公开(公告)号：JPH09181125A

公开(公告)日：1997-07-11

申请号：JP29996296

申请日：1996-11-12

Applicant: IBM

Inventor： PANAYOTEISU KONSUTANTEINUU AND ,  MADABU DATSUTA ,  HARIKURIA DERIJIYANNI ,  UIRUMA JIYAN HOOKANZU ,  SUN KUON KAN ,  KIISU TOMASU KUFUIETONIYAKU ,  GANGADAARA SUWAMI MATADO ,  SANPASU PURUSHIYOTAMAN ,  RIIZEN SHII ,  TON HOO MIN

IPC: B23K35/26 ,  B23K35/00 ,  B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  H01L21/60 ,  H01L23/485 ,  H01L21/321

Abstract: PROBLEM TO BE SOLVED: To provide a connecting structure suitable for connecting a very small electronic circuit chip with a package. SOLUTION: This mutual connecting structure contains the following in order; an adhesion/barrier layer stuck on a passivated board (e.g. silicon wafer), an adhesion layer which is arbitrarily selected and added, a layer to which metal selected out of a group composed of Ni, Co, Fe, NiFe, NiCo, CoFe, NiCoFe can be soldered, and a leadless solder ball which contains a kind or a plurality of kinds of alloy elements selected out of tin, Bi, Ag and Sb which are main components and a kind or a plurality of kinds of elements arbitrarily selected out of a group composed of Zn, In, Ni, Co and Cu.

公开(公告)号：JPH04228288A

公开(公告)日：1992-08-18

申请号：JP5566791

申请日：1991-02-28

Applicant: IBM

Inventor： UU-SON HOWAN ,  IIGORU YAN KAANDOROSU ,  RAABII SARAFU ,  RIIZEN SHII

IPC: B23K35/22 ,  B23K35/26 ,  B23K35/36 ,  B23K35/363 ,  B23K101/36 ,  C08K3/08 ,  H05K3/32 ,  H05K3/34

Abstract: PURPOSE: To provide the meltable alloy powder/polymer composite paste which is prepared by reinforcing the metal alloy powder with a polymer and partially fusing to form an electroconductive solder connection of an interconnected network structure. CONSTITUTION: A thermoplastic polymer, which has a softening temp. equal to or lower than the reflow temp. and is stable at the reflow temp., is dissolved in a volatile organic solvent having a boiling point which is higher than the melting point of the alloy powder filler and is lower than the reflow temp of the composition. A transient fluxing agent is used as a metal-oxide reducing agent having a boiling point higher than the melting point of the alloy powder filler and lower than the reflow temp. Reflow of the paste is carried out in substantial absence of the fluxing agent and the solvent. The electroconductive solder connection of the interconnected network structure is formed by reinforcing the metal alloy powder with the polymer and partially fusing. By this method, the paste free from expensive noble metal fillers or harmful lead metal filler can be prepared.