公开(公告)号：GB2501853A

公开(公告)日：2013-11-06

申请号：GB201314831

申请日：2012-01-16

Applicant: IBM

Inventor： LACROIX LUKE D ,  LAMOREY MARK C H ,  OAKLAND STEVEN F ,  PATEL JANAK G ,  PFARR KERRY P ,  SLOTA PETER ,  STONE DAVID B

IPC: G01R31/02 ,  G01R31/28

Abstract: Detection circuits, methods of use and manufacture and design structures are provided herein. The structure (25) includes at least one signal line (30) traversing one or more metal layers (20) of an integrated circuit. Circuitry (35) is coupled to the at least one signal line, which is structured to receive a signal with a known signal value (VDD) from the at least one signal line or a signal from a different potential (GND) and, based on which signal is received; determine whether there is a structural defect in the integrated circuit.