公开(公告)号：JPH06298934A

公开(公告)日：1994-10-25

申请号：JP24968992

申请日：1992-09-18

Applicant: IBM

Inventor： MARII ANJIEROPUROSU ,  KURAUDEIUSU FUEEGAA ,  JIEFURII DONARUDO JIEROOMU ,  JIEEN MAAGARETSUTO SHIYOU

IPC: C08G73/10 ,  G03F7/004 ,  G03F7/038

公开(公告)号：JPH05178999A

公开(公告)日：1993-07-20

申请号：JP28959591

申请日：1991-11-06

Applicant: IBM

Inventor： KURAUDEIUSU FUEEGAA ,  RODONII TOREBAA HOJISON ,  DEIBITSUDO ANDORUU RUISU ,  RAABII SARAFU

IPC: C08G59/18 ,  B01D71/64 ,  B32B27/00 ,  C08G8/00 ,  C08G8/06 ,  C08G18/70 ,  C08G18/80 ,  C08G85/00 ,  C08J5/00 ,  C08J5/18 ,  C08L75/00 ,  C08L75/04 ,  C08L79/08 ,  C08L101/00 ,  D01F6/94

公开(公告)号：JPH0248666A

公开(公告)日：1990-02-19

申请号：JP14856189

申请日：1989-06-13

Applicant: IBM

Inventor： SUTEIIBUN RINTSU BAADO ,  KURAUDEIUSU FUEEGAA ,  JIYON JIYOSEFU GURENINGU ,  GARESU JIEFURII HOKAMU ,  SUTEIIBUN AARU MORISU ,  UOORUTAA POORU PAUROUSUKII ,  JIYON JIEIMUZU RITSUKO ,  PIITAA SUROUTA JIYUNIA ,  RANDEI UIRIAMU SUNAIDAA

IPC: G03F7/26 ,  C08J7/12 ,  G03F7/40 ,  H01L21/306 ,  H01L21/311 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10

Abstract: PURPOSE: To unnecessitate the use of dangerous or explosive chemicals in etching a polyimide layer by bringing the layer into successive contact with an aq. soln., an acid and a soln. CONSTITUTION: A satisfactorily or practically satisfactorily cured polyimide layer is brought into successive contact with an aq. metal. hydroxide soln., an acid and a metal hydroxide soln. The transfer of chemicals from one bath to other bath by which the service life of the baths is shortened by neutralization is suppressed and slight washing can be carried out.