公开(公告)号：FR2740224B1

公开(公告)日：1998-12-31

申请号：FR9612844

申请日：1996-10-15

Applicant: IBM

Inventor： BAYER THOMAS ,  MEISSNER KLAUS ,  STOHR ROLAND ,  GRESCHNER JOHANN ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.

公开(公告)号：FR2740224A1

公开(公告)日：1997-04-25

申请号：FR9612844

申请日：1996-10-15

Applicant: IBM

Inventor： BAYER THOMAS ,  MEISSNER KLAUS ,  STOHR ROLAND ,  GRESCHNER JOHANN ,  STEINER WERNER

IPC: G01R1/073 ,  G01R31/28 ,  H01L21/66

Abstract: The invention relates to a contact probe arrangement for electrically connecting a test system with contact pads of a device to be tested. The contact probes are located in guide grooves. The guide grooves as well as areas are provided in a plane parallel to the surface of a guide plate and are covered by a protective plate. The contact probes may bend out laterally into the respective areas. This assures a very dense contact probe array. Contact probe arrays of this type may be used, for example, for detecting opens and shorts in integrated circuits or semiconductor chips. The invention overcomes the problem of adjusting for height differences in the contact pads caused by an uneven surface of the device to be tested.