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公开(公告)号：JP2001344723A
公开(公告)日：2001-12-14
申请号：JP2000165406
申请日：2000-06-02
Applicant: IBM
Inventor： TSUCHIDA HIROYASU , AOYANAGI AKIHIKO , OKADA AKIOMI
Abstract: PROBLEM TO BE SOLVED: To provide a magnetic head device capable of dealing with a high data transfer rate by using a lead wire. SOLUTION: This magnetic head device 1 is provided with a head slider 3 including a magnetic head 2 having data reading and writing elements, a reading lead RL composed of a pair of twisted lead wires for data transfer between the data reading element and the outside, and a writing lead WL composed of a pair of lead wires arranged in parallel without being twisted for data transfer between the data writing element and the outside. Because of the parallel arrangement of the lead wires of the writing lead WL without being twisted, a high data transfer rate is dealt with.
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公开(公告)号：JPH08279264A
公开(公告)日：1996-10-22
申请号：JP7521395
申请日：1995-03-31
Applicant: IBM
Inventor： TSUCHIDA HIROYASU , AOYANAGI AKIHIKO , ENDO TATSUYA
Abstract: PURPOSE: To facilitate a signal wire connection at a top end of load beams in a disk memory device. CONSTITUTION: A flange 26 has a bent part 30. This bent part 30 has a structure bent from a middle portion of a rising part of the flange 26 to further an outside of load beams. A bending width in the flange of this bent part 30 is structured so as to be gradually increased as approaching the top end, and at the top end, the flange 26 has substantially the same face as a base plane 24 of load beams 14, and the top end is structured so as to have a rising part and is connected to a signal exchange head 10 without unwillingly bending a signal wire 20. Accordingly, a vertical flange at the top end of load beams is removed, whereby a connection work region of the signal wire 20 is widened so that the connection works of the signal wire is facilitated.
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公开(公告)号：JP2003123217A
公开(公告)日：2003-04-25
申请号：JP2001313491
申请日：2001-10-11
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , MATSUMOTO YUSUKE , MUROKAWA TAKAAKI , FUJII NAOKI , SATO TAKUYA , MITA YASUHIRO , TSUCHIDA HIROYASU , UEMATSU YOSHIO
Abstract: PROBLEM TO BE SOLVED: To provide a wiring integrated suspension where the position of a solder ball is not deviated from a center line when a bonding pad and a lead wiring pad are connected by the solder ball. SOLUTION: In the wiring integrated suspension where a solder ball 400 is arranged between a lead wiring pad 20 disposed in the flexure part 5 of a suspension and a bonding pad 15 disposed in the slide of a head gimbals part, and the solder ball 400 is melted to connect the lead wiring pad 20 and the bonding pad 13 by solder, in the vicinity of the center lien CL of the surface of the lead wiring pad 20, a recess 21 is formed to drop the solder ball 400 from the surface projected parts 22, 23 of the lead wiring pad 20 by gravity.
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公开(公告)号：JP2000137967A
公开(公告)日：2000-05-16
申请号：JP30890598
申请日：1998-10-29
Applicant: IBM
Inventor： TSUCHIDA HIROYASU , TSUDA SHINGO , BABA SACHIYO , SATO KIYOSHI
Abstract: PROBLEM TO BE SOLVED: To reduce resonance caused by an air flow in a driving device by providing an opening portion having a specified aperture in a rib erected in the longitudinal direction of an arm section having a head slider attached to its tip. SOLUTION: A head suspension assembly(HSA) is provided with an arm section 3a having a head slider 2 attached to its tip, and the head slider 2 is loaded on a disk side by a spring, for example by a 2g load. Ribs 3b are formed on both sides of the longitudinal direction of the arm section 3a to maintain rigidity. In this case, plural opening portions 3c are formed in each of the ribs 3b to reduce a projection area. When the arm section 3a is formed by stainless steel machining, since the opening portion 3c is formed by etching, the dimension of the opening portion 3c is set larger than the plate thickness of the stainless steel, e.g. about 60 μm. By setting the aperture of the opening portion 3c with respect to the rib 3b equal to 10% or more, Karman's vortex generated in the downstream side of the rib 3b is reduced.
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Patent Agency Ranking
公开(公告)号：JPH1145531A
公开(公告)日：1999-02-16
申请号：JP19811797
申请日：1997-07-24
Applicant: IBM
Inventor： TSUCHIDA HIROYASU , SATO TAKUYA , MITA YASUHIRO , YOSHIDA TATSUSHI , ISHIKAWA HIROMI , TANAKA TATSUYA
Abstract: PROBLEM TO BE SOLVED: To accurately control the flying height by obtaining the ideal static attitude of a head/slider assembly. SOLUTION: The head supporting arm 17 of the disk drive device is provided with a front part for supporting an assembly 21, a rear part pivotally attached 30 to the frame of the drive device, a bent part 31 between the front part and rear part, plural conductive wires 25 covered with a tube, and a first and 2nd fixing positions 38, 39 symmetrically arranged on the both sides of the center line of the arm in the position between the bent part and the front part. The tube is mounted on the arm between the bent part and the rear part, and the plural conductive wires extended from the tip of the tube positioned on the front part side of the arm are extended above the bent part and divided into a 1st and 2nd groups 25A, 25B, then the wires of the 1st, 2nd groups are respectively fixed to the 1st and 2nd fixing positions and connected to the head while being symmetrically arranged on the both sides of the center line 29.
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公开(公告)号：JPH0935424A
公开(公告)日：1997-02-07
申请号：JP17319295
申请日：1995-07-10
Applicant: IBM
Inventor： AOYANAGI AKIHIKO , TSUCHIDA HIROYASU , NAKAMOTO TATSUO , TSUJINO HITOSHI , TSUDA SHINGO , OTA MUTSURO
Abstract: PROBLEM TO BE SOLVED: To obtain a structure for fixing a load beam stably to a carriage. SOLUTION: When a load beam 14 is fixed to a carriage 40, the carriage 40 is fixed to a fixing plate 32 by swaging and the fixing plate 32 is fixed to the load beam 14 by welding so that the load beam 14 does not come into direct contact with a swaged part and the deformation of swaged part does not have direct effect on the load beam 14. Furthermore, stability is enhanced in the fixing of load beam by a structure wherein the carriage 40 is surrounded by the load beam 14 on the fixing plate 32 side, i.e., the load beam 14 extends from the opposite sides of longitudinal center of load beam toward the carriage 40 side.
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公开(公告)号：JP2002254276A
公开(公告)日：2002-09-10
申请号：JP2001055103
申请日：2001-02-28
Applicant: IBM JAPAN , NHK SPRING CO LTD
Inventor： NAGATA TAKESHI , TSUCHIDA HIROYASU , UEMATSU YOSHIO , SATO KIYOSHI , TAMARU HIROSUKE
Abstract: PROBLEM TO BE SOLVED: To provide iron based parts with high cleanliness (e.g. a base plate of a suspension for a disk drive). SOLUTION: A base plate 20 made of a base material of stainless steel formed by press working is polished by an abrasive mainly composed of Fe2 O3 in a polishing process and is deburred. The base plate 20 after polishing is heated to a solution treatment temperature in a reducing atmosphere during a heat treatment process. Through the heat treatment process, an oxide of ingredients in broken micro pieces of the abrasive existed on the face of the base material of the base plate 20 is reduced to leave iron and the iron is diffused in the base material.
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公开(公告)号：JP2001093128A
公开(公告)日：2001-04-06
申请号：JP25907099
申请日：1999-09-13
Applicant: IBM
Inventor： ITO KENJI , TSUCHIDA HIROYASU , YOSHIDA TATSUSHI , UEMATSU YOSHIO , ONO TETSUJI
Abstract: PROBLEM TO BE SOLVED: To provide a head suspension assembly capable of joining plural wires to the connection pad part of a slider without providing an open hole window on the tip of a load beam. SOLUTION: The wires 701-704 are wound around pins 2011-2013, led from the rear end side of this suspension assembly(SA) 1000 to a tip side, wound around the pins 2021-2024 and 2031-2034 and bent. The wires 701 and 702 are adhered to the second frame 420 of a tab frame 400 and the wires 703 and 704 are adhered to the second frame 520 of the tab frame 500. The tab frames 400 and 500 are bent almost perpendicularly to the SA 1000 and also the second frames 420 and 520 are bent almost perpendicularly to first frames 410 and 510. The wires 701-704 are led to the joining position of the slider 800.
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公开(公告)号：JP2001043647A
公开(公告)日：2001-02-16
申请号：JP20163099
申请日：1999-07-15
Applicant: IBM
Inventor： TSUCHIYA TATSUMI , YOSHIDA TATSUSHI , TSUCHIDA HIROYASU , INOUE HIROO , SURUYA PATANAIKU , ISHIKAWA HIROMI , NANBA MASAAKI
Abstract: PROBLEM TO BE SOLVED: To prevent short-circuiting caused by the oozing-out of flexure adhesive, to absorb distortion caused by the contraction of a soldered part by reducing the rigidity of a flexure, and to improve the quality of the soldered part by arranging pads adjacently to each other as much as possible when the bonding pad formed in a slider held in the flexure and the leading pad for a lead fixed to the platform of the flexure are soldered to each other. SOLUTION: Holes 21 and 22 are bored in a flexure 8 portion near the soldered parts of the bonding pads 28 to 31 of a slider 25 and the leading pads 41 to 44 of a lead end part. Thus, since adhesive for adhering the slider 25 to a flexure tongue 20 is moved downward from the holes 21 and 22, the adhesive is prevented from being brought into contact with the bonding pads 28 to 31.
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