公开(公告)号：FR2795854A1

公开(公告)日：2001-01-05

申请号：FR0006688

申请日：2000-05-25

Applicant: IBM

Inventor： INOUE HIROO ,  YOSHIDA TATSUSHI ,  TSUCHIYA TATSUMI ,  SHIMOZAWA YURIKA

IPC: G11B21/21 ,  G11B5/48 ,  G11B21/24

Abstract: The head support arm includes: - a load arm (35); - a flexion device (36) composed of a connection zone connected to the load arm and with a link zone (36A); - a cursor (37) fitted with a head at one of its ends a fixed to the link zone by an adhesive. The load arm has a part to generate a universal joint movement between the flexion device and the cursor, and a exposure zone which exposes the link zone of the flexion device connected to the end of the cursor opposite to that which supports the head. A limiter formed with the flexion device extends on a surface of the exposure zone, at the end opposite to the surface on which the flexion device is found so that the limiter is hooked to the load arm. An Independent Claim is included for a fabrication method.

公开(公告)号：FR2795854B1

公开(公告)日：2006-10-27

申请号：FR0006688

申请日：2000-05-25

Applicant: IBM

Inventor： INOUE HIROO ,  YOSHIDA TATSUSHI ,  TSUCHIYA TATSUMI ,  SHIMOZAWA YURIKA

IPC: G11B21/21 ,  G11B21/24 ,  G11B5/48

Abstract: The present invention provides a head supporting arm that allows for laser tacking while having a merging lip and limiters for loading/unloading respectively. A head supporting arm according to the present invention includes a load beam, and a flexure connecting the load beam to a slider. The load beam having a dimple for generating a gimbal motion between the flexure and the slider. The slider having a head connected to its one end. The head supporting arm of the present invention further including an exposure opening formed in the load beam. The exposure opening allowing for the exposing of the bonding portion of the flexure that is bonded to the other end of the slider. The exposure opening further providing an opening to extend the limiters formed unitarily with the flexure 36 onto a surface of the load beam that is opposite to the surface on which the flexure 36 is provided. The extended limiters are hooked to the load beam at the opposite surface.

公开(公告)号：JP2003007015A

公开(公告)日：2003-01-10

申请号：JP2001189596

申请日：2001-06-22

Applicant: Fujikura Ltd ,  Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーション ,  株式会社フジクラ

Inventor： NAGATA MASAKATSU ,  IWASAKI SHOJI ,  MIZUTANI MUNEKIMI ,  NASU YOSHIO ,  ISHIKAWA HIROMI ,  UEMATSU YOSHIO ,  SHI ARASHI ,  YOSHIDA TATSUSHI

IPC: G11B21/21

Abstract: PROBLEM TO BE SOLVED: To improve manufacturing efficiency and to reduce costs for a product compared with a conventional manufacturing method, etc., using only a dry etching process typified by plasma etching for molding a second layer in a method for manufacturing a laminated structure for a disk driving suspension assembly using a multilayer sheet having a first layer made of metallic spring material, the second layer in between consisting of electric insulation material and a third layer consisting of conductive material.
SOLUTION: The method for manufacturing the laminated structure for the disk driving suspension assembly and the laminated structure uses the multilayer sheet having the first layer 50 made of the metallic spring material, the second layer 90 in between consisting of the electric insulation material and the third layer 70 consisting of the conductive material and uses only the wet etching process as the molding process of the second layer 90.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：与传统的制造方法等相比，为了提高制造效率和降低成本，仅使用以等离子体蚀刻为代表的用于模制第二层的干蚀刻工艺，用于制造层压结构的方法 一种使用具有由金属弹簧材料制成的第一层的多层片材的盘驱动悬架组件，其中的第二层由电绝缘材料和由导电材料组成的第三层组成。 解决方案：用于制造盘驱动悬架组件和层压结构的层压结构的方法使用具有由金属弹簧材料制成的第一层50的多层片材，其中第二层90由电绝缘材料和第三层 层70由导电材料组成，并且仅使用湿蚀刻工艺作为第二层90的模制工艺。

公开(公告)号：JP2002015536A

公开(公告)日：2002-01-18

申请号：JP2001158467

申请日：2001-05-28

Applicant: IBM

Inventor： TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  FUJII NAOKI ,  SUZUKI NAOKI ,  MATSUMOTO YUSUKE ,  SURUYA PATANAIKU ,  WILLIAM A CHILDERS ,  O'REGAN DIANE SPRANDEL

IPC: G11B21/21 ,  G11B5/48

Abstract: PROBLEM TO BE SOLVED: To solve the problem that conventionally it is difficult to improve the efficiency of operation and the efficiency of internal space in a high-temperature vessel, because it is necessary to keep a joined state between a slider of hard disk device(HDD) and a suspension which supports the slider, by using a joining jig until epoxy adhesive is hardened through heat treatment, when the slider and the suspension are adhered by the epoxy adhesive of low elasticity, and, the operation is performed in the state of being set by the joining jig, even when both are moved during operational processes or are heat treated in the high-temperature vessel. SOLUTION: One part of a joint part, of the slider and the suspension which are joined with an epoxy adhesive of low elasticity interposed in between, is heated by a laser beam and is temporally tacked by partially hardening the adhesive. In addition, in order to determine the output and the irradiation time of the laser beam beforehand, the value of resistance of a head which is disposed on the slider is measured, and the temperature is monitored. The output and the irradiation time, which permits the desired temporal tacking strength within a range, where the measured temperature does not exceeds the prescribed temperature, are determined.

公开(公告)号：JP2004039056A

公开(公告)日：2004-02-05

申请号：JP2002192542

申请日：2002-07-01

Applicant: Fujikura Ltd ,  Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation ,  株式会社フジクラ

Inventor： NASU YOSHIO ,  NAKAO SATORU ,  NAGATA MASAKATSU ,  OKAMOTO MASAHIRO ,  IWASAKI SHOJI ,  MIZUTANI MUNEKIMI ,  ITO SHOJI ,  PONPANPAANII ANAN ,  ISHIKAWA HIROMI ,  UEMATSU YOSHIO ,  SHI ARASHI ,  YOSHIDA TATSUSHI

IPC: G11B5/60 ,  G11B21/21 ,  H05K1/02 ,  H05K3/00 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To prevent peeling or separation of a polyimide insulating material caused by the pie-doughy irregularities during the wet etching of the polyimide insulating material in a circuit integrated suspension and a flexible circuit board.
SOLUTION: The vicinity of a pie-doughy irregular part formed when a polyimide insulating material is patterned by wet etching is covered with thermosetting resin, photosetting resin or a precursor thereof.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2002343045A

公开(公告)日：2002-11-29

申请号：JP2001149952

申请日：2001-05-18

Applicant: FUJIKURA LTD ,  IBM

Inventor： NAGATA MASAKATSU ,  IWASAKI SHOJI ,  MIZUTANI MUNEKIMI ,  NASU YOSHIO ,  ISHIKAWA HIROMI ,  UEMATSU YOSHIO ,  SHI ARASHI ,  YOSHIDA TATSUSHI

IPC: G11B21/21

Abstract: PROBLEM TO BE SOLVED: To provide a technique capable of making manufacturing efficiency higher and a product cost lower than the conventional production process, etc., utilizing only the dry etching process represented by plasma etching in molding an intermediate second layer consisting of an electrically insulating material in a method of manufacturing a laminated structure for a disk driving suspension assembly using a multilayered lamination sheet having a first layer consisting of a metallic spring material, the second layer described above and a third layer consisting of a conductive material. SOLUTION: The method of manufacturing the laminated structure for the disk driving suspension assembly comprising using the multilayered lamination sheet having the first layer 50 consisting of the metallic spring material, the intermediate second layer 90 consisting of the electrical insulating material and the third layer 70 consisting of the conductive material and performing the dry etching process after wet etching as a process step of molding the second layer 90 and the laminated structure thereof are provided.

公开(公告)号：JP2001014625A

公开(公告)日：2001-01-19

申请号：JP18198999

申请日：1999-06-28

Applicant: IBM

Inventor： ITO KENJI ,  KUROSU NAOKI ,  ICHIMURA YOTARO ,  YOSHIDA TATSUSHI

IPC: G11B5/60 ,  B23K20/00 ,  G11B5/48

Abstract: PROBLEM TO BE SOLVED: To improve workability by pressing the welding part of a lead wire to an opposed welding pad and inclining the tip end surface of a wedge acting on the welding part in the direction retreating with respect to a prescribed plane of a slider. SOLUTION: A roller 113 is abutted on the longest major axis part of a cam 115, although a wedge 78 is about to move downward nearly along the X axis by gravity of a ultrasonic vibration transducer 76, since the roller 113 abuts on the cam 115 and is controlled, it is maintained in the position apart from an HG assembly 1. Although the ultrasonic vibration transducer 76 is held by a clamper arm 111, the balancer 116 for adjusting a pressurizing force of the wedge 78 to a rotary shaft 110 in the opposite side position of the ultrasonic vibration transducer 76 is disposed, and whereby the position of the balancer 116 from the rotary shaft 110 is adjusted. A wedge arm 78 at the tip end is ultrasonically vibrated along the X axial direction by a ultrasonic transmitter 117, and the turning positional information of the clamper arm 111 is measured.

公开(公告)号：JP2000315307A

公开(公告)日：2000-11-14

申请号：JP12328899

申请日：1999-04-30

Applicant: IBM

Inventor： ITO KENJI ,  MITA YASUHIRO ,  NANBA MASAAKI ,  YOSHIDA TATSUSHI

IPC: G11B5/60 ,  G11B5/48

Abstract: PROBLEM TO BE SOLVED: To lower the wire height of HGA(head gimbal assembly) and to stabilize the stationary posture of a head/slider. SOLUTION: The HGA is equipped with a head/slider 40 consisting of a slider for flying on a disk surface and a head for reading/writing data in a non-contact state for the disk surface; with four electrically conductive data- transmitting wires 61 connected to the head at one end; and with a load beam 20 which is loaded with the wires 61, which carries the head/slider 40 near the front end 24, and which is supported at the rear end 23 by an actuator. Further, in the HGA, the wires 61 are fixed on the wire loading surface 21 of the load beam 20 at the fixing point E (E1, E2) between the head connecting end H and the rear end 23, with a wire loop 610 provided between the head connecting end H and the wire fixing point E, and a distance De is shorter than the conventional one between the head connecting position Hg and the wire fixing position Eg, that is, approximately 3.8 (mm) or less.

公开(公告)号：JP2002170351A

公开(公告)日：2002-06-14

申请号：JP2000355838

申请日：2000-11-22

Applicant: IBM

Inventor： KIDACHI TAKAO ,  TOMIYAMA TADAAKI ,  UEMATSU YOSHIO ,  ISHIKAWA HIROMI ,  YOSHIDA TATSUSHI ,  YOKOME HIROYOSHI ,  NAKAMURA YUKIHIRO ,  OYAMA HIROSHI ,  TSUCHIYA TATSUMI

IPC: G11B21/21 ,  G11B5/48 ,  G11B21/20

Abstract: PROBLEM TO BE SOLVED: To solve the problems, such as the degradation in working space efficiency and a cost increase by as much as the need for assembly jigs (holders and fixtures, etc.), as trays or blocks move as a pair at all times while unfinished HG assemblies move between respective manufacturing process steps in assembling the HG assemblies which are components of hard disk devices and consequently the assembly jigs are needed by as much as the number of the unfinished HG assemblies existing in at least the respective assembly process steps. SOLUTION: Base plates, load beams, etc., which are lamination members constituting the HG assemblies are respectively formed of run constitution. The base late runs 3 and the load beam runs 4 are conveyed in the laminated run state by the conveyance equipment 2 and are subjected in the run state to necessary assembly process steps, such as adhesion of the respective layers, fitting of sliders, electrical connection of terminals and the like.

公开(公告)号：JP2002025025A

公开(公告)日：2002-01-25

申请号：JP2000189148

申请日：2000-06-23

Applicant: IBM

Inventor： TSUCHIYA TATSUMI ,  YOSHIDA TATSUSHI ,  SATO TAKUYA ,  SURUYA PATANAIKU

IPC: B23K1/00 ,  B23K1/005 ,  B23K3/00 ,  B23K3/06 ,  B23K31/02 ,  B23K101/38 ,  G11B5/17 ,  G11B5/60 ,  G11B21/21 ,  H01R43/02 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To solve the problem that laser irradiation efficiency, maintenance, work efficiency of a conventional solder ball joining device due to spatial restriction, difficulty in the weight reduction and fixed work procedure, etc., involved in the device which joins the slider bonding pad of a head gimbals assembly and the leading pad of a lead wire to each other by a solder ball, and carries out (1) the supplying of the solder ball, (2) the positioning of the solder ball, (3) the spraying of nitrogen gas N2, and (4) the dissolving of the solder ball by laser irradiation, by only one device. SOLUTION: This solder ball joining device is provided with a solder ball holding device 1, and optical device 4, these being separately installed, and a suction pad 3, solder balls 135 held in the soldering ball holding holes of the soldering ball holding device 1 are conveyed to the connection part of the head gimbals assembly by the suction pad 3, and solder is caused to reflow by the optical device 4.