公开(公告)号：JPH0613495A

公开(公告)日：1994-01-21

申请号：JP25563591

申请日：1991-10-03

Applicant: IBM

Inventor： RORENSU MAAKU BURAUN ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  CHIYAARUZU ROBAATO DEIBISU ,  RIISA JIYANIIN HIMAARESU ,  ASHITO AABINDO MEETA ,  YUUJIIN ROOMAN SUKARUBINKO

IPC: C08L27/12 ,  C08L79/08 ,  H01L23/08 ,  H01L23/14 ,  H05K1/03 ,  H05K3/00

Abstract: PURPOSE: To provide perfluoro carbon composition of a polymer having thermal stability at the temperature at the laser processing and printed-circuit-board manufacturing at 308 nanometers. CONSTITUTION: This polymer composition has a main amount of perfluoro carbon composition, which is substantially transparent to ultraviolet rays, and a second polymer such as polyimide, which is thermally stable for imparting ultraviolet-ray processing. This is the manufacturing method for providing a forming method of the polymer composition, a through-hole for the polymer composition and the printed circuit board, including the laser removal of a via.

公开(公告)号：JPH05197147A

公开(公告)日：1993-08-06

申请号：JP16475691

申请日：1991-07-05

Applicant: IBM

Inventor： BOYA RISUTA MARUKOBITSUKU ,  ASHITO AABINDO MEETA ,  YUUJIIN ROOMAN SUKARUBINKO ,  DEIBITSUDO UEI WAN

IPC: G03F7/004 ,  G03F7/023 ,  G03F7/029 ,  G03F7/038 ,  G03F7/30 ,  H01L21/027 ,  H01L21/30 ,  H05K3/06 ,  H05K3/28 ,  H05K3/34

Abstract: PURPOSE: To lower a heat expansion coefficient and to enhance resistance to high temperature and photopatternability characteristics and the like by using the composition comprising a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. CONSTITUTION: The photopatternable composition comprises the cationically polymerizable epoxy resin, the solvent material and the photosensitive cationic photoiniciator mixed with the optically transparent ceramic filler and it is thermally stable at 360 deg.C. This composition is polymerized by exposure to ultraviolet rays. The unexposed areas of the composition are not polymerized by selectively shielding the composition from ultraviolet rays with a pattern or stencil, and these nonpolymerized areas are dissolved in a proper solvent and removed, and the remaining developed areas are hardened to a sufficient cross-linking degree and made resistant enough to exposure at 360 deg.C and to be made a tough protective coat having a heat expansion coefficient similar to solder.

公开(公告)号：JPH05163467A

公开(公告)日：1993-06-29

申请号：JP28959691

申请日：1991-11-06

Applicant: IBM

Inventor： CHIYAARUZU ROBAATO DEIBISU ,  ASHITO AABINDO MEETA ,  KONSUTANTEINOSU PAPATOMASU ,  RII POORU SUPURINGAA ,  UIRIAMU JIYOZEFU SUMA ,  DEIBITSUDO UEI WAN

IPC: C09J7/02 ,  C09J163/00 ,  C09J163/02 ,  C09J179/00 ,  C09J179/04 ,  H01L23/12 ,  H01L23/14 ,  H05K3/38 ,  H05K3/46