公开(公告)号：DE3877437D1

公开(公告)日：1993-02-25

申请号：DE3877437

申请日：1988-06-28

Applicant: IBM

Inventor： CLARKE THOMAS CARL ,  KOVAC CAROLINE ANN ,  JUNG DAE YOUNG ,  PARK JAE MYUNG ,  THOMAS RICHARD RONALD

IPC: C23C16/06 ,  C23C16/04 ,  C23C16/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  C23C18/30 ,  H01L21/288 ,  H05K3/14 ,  H05K3/18 ,  H01L21/02

公开(公告)号：DE69114355D1

公开(公告)日：1995-12-14

申请号：DE69114355

申请日：1991-02-27

Applicant: IBM

Inventor： BUCHWALTER LEENA PAIVIKKI ,  BUCHWALTER STEPHEN LESLIE ,  O'TOOLE TERRENCE ROBERT ,  THOMAS RICHARD RONALD ,  VIEHBECK ALFRED

IPC: C08G73/10 ,  C08J7/12 ,  C09D179/08 ,  C09J5/02 ,  C23C18/20 ,  C23C18/22 ,  H05K3/38

Abstract: The surface modification of polyimide materials by a chemical process is disclosed to provide a variety of functional groups on the surface. The surface is treated to produce polyamic acid carboxyl groups which are subsequently reacted with epoxies, hydrazines, or alcohols. The carboxyl groups can also be subjected to other organic reactions, such as reduction with metal hydrides and the like. The versatility and controllability of this process lends itself to promoting adhesion of the polyimide to similarly treated polyimides, other polymers and other substrates as well as combining with metals such as metal catalysts used for depositing conductors on non-conductive surfaces such as circuit boards.

公开(公告)号：DE3877437T2

公开(公告)日：1993-07-15

申请号：DE3877437

申请日：1988-06-28

Applicant: IBM

Inventor： CLARKE THOMAS CARL ,  KOVAC CAROLINE ANN ,  JUNG DAE YOUNG ,  PARK JAE MYUNG ,  THOMAS RICHARD RONALD

IPC: C23C16/06 ,  C23C16/04 ,  C23C16/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  C23C18/30 ,  H01L21/288 ,  H05K3/14 ,  H05K3/18 ,  H01L21/02