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    AIR TWEEZER AND SUCTION PAD
    1.
    发明专利
    AIR TWEEZER AND SUCTION PAD 失效

    公开(公告)号：JP2001232573A

    公开(公告)日：2001-08-28

    申请号：JP2000044742

    申请日：2000-02-22

    Applicant: IBM

    Inventor： UEMATSU YOSHIO ,  ICHIMURA YOTARO ,  TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI

    IPC: B25B11/00 ,  B25J15/06

    Abstract: PROBLEM TO BE SOLVED: To provide an air tweezer capable of sucking an object having an extremely small dimension such as a pico slider or a femto slider and arranging it at a predetermined position of a suspension efficiently and providing a countermeasure against ESD. SOLUTION: This air tweezer 1 comprises a tweezer body 2 for gripping when work is done, a tube assembly 5 mounted on the tweezer body 2 and having a suction passage, and a suction pad 6 mounted at a tip of the tube assembly 5 and provided with an opening communicated with the suction passage to suck the object by the suction pad 6 by letting a suction force act on the suction passage of the tube assembly 5. The suction pad 6 is made of an elastic member provided with an electric current carrying path.

    METHOD OF MANUFACTURING LAMINATED STRUCTURE FOR DISK DRIVING SUSPENSION ASSEMBLY AND LAMINATED STRUCTURE FOR THE SAME
    3.
    发明专利
    METHOD OF MANUFACTURING LAMINATED STRUCTURE FOR DISK DRIVING SUSPENSION ASSEMBLY AND LAMINATED STRUCTURE FOR THE SAME 失效

    公开(公告)号：JP2002343045A

    公开(公告)日：2002-11-29

    申请号：JP2001149952

    申请日：2001-05-18

    Applicant: FUJIKURA LTD ,  IBM

    Inventor： NAGATA MASAKATSU ,  IWASAKI SHOJI ,  MIZUTANI MUNEKIMI ,  NASU YOSHIO ,  ISHIKAWA HIROMI ,  UEMATSU YOSHIO ,  SHI ARASHI ,  YOSHIDA TATSUSHI

    IPC: G11B21/21

    Abstract: PROBLEM TO BE SOLVED: To provide a technique capable of making manufacturing efficiency higher and a product cost lower than the conventional production process, etc., utilizing only the dry etching process represented by plasma etching in molding an intermediate second layer consisting of an electrically insulating material in a method of manufacturing a laminated structure for a disk driving suspension assembly using a multilayered lamination sheet having a first layer consisting of a metallic spring material, the second layer described above and a third layer consisting of a conductive material. SOLUTION: The method of manufacturing the laminated structure for the disk driving suspension assembly comprising using the multilayered lamination sheet having the first layer 50 consisting of the metallic spring material, the intermediate second layer 90 consisting of the electrical insulating material and the third layer 70 consisting of the conductive material and performing the dry etching process after wet etching as a process step of molding the second layer 90 and the laminated structure thereof are provided.

    BASE MEMBER, CONVEYANCE EQUIPMENT, HEAD GIMBALS ASSEMBLY EQUIPMENT AND ASSEMBLY METHOD FOR THE SAME
    4.
    发明专利
    BASE MEMBER, CONVEYANCE EQUIPMENT, HEAD GIMBALS ASSEMBLY EQUIPMENT AND ASSEMBLY METHOD FOR THE SAME 失效

    公开(公告)号：JP2002170351A

    公开(公告)日：2002-06-14

    申请号：JP2000355838

    申请日：2000-11-22

    Applicant: IBM

    Inventor： KIDACHI TAKAO ,  TOMIYAMA TADAAKI ,  UEMATSU YOSHIO ,  ISHIKAWA HIROMI ,  YOSHIDA TATSUSHI ,  YOKOME HIROYOSHI ,  NAKAMURA YUKIHIRO ,  OYAMA HIROSHI ,  TSUCHIYA TATSUMI

    IPC: G11B21/21 ,  G11B5/48 ,  G11B21/20

    Abstract: PROBLEM TO BE SOLVED: To solve the problems, such as the degradation in working space efficiency and a cost increase by as much as the need for assembly jigs (holders and fixtures, etc.), as trays or blocks move as a pair at all times while unfinished HG assemblies move between respective manufacturing process steps in assembling the HG assemblies which are components of hard disk devices and consequently the assembly jigs are needed by as much as the number of the unfinished HG assemblies existing in at least the respective assembly process steps. SOLUTION: Base plates, load beams, etc., which are lamination members constituting the HG assemblies are respectively formed of run constitution. The base late runs 3 and the load beam runs 4 are conveyed in the laminated run state by the conveyance equipment 2 and are subjected in the run state to necessary assembly process steps, such as adhesion of the respective layers, fitting of sliders, electrical connection of terminals and the like.

    Method for manufacturing laminated structure for disk driving suspension assembly and the laminated structure
    6.
    发明专利
    Method for manufacturing laminated structure for disk driving suspension assembly and the laminated structure 审中-公开
    盘式驱动悬挂组件和层压结构的制造层压结构的方法

    公开(公告)号：JP2003007015A

    公开(公告)日：2003-01-10

    申请号：JP2001189596

    申请日：2001-06-22

    Applicant: Fujikura Ltd ,  Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション ,  株式会社フジクラ

    Inventor： NAGATA MASAKATSU ,  IWASAKI SHOJI ,  MIZUTANI MUNEKIMI ,  NASU YOSHIO ,  ISHIKAWA HIROMI ,  UEMATSU YOSHIO ,  SHI ARASHI ,  YOSHIDA TATSUSHI

    IPC: G11B21/21

    Abstract: PROBLEM TO BE SOLVED: To improve manufacturing efficiency and to reduce costs for a product compared with a conventional manufacturing method, etc., using only a dry etching process typified by plasma etching for molding a second layer in a method for manufacturing a laminated structure for a disk driving suspension assembly using a multilayer sheet having a first layer made of metallic spring material, the second layer in between consisting of electric insulation material and a third layer consisting of conductive material.
    SOLUTION: The method for manufacturing the laminated structure for the disk driving suspension assembly and the laminated structure uses the multilayer sheet having the first layer 50 made of the metallic spring material, the second layer 90 in between consisting of the electric insulation material and the third layer 70 consisting of the conductive material and uses only the wet etching process as the molding process of the second layer 90.
    COPYRIGHT: (C)2003,JPO

    Abstract translation: 要解决的问题：与传统的制造方法等相比，为了提高制造效率和降低成本，仅使用以等离子体蚀刻为代表的用于模制第二层的干蚀刻工艺，用于制造层压结构的方法 一种使用具有由金属弹簧材料制成的第一层的多层片材的盘驱动悬架组件，其中的第二层由电绝缘材料和由导电材料组成的第三层组成。 解决方案：用于制造盘驱动悬架组件和层压结构的层压结构的方法使用具有由金属弹簧材料制成的第一层50的多层片材，其中第二层90由电绝缘材料和第三层 层70由导电材料组成，并且仅使用湿蚀刻工艺作为第二层90的模制工艺。

    Method for manufacturing multilayered plate and hard disk suspension multilayered body
    8.
    发明专利
    Method for manufacturing multilayered plate and hard disk suspension multilayered body 审中-公开
    制造多层板和硬盘悬挂多层体的方法

    公开(公告)号：JP2004039057A

    公开(公告)日：2004-02-05

    申请号：JP2002192543

    申请日：2002-07-01

    Applicant: Fujikura Ltd ,  Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation ,  株式会社フジクラ

    Inventor： NASU YOSHIO ,  NAGATA MASAKATSU ,  IWASAKI SHOJI ,  MIZUTANI MUNEKIMI ,  ITO SHOJI ,  OKAMOTO MASAHIRO ,  PONPANPAANII ANAN ,  ISHIKAWA HIROMI ,  UEMATSU YOSHIO ,  SHI ARASHI ,  YOSHIDA TATSUSHI

    IPC: G11B21/21

    Abstract: PROBLEM TO BE SOLVED: To meet the demand of developing a technology capable of making uniform processing on both sides particularly when a resin layer is processed from both surfaces by wet etching in the multilayered plate of a structure having a resin layer in which thermoplastic polyimide layers are formed on both surfaces of a non-thermoplastic polyimide layer.
    SOLUTION: A manufacturing method is provided for a multilayered plate 100 wherein the thickness d1 of a thermoplastic polyimide layer 20 on a large surface roughness side is secured larger than a thermoplastic polyimide layer 30 on a small rough surface side corresponding to a difference in surface roughness between the thermoplastic polyimide layers 20 and 30 on both sides of a resin layer 60, and etching is similarly progressed on both sides of the resin layer 60 according to a difference in thickness, and a hard disk suspension multilayered body.
    COPYRIGHT: (C)2004,JPO

    Abstract translation: 要解决的问题：为了满足开发能够在两面均匀加工的技术的需求，特别是当在具有树脂层的结构的多层板中通过湿法蚀刻从两个表面处理树脂层时，其中 热塑性聚酰亚胺层形成在非热塑性聚酰亚胺层的两个表面上。 解决方案：提供一种多层板100的制造方法，其中在大的表面粗糙度侧的热塑性聚酰亚胺层20的厚度d1被固定得比对应于差异的小的粗糙表面侧上的热塑性聚酰亚胺层30 在树脂层60的两面上的热塑性聚酰亚胺层20和30之间的表面粗糙度，并且根据厚度差异在树脂层60的两面上类似地进行蚀刻，以及硬盘悬浮体多层体。 版权所有（C）2004，JPO

    IRON BASED PART AND ITS MANUFACTURING METHOD
    9.
    发明专利
    IRON BASED PART AND ITS MANUFACTURING METHOD 失效

    公开(公告)号：JP2002254276A

    公开(公告)日：2002-09-10

    申请号：JP2001055103

    申请日：2001-02-28

    Applicant: IBM JAPAN ,  NHK SPRING CO LTD

    Inventor： NAGATA TAKESHI ,  TSUCHIDA HIROYASU ,  UEMATSU YOSHIO ,  SATO KIYOSHI ,  TAMARU HIROSUKE

    IPC: B24B1/00 ,  C22C38/40 ,  G11B5/48 ,  G11B21/16 ,  G11B33/14

    Abstract: PROBLEM TO BE SOLVED: To provide iron based parts with high cleanliness (e.g. a base plate of a suspension for a disk drive). SOLUTION: A base plate 20 made of a base material of stainless steel formed by press working is polished by an abrasive mainly composed of Fe2 O3 in a polishing process and is deburred. The base plate 20 after polishing is heated to a solution treatment temperature in a reducing atmosphere during a heat treatment process. Through the heat treatment process, an oxide of ingredients in broken micro pieces of the abrasive existed on the face of the base material of the base plate 20 is reduced to leave iron and the iron is diffused in the base material.

    METHOD FOR WIRING WIRE OF HEAD SUSPENSION ASSEMBLY, ASSEMBLY BASE THEREFOR, FLEXTURE ASSEMBLY AND SUSPENSION ASSEMBLY
    10.
    发明专利
    METHOD FOR WIRING WIRE OF HEAD SUSPENSION ASSEMBLY, ASSEMBLY BASE THEREFOR, FLEXTURE ASSEMBLY AND SUSPENSION ASSEMBLY 失效

    公开(公告)号：JP2001093128A

    公开(公告)日：2001-04-06

    申请号：JP25907099

    申请日：1999-09-13

    Applicant: IBM

    Inventor： ITO KENJI ,  TSUCHIDA HIROYASU ,  YOSHIDA TATSUSHI ,  UEMATSU YOSHIO ,  ONO TETSUJI

    IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21

    Abstract: PROBLEM TO BE SOLVED: To provide a head suspension assembly capable of joining plural wires to the connection pad part of a slider without providing an open hole window on the tip of a load beam. SOLUTION: The wires 701-704 are wound around pins 2011-2013, led from the rear end side of this suspension assembly(SA) 1000 to a tip side, wound around the pins 2021-2024 and 2031-2034 and bent. The wires 701 and 702 are adhered to the second frame 420 of a tab frame 400 and the wires 703 and 704 are adhered to the second frame 520 of the tab frame 500. The tab frames 400 and 500 are bent almost perpendicularly to the SA 1000 and also the second frames 420 and 520 are bent almost perpendicularly to first frames 410 and 510. The wires 701-704 are led to the joining position of the slider 800.

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