公开(公告)号：SG63843A1

公开(公告)日：1999-03-30

申请号：SG1998000886

申请日：1998-04-28

Applicant: IBM

Inventor： EDWARDS DAVID LINN ,  CAMMARANO ARMANDO SALVATORE ,  COFFIN JEFFERY THOMAS ,  COURTNEY MARK GERARD ,  DROFITZ STEPHEN S JR ,  ELLSWORTH MICHAEL JOSEPH JR ,  GOLDMANN LEWIS SIGMUND ,  IRUVANTI SUSHUMNA ,  SABLINSKI WILLIAM EDWARD ,  SHERIE RAED A ,  TOY HILTON T ,  POMPEO FRANK LOUIS

IPC: B23K35/14 ,  B23K35/26 ,  H01L21/50 ,  H01L21/60 ,  H01L23/02 ,  H01L23/10 ,  H05K3/34

Abstract: A scheme of providing a seal band for semi-conductor substrates and chip carriers encompasses a structure and a method that uses a multi-layer metallic seal (23) to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability. hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core (43), and lower melting point thin interconnecting solder layers (41.45). where the thin interconnecting solder layers may have similar or different melting points.