公开(公告)号：JPH05163467A

公开(公告)日：1993-06-29

申请号：JP28959691

申请日：1991-11-06

Applicant: IBM

Inventor： CHIYAARUZU ROBAATO DEIBISU ,  ASHITO AABINDO MEETA ,  KONSUTANTEINOSU PAPATOMASU ,  RII POORU SUPURINGAA ,  UIRIAMU JIYOZEFU SUMA ,  DEIBITSUDO UEI WAN

IPC: C09J7/02 ,  C09J163/00 ,  C09J163/02 ,  C09J179/00 ,  C09J179/04 ,  H01L23/12 ,  H01L23/14 ,  H05K3/38 ,  H05K3/46

公开(公告)号：JPH0685107A

公开(公告)日：1994-03-25

申请号：JP225993

申请日：1993-01-11

Applicant: IBM

Inventor： ASHITO AABUINDO MEFUTA ,  TEIYAN MIN NIU ,  RII POORU SUPURINGAA ,  UIRIAMU JIYOOZEFU SAMA ,  RII PARUFURII WAIRUDEINGU

IPC: C08L27/12 ,  C08L79/04 ,  H01L21/48 ,  H01L23/14 ,  H05K1/03

Abstract: PURPOSE: To provide a polytriazine dielectric composite material, which has a low dielectric constant and is superior in procesability, and a microelectronic circuit package with this composite material incorporated therein. CONSTITUTION: A thermoplastic resin filler is made to disperse in a polytriazine dielectric composite material and, while the dielectric constant of the composite material is held low, the brittleness of a triazine polymer is decreased and the ductility of the polymer is increased. This triazine polymer is used as a substrate to obtain a multilayered printed circuit card.