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公开(公告)号：GB2500965A
公开(公告)日：2013-10-09
申请号：GB201301546
申请日：2013-01-29
Applicant: IBM
Inventor： PARIDA PRITISH RANJAN , CHAINER TIMOTHY JOSEPH , IYENGAR MADHUSUDAN , MILNES DAVID PAUL , SIMONS ROBERT
Abstract: A cooling system such as an intra-rack cooling system 500 of a data centre comprises: one or more nodes, such as servers 300, each node having at least one temperature sensor to monitor a temperature of the node components; an air-to-liquid heat exchanger 402 configured to accept a liquid coolant input, preferably via a first shut-off valve 504, to provide cooled air to the one or more nodes; and a temperature sensor to monitor a temperature of air Tai provided by the heat exchanger. The cooling system also comprises a direct liquid cooling apparatus to provide liquid coolant to components of the one or more nodes, preferably an inlet plenum 404, i.e. manifold, and an outlet plenum 406. The apparatus supplies cold input coolant 412, preferably via a second shut-off valve 506, to the one or more nodes and ejects warm coolant 410. A valve, ideally a three-way valve 502, is configured to control a proportion of the coolant flow directed to the heat exchanger and the one or more nodes based upon the monitored temperatures. A flow rate of coolant is also controlled based upon the monitored temperatures, preferably by varying the pump strength of a pump 401.
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Patent Agency Ranking
公开(公告)号：GB2500966B
公开(公告)日：2016-03-02
申请号：GB201301549
申请日：2013-01-29
Applicant: IBM
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公开(公告)号：GB2514263A
公开(公告)日：2014-11-19
申请号：GB201407784
申请日：2012-10-23
Applicant: IBM
Inventor： IYENGAR MADHUSUDAN , CHU RICHARD , SIMONS ROBERT , ELLSWORTH MICHAEL , CAMPBELL LEVI , MILNES DAVID PAUL
Abstract: A cooling unit (500) is provided to facilitate cooling of coolant passing through a coolant loop (501). The cooling unit (500) includes one or more heat rejection units (510a, 510b) and an elevated coolant tank (520). The heat rejection unit (510a, 510b) rejects heat from coolant passing through the coolant loop (501) to air passing across the heat rejection unit (510a, 510b). The heat rejection unit (510a, 510b) includes one or more heat exchange assemblies (600) coupled to the coolant loop (501) for at least a portion of the coolant to pass through the one or more heat exchange assemblies (600). The elevated coolant tank (520), which is elevated above at least a portion of the coolant loop (501), is coupled in fluid communication with the one or more heat exchange assemblies (600) of the heat rejection unit (510a, 510b), and facilitates return of coolant to the coolant loop (501) at a substantially constant pressure.
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公开(公告)号：GB2497191B
公开(公告)日：2014-02-26
申请号：GB201221080
申请日：2012-11-23
Applicant: IBM
Inventor： ELLSWORTH MICHAEL , CHU RICHARD , SIMONS ROBERT , CAMPBELL LEVI , IYENGAR MADHUSUDAN , MILNES DAVID PAUL
Abstract: A method is provided for dissipating heat from a rack. The method includes: disposing a coolant-cooled heat exchanger within the rack, and providing a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.
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公开(公告)号：GB2500966A
公开(公告)日：2013-10-09
申请号：GB201301549
申请日：2013-01-29
Applicant: IBM
Inventor： PARIDA PRITISH RANJAN , CHAINER TIMOTHY JOSEPH , IYENGAR MADHUSUDAN , MILNES DAVID PAUL , SIMONS ROBERT
Abstract: A cooling system such as an intra-rack cooling system 500 of a data centre comprises: one or more nodes, such as servers 300, each node having at least one temperature sensor to monitor a temperature of the node components; an air-to-liquid heat exchanger 402 configured to accept a liquid coolant input, preferably via a first shut-off valve 504, to provide cooled air to the one or more nodes; and a temperature sensor to monitor a temperature of air Tai provided by the heat exchanger. The cooling system also comprises a direct liquid cooling apparatus to provide liquid coolant to components of the one or more nodes, preferably an inlet plenum 404, i.e. manifold, and an outlet plenum 406. The apparatus supplies cold input coolant 412, preferably via a second shut-off valve 506, to the one or more nodes and ejects warm coolant 410. A valve, ideally a three-way valve 502, is configured to control a proportion of the coolant flow directed to the heat exchanger and the one or more nodes based upon the monitored temperatures. A flow rate of coolant is also controlled based upon the monitored temperatures, preferably by varying the pump strength of a pump 401.
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公开(公告)号：GB2497191A
公开(公告)日：2013-06-05
申请号：GB201221080
申请日：2012-11-23
Applicant: IBM
Inventor： ELLSWORTH MICHAEL , CHU RICHARD , SIMONS ROBERT , CAMPBELL LEVI , IYENGAR MADHUSUDAN , MILNES DAVID PAUL
Abstract: Cooling apparatus associated with one or more electronic racks 910 in a data center 900 includes a coolant-cooled heat exchanger 920, such as a door mounted air-to-liquid heat exchanger for facilitating dissipation of heat generated within the electronics rack 910, and a coolant control apparatus 930. The coolant control apparatus includes at least one coolant recirculation conduit 931 coupled in fluid communication between a facility coolant supply conduit 921 and return conduit 922, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) 932 associated with the recirculation conduits and a controller 935 which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a room dew point temperature. The coolant control apparatus may be shared between multiple electronics racks (Figs. 9 A and B) or separate coolant control apparatus may be associated with each electronics rack (See Fig. 10).
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