公开(公告)号：EP1883961A4

公开(公告)日：2012-12-05

申请号：EP06759690

申请日：2006-05-12

Applicant: IBM

Inventor： CASEY JON A ,  BERGER MICHAEL ,  BUCHWALTER LEENA P ,  CANAPERI DONALD F ,  HORTON RAYMOND R ,  JAIN ANURAG ,  PERFECTO ERIC D ,  TORNELLO JAMES A

IPC: H01L23/14 ,  H01L21/48 ,  H01L21/768 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/147 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：WO2006124607A3

公开(公告)日：2007-04-12

申请号：PCT/US2006018458

申请日：2006-05-12

Applicant: IBM ,  CASEY JON A ,  BERGER MICHAEL ,  BUCHWALTER LEENA P ,  CANAPERI DONALD F ,  HORTON RAYMOND R ,  JAIN ANURAG ,  PERFECTO ERIC D ,  TORNELLO JAMES A

Inventor： CASEY JON A ,  BERGER MICHAEL ,  BUCHWALTER LEENA P ,  CANAPERI DONALD F ,  HORTON RAYMOND R ,  JAIN ANURAG ,  PERFECTO ERIC D ,  TORNELLO JAMES A

IPC: H01L23/22 ,  H01L23/04 ,  H01L23/14 ,  H01L23/24

CPC classification number: H01L23/147 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via (100) at an elevated temperature, A supply chamber (630) is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.

Abstract translation: 使用无粘性，低粘度，高温稳定的聚合物或低粘度的高固含量聚合物溶液密封通孔，其中聚合物材料在高温下浸渍在通孔（100）内，引入供应室（630） 以在升高的温度下施用聚合物材料，通常在高至足以液化聚合物材料的温度下。 聚合物材料通过来自泵，活塞或保持在所述供应室内的真空的力的加热供应管线引入。