公开(公告)号：JP2001093128A

公开(公告)日：2001-04-06

申请号：JP25907099

申请日：1999-09-13

Applicant: IBM

Inventor： ITO KENJI ,  TSUCHIDA HIROYASU ,  YOSHIDA TATSUSHI ,  UEMATSU YOSHIO ,  ONO TETSUJI

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21

Abstract: PROBLEM TO BE SOLVED: To provide a head suspension assembly capable of joining plural wires to the connection pad part of a slider without providing an open hole window on the tip of a load beam. SOLUTION: The wires 701-704 are wound around pins 2011-2013, led from the rear end side of this suspension assembly(SA) 1000 to a tip side, wound around the pins 2021-2024 and 2031-2034 and bent. The wires 701 and 702 are adhered to the second frame 420 of a tab frame 400 and the wires 703 and 704 are adhered to the second frame 520 of the tab frame 500. The tab frames 400 and 500 are bent almost perpendicularly to the SA 1000 and also the second frames 420 and 520 are bent almost perpendicularly to first frames 410 and 510. The wires 701-704 are led to the joining position of the slider 800.