公开(公告)号：JPH06170341A

公开(公告)日：1994-06-21

申请号：JP19367493

申请日：1993-08-04

Applicant: IBM

Inventor： SUTEIIBUN RINTSU BAADO ,  JIEFURII DONARUDO JIYOONZU ,  ROBAATO HENRII KATEIRU ,  RONARUDO JIEEMUSU MUUA ,  OSUKAA OREO MORENO

IPC: B05C5/02 ,  B05D1/36 ,  B08B3/02 ,  C23F1/08 ,  F26B21/00 ,  H01L21/304 ,  H05K3/00 ,  H05K3/06 ,  H05K3/22 ,  H05K3/26

Abstract: PURPOSE: To obtain high treatment efficiency by forming two rows of injection holes arranged apart spaced intervals in a transverse direction of an injector plate constituting a substrate transporting surface before and behind in a substrate transporting direction and transporting substrate while the substrate is subjected to the fluid-treatment by the fluid bearing effect generated by the jet of fluid. CONSTITUTION: Plenum housings 20 and 120 having plenum chambers 30 and 130 to which the fluid is supplied by tubes 40 and 140 are arranged one above the other across the prescribed spacing constituting the substrate transporting space. At least two rows of isolated drill holes 60, 70 and 160, 170 are formed at the connected injector plates 50 and 150 constituting the upper part and lower part of the respective housings 20 and 120. Rollers 80 and 90 for transporting the substrates, such as printed circuit boards, are arranged at the inlet end 54 and outlet end 56 of the substrate transporting space. The substrate carried into the apparatus by the roller 80 on the inlet side is transported by the fluid bearing effect by the jet from the first hole 60 row and the back flow accompanying the fluid from the holes 60 is promoted by the jet from the second hole 70 row.

公开(公告)号：JPH0671232A

公开(公告)日：1994-03-15

申请号：JP12882893

申请日：1993-05-31

Applicant: IBM

Inventor： SUTEIIBUN RINTSU BAADO ,  JIEFURII DONARUDO JIYOONZU ,  ROBAATO HENRII KATEIRU ,  RONARUDO JIEEMUSU MUUA ,  OSUKAA OREO MORENO

IPC: B05C5/02 ,  B05D1/36 ,  B08B3/02 ,  C23F1/08 ,  F26B21/00 ,  H01L21/304 ,  H05K3/00 ,  H05K3/22 ,  H05K3/26

Abstract: PURPOSE: To provide an apparatus capable of efficiently treating substrates with fluid jet and a method therefor. CONSTITUTION: At least one of rows 60 and 70 of fluid jet injectors penetrate the surface 52 of the apparatus. The substrate 100 to be treated is transported on the apparatus surface via the rollers 80 and 90 placed at the inlet ends 54 and 154 and outlet ends 56 and 156 of the apparatus surface. The substrate is transported in a direction practicably parallel to the axis extending from the inlet ends 54, 154 associated with the apparatus surface to the outlet ends 56, 156 and the rows 60 and 70 of the fluid jet injectors are aligned perpendicular to the axis. The substrate is positioned in sufficient proximity to the apparatus surface in such a manner that the jets emitted from the fluid jet injectors at the time of transportation are sunk into the layer of the consuming fluid covering the surface and that the injected jets constitute the dipping jets.

公开(公告)号：JPH0248666A

公开(公告)日：1990-02-19

申请号：JP14856189

申请日：1989-06-13

Applicant: IBM

Inventor： SUTEIIBUN RINTSU BAADO ,  KURAUDEIUSU FUEEGAA ,  JIYON JIYOSEFU GURENINGU ,  GARESU JIEFURII HOKAMU ,  SUTEIIBUN AARU MORISU ,  UOORUTAA POORU PAUROUSUKII ,  JIYON JIEIMUZU RITSUKO ,  PIITAA SUROUTA JIYUNIA ,  RANDEI UIRIAMU SUNAIDAA

IPC: G03F7/26 ,  C08J7/12 ,  G03F7/40 ,  H01L21/306 ,  H01L21/311 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10

Abstract: PURPOSE: To unnecessitate the use of dangerous or explosive chemicals in etching a polyimide layer by bringing the layer into successive contact with an aq. soln., an acid and a soln. CONSTITUTION: A satisfactorily or practically satisfactorily cured polyimide layer is brought into successive contact with an aq. metal. hydroxide soln., an acid and a metal hydroxide soln. The transfer of chemicals from one bath to other bath by which the service life of the baths is shortened by neutralization is suppressed and slight washing can be carried out.