FIELD EFFECT TRANSISTOR AND FABRICATION THEREOF

    公开(公告)号:JP2000101093A

    公开(公告)日:2000-04-07

    申请号:JP24211799

    申请日:1999-08-27

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a device structure of SOI(silicon on isulator) CMOS (complementary metal oxide semiconductor) in which avalanche multiplication of current flowing through a device is increased when an FET(field effect transistor) is turned on and body charges are removed when the FET is turned off. SOLUTION: An FET having an electric floating body is substantially isolated electrically from a substrate. A high resistance path 16 for coupling the floating body is provided at the source. The resistor is operated as a floating body for active switching and a body grounded in waiting mode in order to reduce leakage current. The high resistance path has a resistance of at least 1 MΩ and made of polysilicon. The resistor is formed using a split polysilicon process for opening a hole in a first polysilicon layer in order that an embedded contact mask 19 brings a second polysilicon layer into contact with the substrate.

    SEMICONDUCTOR DEVICE AND TRANSISTOR DEVICE

    公开(公告)号:JPH11289016A

    公开(公告)日:1999-10-19

    申请号:JP2366499

    申请日:1999-02-01

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a DTFET(dynamic threshold field effect transistor) which can improve a switching speed in a transistor circuit and can use a power voltage higher than 0.5 volts. SOLUTION: A DTFET 12 includes a resistance 18 connected between an input node 14 and a body 15. Inclusion of such a resistance can realization of the DTFET by a bulk technique and can utilize a power voltage higher than 0.5 volts. The resistance 18 can be provided in the form of a resistance integrated within a transistor or in the form of an independent element separated from the transistor.

Patent Agency Ranking