- structures to stable micro-structures of large particles. A result of X-ray diffraction of an electroplated copper thin film having micro-structures of large particles is illustrated.

公开(公告)号：CA2475491A1

公开(公告)日：2003-08-28

申请号：CA2475491

申请日：2003-02-11

Applicant: IBM

Inventor： CHOI WON K ,  GOLDSMITH CHARLES C ,  GOSSELIN TIMOTHY A ,  HENDERSON DONALD W ,  KANG SUNG K ,  PUTTLITZ KARL SR ,  SHIH DA-YUAN

IPC: B23K1/00 ,  B23K35/26 ,  B23K101/42 ,  C22C13/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/34 ,  H01L23/488

Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn) , silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90 %. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates (57, 58 ) is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phas e is nucleated. This lower temperature corresponds to an undercooling .delta.T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0 % or less, wherein the liquefied alloy is cooled at a cooli ng rate that is high enough to substantially suppress Ag3Sn plate (57, 58) formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5 %.

公开(公告)号：MY128248A

公开(公告)日：2007-01-31

申请号：MYPI20030490

申请日：2003-02-13

Applicant: IBM

Inventor： CHOI WON K ,  GOLDSMITH CHARLES C ,  GOSSELIN TIMOTHY A ,  HENDERSON DONALD W ,  KANG SUNG K ,  PUTTLITZ KARL SR ,  SHIH DA-YUAN

IPC: B23K1/00 ,  B23K101/42 ,  B23K35/26 ,  C22C13/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/34

Abstract: A SOLDER COMPOSITION AND ASSOCIATED METHOD OF FORMATION. THE SOLDER COMPOSITION COMPRISES A SUBSTANTIALLY LEAD-FREE ALLOY THAT INCLUDES TIN (Sn), SILVER (Ag), AND COPPER. THE TIN HAS A WEIGHT PERCENT CONCENTRATION IN THE ALLOY OF AT LEAST ABOUT 90% THE SILVER HAS A WEIGHT PERCENT CONCENTRATION X IN THE ALLOY. X IS SUFFICIENTLY SMALL THAT FORMATION OF Ag3Sn PLATES IS SUBSTANTIALLY SUPPRESSED WHEN THE ALLOY INA LIQUEFIED STATE IS BEING SOLIDIFIED BY BEING COOLED TO A LOWER TEMPERATURE AT WHICH THE SOLID Sn PHASE IS NUCLEATED. THIS LOWER TEMPERATURE CORRESPONDS TO AN UNDERCOOLING oT RELATIVE TO THE EUTECTIC MELTING TEMPERATURE OF THE ALLOY. ALTERNATIVELY, X MAY BE ABOUT 4.0% OR LESS , WHEREIN THE LIQUIFIED ALLOY IS COOLED AT A COOLING RATE THAT IS HIGH ENOUGH TO SUBSTANTIALLY SUPPRESS Ag3Sn PLATE FORMATION IN THE ALLOY. THE COPPER HAS A WEIGHT PERCENT CONCENTRATION IN THE ALLOY NOT EXCEEDING ABOUT 1.5%.(FIG 16)

公开(公告)号：BR0307719A

公开(公告)日：2005-04-26

申请号：BR0307719

申请日：2003-02-11

Applicant: IBM

Inventor： CHOI WON K ,  GOLDSMITH CHARLES C ,  GOSSELIN TIMOTHY A ,  HENDERSON DONALD W ,  KANG SUNG K ,  SHIH DA-YUAN ,  PUTTLITZ KARL SR

IPC: B23K1/00 ,  B23K35/26 ,  B23K101/42 ,  C22C13/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/34 ,  H01L23/488

Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling deltaT relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.

公开(公告)号：CA2475491C

公开(公告)日：2012-03-27

申请号：CA2475491

申请日：2003-02-11

Applicant: IBM

Inventor： CHOI WON K ,  GOLDSMITH CHARLES C ,  GOSSELIN TIMOTHY A ,  HENDERSON DONALD W ,  KANG SUNG K ,  PUTTLITZ KARL SR ,  SHIH DA-YUAN

IPC: B23K1/00 ,  C22C13/00 ,  B23K35/26 ,  B23K101/42 ,  H01L21/60 ,  H01L23/12 ,  H01L23/488 ,  H05K3/34

Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90 %. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates (57, 58) is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling .delta.T relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0 % or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate (57, 58) formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5 %.

公开(公告)号：AU2003209129A8

公开(公告)日：2003-09-09

申请号：AU2003209129

申请日：2003-02-11

Applicant: IBM

Inventor： KANG SUNG K ,  GOSSELIN TIMOTHY A ,  CHOI WON K ,  PUTTLITZ KARL SR ,  HENDERSON DONALD W ,  GOLDSMITH CHARLES C ,  SHIH DA-YUAN

IPC: B23K1/00 ,  B23K35/26 ,  B23K101/42 ,  C22C13/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/34 ,  H01L23/488

Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling deltaT relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.

公开(公告)号：AU2003209129A1

公开(公告)日：2003-09-09

申请号：AU2003209129

申请日：2003-02-11

Applicant: IBM

Inventor： CHOI WON K ,  GOLDSMITH CHARLES C ,  GOSSELIN TIMOTHY A ,  HENDERSON DONALD W ,  KANG SUNG K ,  PUTTLITZ KARL SR ,  SHIH DA-YUAN

IPC: B23K1/00 ,  B23K35/26 ,  B23K101/42 ,  C22C13/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/34

Abstract: A solder composition and associated method of formation. The solder composition comprises a substantially lead-free alloy that includes tin (Sn), silver (Ag), and copper. The tin has a weight percent concentration in the alloy of at least about 90%. The silver has a weight percent concentration X in the alloy. X is sufficiently small that formation of Ag3Sn plates is substantially suppressed when the alloy in a liquefied state is being solidified by being cooled to a lower temperature at which the solid Sn phase is nucleated. This lower temperature corresponds to an undercooling deltaT relative to the eutectic melting temperature of the alloy. Alternatively, X may be about 4.0% or less, wherein the liquefied alloy is cooled at a cooling rate that is high enough to substantially suppress Ag3Sn plate formation in the alloy. The copper has a weight percent concentration in the alloy not exceeding about 1.5%.