公开(公告)号：JPH04327993A

公开(公告)日：1992-11-17

申请号：JP33464891

申请日：1991-12-18

Applicant: IBM

Inventor： FUADO IRAIASU DOUNII ,  GEERII UIRIAMU GURUUBU ,  RAABII SARAFU

IPC: B41N1/24 ,  B41C1/055 ,  B41M1/12 ,  G03F1/00 ,  G03F7/12 ,  H01L21/308 ,  H01L21/48 ,  H01L23/12 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/12

Abstract: PURPOSE: To provide a dry method for forming a pattern on a substrate. CONSTITUTION: The drying method comprises the steps of coating an unzippable polymer film with a small amount of desirable UV if required on a substrate, laser ablating the film into a desired pattern or mask, screening a conductive or resistive paste onto the substrate through the ablated features of the mask, heating the substrate and mask to the unzipping temperature of the mask, and vaporizing the mask and UV absorbing dye if present leaving behind the solid of the conductive or resistive paste adhered to the substrate in the desired pattern.

公开(公告)号：JPH05178999A

公开(公告)日：1993-07-20

申请号：JP28959591

申请日：1991-11-06

Applicant: IBM

Inventor： KURAUDEIUSU FUEEGAA ,  RODONII TOREBAA HOJISON ,  DEIBITSUDO ANDORUU RUISU ,  RAABII SARAFU

IPC: C08G59/18 ,  B01D71/64 ,  B32B27/00 ,  C08G8/00 ,  C08G8/06 ,  C08G18/70 ,  C08G18/80 ,  C08G85/00 ,  C08J5/00 ,  C08J5/18 ,  C08L75/00 ,  C08L75/04 ,  C08L79/08 ,  C08L101/00 ,  D01F6/94

公开(公告)号：JPH04228288A

公开(公告)日：1992-08-18

申请号：JP5566791

申请日：1991-02-28

Applicant: IBM

Inventor： UU-SON HOWAN ,  IIGORU YAN KAANDOROSU ,  RAABII SARAFU ,  RIIZEN SHII

IPC: B23K35/22 ,  B23K35/26 ,  B23K35/36 ,  B23K35/363 ,  B23K101/36 ,  C08K3/08 ,  H05K3/32 ,  H05K3/34

Abstract: PURPOSE: To provide the meltable alloy powder/polymer composite paste which is prepared by reinforcing the metal alloy powder with a polymer and partially fusing to form an electroconductive solder connection of an interconnected network structure. CONSTITUTION: A thermoplastic polymer, which has a softening temp. equal to or lower than the reflow temp. and is stable at the reflow temp., is dissolved in a volatile organic solvent having a boiling point which is higher than the melting point of the alloy powder filler and is lower than the reflow temp of the composition. A transient fluxing agent is used as a metal-oxide reducing agent having a boiling point higher than the melting point of the alloy powder filler and lower than the reflow temp. Reflow of the paste is carried out in substantial absence of the fluxing agent and the solvent. The electroconductive solder connection of the interconnected network structure is formed by reinforcing the metal alloy powder with the polymer and partially fusing. By this method, the paste free from expensive noble metal fillers or harmful lead metal filler can be prepared.