公开(公告)号：JP2002048716A

公开(公告)日：2002-02-15

申请号：JP2000200861

申请日：2000-07-03

Applicant: IBM

Inventor： TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  ITO KENJI ,  KOIKE TORU ,  MATSUMOTO YUSUKE ,  FUJIMORI MASASHI ,  NAKAGAWA SEIJI

IPC: G01N21/84 ,  G01N21/88 ,  G02B21/00 ,  G11B5/48

Abstract: PROBLEM TO BE SOLVED: To provide a jig unnecessary for an inspector to pass a head assembly from one hand to the other hand many times when executing an appearance inspection from many directions. SOLUTION: This jig is provided with a base part 11 having an upper plane 11u to be a placing table of an optical microscope 100 in inspecting the appearance of a small component 30 using the optical microscope 100, and provided with a moving means 11b for moving the upper plane 11u almost parallel with the optical axis direction of at least an objective lens 103 of the optical microscope 100 in order to focus an inspected part of the small component 30 placed on the upper place 11u, on the focus of the optical microscope 100, an inspection object support part 20 provided with a support means 21 capable of supporting the small component 30 in a specified position on the base part 11, and reflecting mirror means 22 to 24 having mirror surfaces at the rising angle of about 45 deg. from the upper plane 11u of the base part 11.

公开(公告)号：JP2001093128A

公开(公告)日：2001-04-06

申请号：JP25907099

申请日：1999-09-13

Applicant: IBM

Inventor： ITO KENJI ,  TSUCHIDA HIROYASU ,  YOSHIDA TATSUSHI ,  UEMATSU YOSHIO ,  ONO TETSUJI

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21

Abstract: PROBLEM TO BE SOLVED: To provide a head suspension assembly capable of joining plural wires to the connection pad part of a slider without providing an open hole window on the tip of a load beam. SOLUTION: The wires 701-704 are wound around pins 2011-2013, led from the rear end side of this suspension assembly(SA) 1000 to a tip side, wound around the pins 2021-2024 and 2031-2034 and bent. The wires 701 and 702 are adhered to the second frame 420 of a tab frame 400 and the wires 703 and 704 are adhered to the second frame 520 of the tab frame 500. The tab frames 400 and 500 are bent almost perpendicularly to the SA 1000 and also the second frames 420 and 520 are bent almost perpendicularly to first frames 410 and 510. The wires 701-704 are led to the joining position of the slider 800.

公开(公告)号：JP2001101636A

公开(公告)日：2001-04-13

申请号：JP27411399

申请日：1999-09-28

Applicant: IBM

Inventor： ITO KENJI ,  KUROSU NAOKI ,  ICHIMURA YOTARO ,  YOSHIDA TATSUSHI

IPC: G11B5/60 ,  B23K20/00 ,  B23K20/10 ,  B23K101/38 ,  G11B21/21 ,  H01L21/60 ,  H01L21/607

Abstract: PROBLEM TO BE SOLVED: To enhance reliability in the joining strength of wire bonding by reducing variance of deformation for the entirety of a wire. SOLUTION: At point P1, a bonding wedge 21 comes into contact with a wire 71, imparting a load to the wire 71. The wire 71 is deformed by a deformation quantity A, with the deformation stopping at point P2. The deformation quantity A varies greatly. At point P3 (T1), a supersonic vibration is imparted, with the deformation of the wire 71 resumed. The variance of the deformation quantity A is absorbed by a deformation quantity B, with the combined deformation quantity (A+B) reduced in variance. At point P4 (T1+T2), the deformation quantity (A+B) is kept nearly constant. At this point P4, the deformation quantity of the wire 71 is set at zero, with measurement started for the deformation quantity of the wire 71, and with the load and the supersonic vibration imparted until the deformation quantity of the wire 71 reaches a quantity C (point P5).

公开(公告)号：JPH09108853A

公开(公告)日：1997-04-28

申请号：JP26391595

申请日：1995-10-12

Applicant: IBM

Inventor： ICHIMURA YOTARO ,  TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  ITO KENJI

IPC: B23K20/10 ,  B23K26/00 ,  B23K26/066 ,  B23K26/352 ,  G11B5/17 ,  H01R4/00 ,  H01R4/02 ,  B23K26/06

Abstract: PROBLEM TO BE SOLVED: To enable bonding with few ruptures in a heal part by forming peaks and valleys at the end part and improving holding capability of a material to be bonded at the time of ultrasonic wave bonding. SOLUTION: The approximately flat end 61 of a tool made of zirconia having excellent wear resistance is irradiated with an excimer laser to form plural cross shaped grooves. Whereby, peak part 64 and valley pate 63 are regularly formed. Ultrasonic wave oscillation energy is applied to the material to be bonded being in contact with it using the ultrasonic wave bonding tool 60 having the end 61. In this case, holding capability between the tool 60 and the material to be bonded is reinforced. Plural first grooves parallel to a first axis and plural secondary grooves, which are parallel to a secondary axis having a prescribed angle with respect to first grooves and cross first grooves, are formed in the end part. By this way the ultrasonic wave bonder improving bonding strength in the heel part is obtained.

公开(公告)号：JP2001014625A

公开(公告)日：2001-01-19

申请号：JP18198999

申请日：1999-06-28

Applicant: IBM

Inventor： ITO KENJI ,  KUROSU NAOKI ,  ICHIMURA YOTARO ,  YOSHIDA TATSUSHI

IPC: G11B5/60 ,  B23K20/00 ,  G11B5/48

Abstract: PROBLEM TO BE SOLVED: To improve workability by pressing the welding part of a lead wire to an opposed welding pad and inclining the tip end surface of a wedge acting on the welding part in the direction retreating with respect to a prescribed plane of a slider. SOLUTION: A roller 113 is abutted on the longest major axis part of a cam 115, although a wedge 78 is about to move downward nearly along the X axis by gravity of a ultrasonic vibration transducer 76, since the roller 113 abuts on the cam 115 and is controlled, it is maintained in the position apart from an HG assembly 1. Although the ultrasonic vibration transducer 76 is held by a clamper arm 111, the balancer 116 for adjusting a pressurizing force of the wedge 78 to a rotary shaft 110 in the opposite side position of the ultrasonic vibration transducer 76 is disposed, and whereby the position of the balancer 116 from the rotary shaft 110 is adjusted. A wedge arm 78 at the tip end is ultrasonically vibrated along the X axial direction by a ultrasonic transmitter 117, and the turning positional information of the clamper arm 111 is measured.

公开(公告)号：JP2000315307A

公开(公告)日：2000-11-14

申请号：JP12328899

申请日：1999-04-30

Applicant: IBM

Inventor： ITO KENJI ,  MITA YASUHIRO ,  NANBA MASAAKI ,  YOSHIDA TATSUSHI

IPC: G11B5/60 ,  G11B5/48

Abstract: PROBLEM TO BE SOLVED: To lower the wire height of HGA(head gimbal assembly) and to stabilize the stationary posture of a head/slider. SOLUTION: The HGA is equipped with a head/slider 40 consisting of a slider for flying on a disk surface and a head for reading/writing data in a non-contact state for the disk surface; with four electrically conductive data- transmitting wires 61 connected to the head at one end; and with a load beam 20 which is loaded with the wires 61, which carries the head/slider 40 near the front end 24, and which is supported at the rear end 23 by an actuator. Further, in the HGA, the wires 61 are fixed on the wire loading surface 21 of the load beam 20 at the fixing point E (E1, E2) between the head connecting end H and the rear end 23, with a wire loop 610 provided between the head connecting end H and the wire fixing point E, and a distance De is shorter than the conventional one between the head connecting position Hg and the wire fixing position Eg, that is, approximately 3.8 (mm) or less.