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公开(公告)号：JP2005325348A
公开(公告)日：2005-11-24
申请号：JP2005119145
申请日：2005-04-18
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： SACHDEV KRISHNA G , BERGER DANIEL G , CHIOUJONES KELLY M , DAVES GLENN G , TOY HILTON T
IPC: C09D9/00 , C08K3/08 , C09J9/02 , C09J11/04 , C09J163/00 , C09J183/06 , H01B1/00 , H01B1/22 , H01B1/24 , H01L23/373 , H01L23/42 , H01L23/433 , H05K3/32
CPC classification number: H01L24/32 , C08K3/08 , H01L23/3737 , H01L23/42 , H01L23/433 , H01L2224/16225 , H01L2224/29111 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011 , H05K3/321 , Y10T428/31515 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a conductive adhesive composition so as to be capable of reuse of parts. SOLUTION: An epoxy based conductive adhesive contains conductive metal filler particles dispersed in a solventless hybrid epoxy polymer matrix and its production method are given. In an additional embodiment, an improved removal method of the cured conductive polymer adhesive disclosed as a thermal interface material from electronic parts for reuse or recovery of reusable parts such as an expensive semiconductor element, a heat sink and other module parts is provided. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：提供导电粘合剂组合物以便能够重新使用部件。 解决方案：环氧基导电粘合剂包含分散在无溶剂混合环氧聚合物基质中的导电金属填料颗粒，并给出其制备方法。 在另外的实施方案中，提供了一种改进的固化的导电聚合物粘合剂的去除方法，其被公开为用于重新使用或回收诸如昂贵的半导体元件，散热器和其它模块部件的可重复使用部件的电子部件的热界面材料。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JPH113952A
公开(公告)日：1999-01-06
申请号：JP10075098
申请日：1998-04-13
Applicant: IBM
Inventor： EDWARDS DAVID LINN , CAMMARANO ARMANDO SALVATORE , COFFIN JEFFREY THOMAS , COURTNEY MARK GERARD , DROFITZ STEPHEN S JR , ELLSWORTH MICHAEL JOSEPH JR , GOLDMANN LEWIS SIGMUND , IRUVANTI SUSHUMNA , POMPEO FRANK L , SABLINSKI WILLIAM EDWARD , SHERIF RAED A , TOY HILTON T
Abstract: PROBLEM TO BE SOLVED: To enable a solder sealed band to apply to an inequality with a large expansion between a cover and a substrate by a method wherein the solder sealed band is formed, by laminating first and second solder interconnect layers and a high-melting point solder core holding the solder core between the first and the second solder interconnect layers. SOLUTION: A solder sealed band is formed into a structure, wherein a first solder interconnect layer 41 is provided on the surface on one side of the surfaces of a high-melting point solder core 43 and at the same time, a second solder interconnect layer 45 is provided on the other surface of the core 43 to make lower the melting point of the layer 41 than that of the layer 45, and, moreover, the melting points of the layers 41 and 45 are made lower than that of the core 43. As a result, the band can apply to an inequality with a large expansion between a cover 20 under use and a substrate 10, it becomes possible to maintain the reliability of a hermetic sealing of the band, and the reprocessable degree of the band and the thermal performance of a package can be modified.
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公开(公告)号：JP2009293039A
公开(公告)日：2009-12-17
申请号：JP2009206565
申请日：2009-09-08
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： SACHDEV KRISHNA G , BERGER DANIEL G , CHIOUJONES KELLY M , DAVES GLENN G , TOY HILTON T
IPC: C09D9/00 , C09J5/00 , C08K3/08 , C09J9/02 , C09J11/04 , C09J163/00 , C09J183/06 , H01B1/00 , H01B1/22 , H01B1/24 , H01L21/56 , H01L23/373 , H01L23/42 , H01L23/433 , H05K3/32
CPC classification number: H01L24/32 , C08K3/08 , H01L23/3737 , H01L23/42 , H01L23/433 , H01L2224/16225 , H01L2224/29111 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15787 , H01L2924/16152 , H01L2924/3011 , H05K3/321 , Y10T428/31515 , H01L2924/00 , H01L2924/3512 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a thermoconductive adhesive composition for reusing components. SOLUTION: The reworkable thermoconductive adhesive composition comprising an epoxy-based thermoconductive adhesive containing thermoconductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix, and a method of making the composition, are disclosed. In an additional embodiment, an improved method of removing cured thermoconductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components, is provided. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：提供用于重新使用部件的导热粘合剂组合物。 解决方案：公开了包含分散在无溶剂的杂环氧聚合物基质中的含有导热金属填料颗粒的环氧基导热粘合剂的可再加工的热导粘合剂组合物和制备该组合物的方法。 在另外的实施例中，从用于回收或回收模块组件的可用部件，特别是高成本的半导体器件，散热器和其它模块部件的电子元件中去除固化的导热聚合物粘合剂（这里公开为热界面材料）的改进方法是 提供。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：CA2676495A1
公开(公告)日：2011-02-24
申请号：CA2676495
申请日：2009-08-24
Applicant: IBM CANADA
Inventor： EDWARDS DAVID L , LANDREVILLE JEAN-LUC , SAVARD CARL , LANGE KATHRYN R , SIKKA KAMAL K , TOY HILTON T
Abstract: Embodiments of the invention are generally related to packaging of integrated circuit devices, and more specifically to the placement of thermal paste for cooling an integrated circuit device during operation. A barrier element may be placed along at least one side of an integrated circuit chip. The barrier element may contain thermal paste pumped out during expansion and contraction of the package components to areas near the chip. The barrier element may also form a reservoir to replenish thermal paste that is lost during thermal pumping of the paste.
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Patent Agency Ranking
公开(公告)号：DE69832324D1
公开(公告)日：2005-12-22
申请号：DE69832324
申请日：1998-04-14
Applicant: IBM
Inventor： EDWARDS DAVID LINN , CAMMARANO ARMANDO SALVATORE , COFFIN JEFFREY THOMAS , COURTNEY MARK GERARD , DROFITZ JR , ELLSWORTH JR , GOLDMANN LEWIS SIGMUND , IRUVANTI SUSHUMNA , POMPEO FRANK LOUIS , SABLINSKI WILLIAM EDWARD , SHERIF RAED A , TOY HILTON T
Abstract: A scheme of providing a seal band for semi-conductor substrates and chip carriers encompasses a structure and a method that uses a multi-layer metallic seal (23) to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability. hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core (43), and lower melting point thin interconnecting solder layers (41.45). where the thin interconnecting solder layers may have similar or different melting points.
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公开(公告)号：CA2676495C
公开(公告)日：2014-04-08
申请号：CA2676495
申请日：2009-08-24
Applicant: IBM CANADA
Inventor： EDWARDS DAVID L , LANDREVILLE JEAN-LUC , SAVARD CARL , LANGE KATHRYN R , SIKKA KAMAL K , TOY HILTON T
Abstract: Embodiments of the invention are generally related to packaging of integrated circuit devices, and more specifically to the placement of thermal paste for cooling an integrated circuit device during operation. A barrier element may be placed along at least one side of an integrated circuit chip. The barrier element may contain thermal paste pumped out during expansion and contraction of the package components to areas near the chip. The barrier element may also form a reservoir to replenish thermal paste that is lost during thermal pumping of the paste.
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公开(公告)号：DE69832324T2
公开(公告)日：2006-07-27
申请号：DE69832324
申请日：1998-04-14
Applicant: IBM
Inventor： EDWARDS DAVID LINN , CAMMARANO ARMANDO SALVATORE , COFFIN JEFFREY THOMAS , COURTNEY MARK GERARD , DROFITZ STEPHEN S , ELLSWORTH MICHAEL JOSEPH , GOLDMANN LEWIS SIGMUND , IRUVANTI SUSHUMNA , POMPEO FRANK LOUIS , SABLINSKI WILLIAM EDWARD , SHERIF RAED A , TOY HILTON T
Abstract: A scheme of providing a seal band for semi-conductor substrates and chip carriers encompasses a structure and a method that uses a multi-layer metallic seal (23) to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability. hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core (43), and lower melting point thin interconnecting solder layers (41.45). where the thin interconnecting solder layers may have similar or different melting points.
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公开(公告)号：MY120319A
公开(公告)日：2005-10-31
申请号：MYPI9801534
申请日：1998-04-06
Applicant: IBM
Inventor： EDWARDS DAVID LINN , SHERIF RAED A , TOY HILTON T , DROFITZ STEPHEN S JR , CAMMARANO ARMANDO SALVATORE , COFFIN JEFFREY THOMAS , COURTNEY MARK GERARD , ELLSWORTH MICHAEL JOSEPH JR , GOLDMANN LEWIS SIGMUND , IRUVANTI SUSHUMNA , POMPEO FRANK LOUIS , SABLINSKI WILLIAM EDWARD
Abstract: THE PRESENT INVENTION RELATES GENERALLY TO A NEW SCHEME OF PROVIDING A SEAL BAND FOR SEMICONDUCTOR SUBSTRATES AND CHIP CARRIERS. MORE PARTICULARLY, THE INVENTION ENCOMPASSES A STRUCTURE AND A METHOD THAT USES A MULTI-LAYER METALLIC SEAL (23) TO PROVIDE PROTECTION TO CHIPS ON A CHIP CARRIER. THIS MULTI-LAYER METAL SEAL PROVIDES BOTH ENHANCED HERMETICITY LIFETIME AND ENVIRONMENTAL PROTECTION. FOR THE PREFERRED EMBODIMENT THE MULTI-LAYER METALLIC SEAL BAND IS A THREE LAYER, SOLDER SANDWICH STRUCTURE WHICH IS USED TO CREATE A LOW COST, HIGH RELIABILITY, HERMETIC SEAL FOR THE MODULE. THIS SOLDER SANDWICH HAS A HIGH MELTING TEMPERATURE THICK SOLDER INNER CORE (43), AND LOWER MELTING POINT THIN INTERCONNECTING SOLDER LAYERS (41, 45), WHERE THE THIN INTERCONNECTING SOLDER LAYERS MAY HAVE SIMILAR OR DIFFERENT MELTING POINTS. (FIGURE 3)
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公开(公告)号：SG63843A1
公开(公告)日：1999-03-30
申请号：SG1998000886
申请日：1998-04-28
Applicant: IBM
Inventor： EDWARDS DAVID LINN , CAMMARANO ARMANDO SALVATORE , COFFIN JEFFERY THOMAS , COURTNEY MARK GERARD , DROFITZ STEPHEN S JR , ELLSWORTH MICHAEL JOSEPH JR , GOLDMANN LEWIS SIGMUND , IRUVANTI SUSHUMNA , SABLINSKI WILLIAM EDWARD , SHERIE RAED A , TOY HILTON T , POMPEO FRANK LOUIS
Abstract: A scheme of providing a seal band for semi-conductor substrates and chip carriers encompasses a structure and a method that uses a multi-layer metallic seal (23) to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability. hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core (43), and lower melting point thin interconnecting solder layers (41.45). where the thin interconnecting solder layers may have similar or different melting points.
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