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公开(公告)号:GB2581742A
公开(公告)日:2020-08-26
申请号:GB202007216
申请日:2018-11-02
Applicant: IBM
Inventor: HARIKLIA DELIGIANNI , NING LI , KO-TAO LEE , DEVENDRA SADANA , ROY YU
IPC: A61B5/00
Abstract: Technical solutions are described for implementing an optogenetics treatment using a probe and probe controller are described. A probe controller controls a probe to perform the method that includes emitting, by a light source of the probe, the probe is embeddable in a tissue, a light wave to interact with a corresponding chemical in one or more cells in the tissue. The method further includes capturing, by a sensor of the probe, a spectroscopy of the light wave interacting with the corresponding chemical. The method further includes sending, by the probe, the spectroscopy to an analysis system. The method further includes receiving, by the probe, from the analysis system, adjusted parameters for the light source, and adjusting, by a controller of the probe, settings of the light source according to the received adjusted parameters to emit a different light wave to interact with the corresponding chemical.
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2.
公开(公告)号:SG100759A1
公开(公告)日:2003-12-26
申请号:SG200105944
申请日:2001-09-19
Applicant: IBM
Inventor: H BERNHARD POGGE , CHANDRIKA PRASAD , ROY YU
IPC: H01L21/68 , H01L21/98 , H01L23/538
Abstract: A semiconductor device structure including fine-pitch connections between chips is fabricated using stud/via matching structures. The stud and via are aligned and connected, thereby permitting fine-pitch chip placement and electrical interconnections. A chip support is then attached to the device. A temporary chip alignment structure includes a transparent plate exposed to ablating radiation; the plate is then detached and removed. This method permits interconnection of multiple chips (generally with different sizes, architectures and functions) at close proximity and with very high wiring density. The device may include passive components located on separate chips, so that the device includes chips with and without active devices.
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