Abstract:
The present invention provides a thin film transistor (TFT) and a fabrication method thereof which suppresses the back channel effects in which a leakage current flows between a source electrode and a drain electrode at times during a turn off state of the TFT. A thin silicon oxynitride film 90 having a thickness preferably equal to or less than 50 Å is formed between an amorphous silicon layer 40 and a channel passivation film 50 (a silicon nitride film) above a back channel region 100 between a source electrode and a drain electrode of an inverted staggered type TFT to cause Si-O bonds to exist in an upper interface of the amorphous silicon layer. The Si-O bonds increase the Density of States in the back channel region and has an effect for suppressing the leakage current through the back channel region 100 at times during the turn off of the TFT.
Abstract:
To provide a process for patterning an ITO film, which is capable of preventing, for patterning an Indium-Tin-Oxide (ITO) film by using a chemically amplified resist, resist peeling or reduced adhesion even if the ITO film is exposed to a white light after resist development. An amorphous ITO film is first formed on a substrate, and a negative chemically amplified resist is directly provided on the film, exposed and. developed. In a resultant structure having a resist pattern on the amorphous ITO film, even if exposed to a white light, no resist peeling or no reduced adhesion occurs, and thus satisfactory visual inspection can be performed without adversely affecting subsequent steps. For the structure determined as a good product by visual inspection, the amorphous ITO film is etched through the resist pattern used as a mask, the resist pattern is removed, and then by heating the amorphous ITO film at the ITO crystallization temperature or higher, the crystallized ITO pattern having chemical resistance and good electrical conductivity can he obtained.
Abstract:
A method for patterning an indium-tin-oxide (ITO) film by using a chemically amplified resist, causing no resist separation nor adhesion degradation even if the ITO film is exposed to white light after the resist development. An amorphous ITO film is formed on a wafer. A negative chemically amplified resist is applied directly to the ITO film, and the resist film is exposed a nd developed. The structure having a resist pattern on the amorphous ITO film i s free from resist separation and adhesion degradation even if the resist pattern is exposed to white light, and therefore the later manufacturing ste ps are not adversely affected, enabling proper visual inspection. After the structure is judged to be acceptable at the visual inspection, the amorphous ITO film is etched using the resist pattern as a mask, and then the resist pattern is removed. The ITO film is heated over the crystallization temperature of the ITO to form a crystallized ITO pattern having a chemical- resistance and a good electrical conductivity.
Abstract:
When a client apparatus receives a request for an electronic certificate from a server apparatus, the server apparatus reads a client containing personal information and a server public key of the server apparatus from a storage unit and encrypts the client certificate using the server public key. The client apparatus also a temporary electronic certificate by setting, in a basic field of an electronic certificate, a predetetmined item indicating that the electronic certificate is a temporary electronic certificate and by the client certificate having been encrypted in an extension field of the electronic certificate. Thenthe client apparatus sends the temporary electronic certificate to the server apparatus.
Abstract:
[Object] To provide a technique for authenticating a communication partner using an electronic certificate containing personal information. [Solving Means] When a client apparatus receives a request for an electronic certificate from a server apparatus, the server apparatus reads a client certificate containing personal information and a server public key of the server apparatus from a storage unit and encrypts the client certificate using the server public key. The client apparatus also creates a temporary electronic certificate by setting, in a basic field of an electronic certificate, a predetermined item indicating that the electronic certificate is a temporary electronic certificate and by setting the client certificate having been encrypted in an extension field of the electronic certificate. Then, the client apparatus sends the temporary electronic certificate to the server apparatus.
Abstract:
[PROBLEMS TO BE SOLVED] It is an object to provide a technique for authen ticating a communication partner by means of an electronic certificate inclu ding personal information. [MEANS FOR SOLVING THE PROBLEMS] When a client de vice receives a request of an electronic certificate from a server device, t he client device reads out a client certificate including personal informati on and a server public key from a storing unit and encrypts the client certi ficate by using the server public key. Further, the client device sets a pre determined item in a basic region of the electronic certificate showing that the electronic certificate is temporary digital evidence and makes out a te mporary electronic certificate by setting the encrypted client certificate i n an expanded region of the electronic certificate. The client device then t ransmits the temporary electronic certificate to the server device.
Abstract:
PROBLEM TO BE SOLVED: To perform additional processing in relaying data communication without worrying about the delay of transfer of a server's response to a client's access request. SOLUTION: A relaying device for relaying data communication between a client and a server comprises a receiving part for receiving an access request from the client to the server, a determination part for determining whether fixed time and more is required up to the transfer of a server's response to the access request to the client or not, a temporary response part for transmitting a temporary response message for reporting the separate transmission of the server's response from the relaying device to the client in response to a determination result indicating the requirement of the fixed time and more, and a transfer part for transferring the response to the client in response to a state that the server's response can be transferred to the client. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a film transistor which prevents defects in which a leakage current arises between source and drain electrodes in off condition of a thin-film transistor(TFT), and its manufacture. SOLUTION: This is a reverse staggered type TFT and is provided with a thin (preferably 50 Å or under) silicon oxide film 90 between the amorphous silicon (a-Si) layer 40 of a back-channel region 100 between a source electrode and a drain electrode and a channel protective film 50 (silicon nitride film), and Si-O coupling is made to exist at the top interface of the a-Si layer. The Si-O coupling has the effect of suppressing the leakage current via the back channel region 100 in off condition of the TFT, by raising the state density of the back channel region 100 of the a-Si layer 40. Moreover, this thin silicon acid nitride film 90 includes sufficient Si-N couplings, so that the etching rate is lower than that of the silicon oxide film. Therefore, the etching control is simple, and it gives a reliable reverse staggered type TFT which is stable in voltage current property.
Abstract:
PROBLEM TO BE SOLVED: To reduce leakage current at a floating island formed on a thin-film transistor. SOLUTION: A source electrode 14 and a drain electrode 15, provided above an insulating substrate 11 at a prescribed interval, an a-Si film 16 provided to them, a gate insulating film 17 stacked on the a-Si film 16, and a gate electrode 18 stacked on the gate insulating film 17, are provided. The a-Si film 16 comprises a floating inland 20, which is not present above and below the gate electrode 18, while being present between the source electrode 14 and the drain electrode 15. The boron ion is implanted in the region, to form a boron ion implantation region 19.