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公开(公告)号:AU6334773A
公开(公告)日:1975-06-12
申请号:AU6334773
申请日:1973-12-06
Applicant: IBM
Inventor: SEDGWICK THOMAS OLIVER , KAZAN BENJAMIN
IPC: H05B33/14 , G09F13/22 , H01J29/10 , H01J29/14 , H01J31/08 , H01J31/12 , H01L31/14 , H05B33/12 , H01J31/18 , G09F13/20
Abstract: Improved image storage and display devices of the type which includes a layer of phosphor material which is stimulated to emit light through photoluminescence. The intensity of emitted light is varied by applying an electric field to the phosphor layer. The field may be applied to the phosphor layer by sandwiching the layer between a layer of insulating material and a layer of electrically conductive material and subjecting the insulator to an electron beam. To alter the field strength at selected locations a writing electron beam is focussed on the insulator at these selected locations. In the alternative, the phosphor layer may be covered on one surface with insulation materials forming a charge trap and the phosphor and insulation layers sandwiched between sets of orthognal electrically conductive strips. Selective field alteration is accomplished by X-Y addressing an orthognal pair of conductive strips.
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公开(公告)号:DE3686453T2
公开(公告)日:1993-03-18
申请号:DE3686453
申请日:1986-05-16
Applicant: IBM
Inventor: ABERNATHEY JOHN ROBERT , LASKY JEROME BRETT , NESBIT LARRY ALAN , SEDGWICK THOMAS OLIVER , STIFFLER SCOTT RICHARD
IPC: H01L21/02 , H01L21/20 , H01L21/265 , H01L21/316 , H01L21/84 , H01L27/12 , H01L21/205 , H01L21/18 , H01L21/306
Abstract: A method of forming a thin silicon layer (12A) upon which semiconductor devices may be constructed. An epitaxial layer (12A, 12B) is grown on a silicon substrate (10), and oxygen or nitrogen ions are implanted into the epitaxial layer in order to form a buried etch-stop layer (14) therein. An oxide layer (16A) is grown on the epitaxial layer, and is used to form a bond to a mechanical support wafer (100). The silicon substrate (10) is removed using grinding and/or HNA, the upper portions (12B) of the epitaxy are removed using EDP, EPP or KOH, and the etch-stop (14) is removed using a non-selective etch. The remaining portion of the epitaxy (12A) forms the thin silicon layer. Due to the uniformity of the implanted ions, the thin silicon layer has a very uniform thickness.
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公开(公告)号:DE3686453D1
公开(公告)日:1992-09-24
申请号:DE3686453
申请日:1986-05-16
Applicant: IBM
Inventor: ABERNATHEY JOHN ROBERT , LASKY JEROME BRETT , NESBIT LARRY ALAN , SEDGWICK THOMAS OLIVER , STIFFLER SCOTT RICHARD
IPC: H01L21/02 , H01L21/20 , H01L21/265 , H01L21/316 , H01L21/84 , H01L27/12 , H01L21/205 , H01L21/18 , H01L21/306
Abstract: A method of forming a thin silicon layer (12A) upon which semiconductor devices may be constructed. An epitaxial layer (12A, 12B) is grown on a silicon substrate (10), and oxygen or nitrogen ions are implanted into the epitaxial layer in order to form a buried etch-stop layer (14) therein. An oxide layer (16A) is grown on the epitaxial layer, and is used to form a bond to a mechanical support wafer (100). The silicon substrate (10) is removed using grinding and/or HNA, the upper portions (12B) of the epitaxy are removed using EDP, EPP or KOH, and the etch-stop (14) is removed using a non-selective etch. The remaining portion of the epitaxy (12A) forms the thin silicon layer. Due to the uniformity of the implanted ions, the thin silicon layer has a very uniform thickness.
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公开(公告)号:DE2405830A1
公开(公告)日:1974-09-26
申请号:DE2405830
申请日:1974-02-07
Applicant: IBM
Inventor: COWHER MELVYN EUGENE , SEDGWICK THOMAS OLIVER
Abstract: A charge controlled viewing storage tube uses an insulating film to store charge and a field-effect layer adjacent a phosphor layer for its switching function. Such field-effect layer is now made easier to fabricate in large areas by making it in the form of tiny flakes that are sprinkled onto a phosphor during the latter's curing stage.
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公开(公告)号:DE3166902D1
公开(公告)日:1984-12-06
申请号:DE3166902
申请日:1981-03-31
Applicant: IBM
Inventor: HODGSON RODNEY TREVOR , PETTIT GEORGE DAVID , SEDGWICK THOMAS OLIVER , WOODALL JERRY MCPHERSON
IPC: H01L21/324 , H01L21/314 , H01L21/428 , H01L23/29 , H01L23/31 , H01L23/28
Abstract: A group II-VI compound semiconductor (16) is used as a surface passivator to control recombination of charge carriers at the surface of a group III-V compound semiconductor (12, 14) by a localized heating step. Control of the recombination of the charge carriers is achieved by chemical reaction of the II-VI compound with excess group V element. In particular, a capping layer (16) of laser annealed ZnS is used for passivating a GaAs device (12, 14).
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公开(公告)号:DE2227342A1
公开(公告)日:1973-01-18
申请号:DE2227342
申请日:1972-06-06
Applicant: IBM
Inventor: BROERS ALEX NIGEL , SEDGWICK THOMAS OLIVER
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