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公开(公告)号：JPH11274376A
公开(公告)日：1999-10-08
申请号：JP36146698
申请日：1998-12-18
Inventor： KENETH RAYMOND CARTER , CRAIG JOHN HOKER , JAMES LUPTON HEDRICK , ROBERT DENNIS MILLER , GAYNES MICHAEL ANTHONY , BUCHWALTER STEPHEN LESLIE
CPC classification number: H01L21/563 , H01L23/293 , H01L2224/16225 , H01L2224/73203 , H01L2924/00014 , H01L2924/01019 , H01L2924/09701 , H01L2224/0401
Abstract: PROBLEM TO BE SOLVED: To make an encapsulating material reworkable for permitting respective devices to be repaired and replaced under the environment of integrated circuit assembly, by making the encapsulating material contain a thermoplastic polymer, which is formed adjacent to solder bonding and composed of ring- opening polymerization of ring oligomer.
SOLUTION: An ring oligomer in an encapsulating material forms a thermally stable polymer, which is properly formed upon application at a region applied by ring-opening polymerization. Therefore, the encapsulating material can be simply melted adjacent to a chip from a hotmelt and can be flowed into an assembly by capillary action. The encapsulating material can be reworked by simply concentrating heat on a specific device, heating the thermoplastic polymer to a temperature above its melting temperature Tg and by melting solder. Then, the chip can be removed from a board. The normal reworking temperature is within a range of approximately 250-400°C.
COPYRIGHT: (C)1999,JPOAbstract translation: 要解决的问题：为了使封装材料可再加工以允许在集成电路组件的环境下修复和更换相应的器件，通过使封装材料包含邻近焊接接合形成的热塑性聚合物， 环低聚物的开环聚合。 解决方案：封装材料中的环状低聚物形成热稳定的聚合物，其在通过开环聚合应用的区域适当形成。 因此，封装材料可以从热熔体中简单地熔融到芯片附近，并且可以通过毛细管作用流入组件。 可以通过简单地将热量集中在特定装置上，将热塑性聚合物加热至高于其熔融温度Tg的温度并通过熔化焊料来重新加工封装材料。 然后，可以从电路板上取下芯片。 正常的返工温度在约250-400摄氏度的范围内。
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公开(公告)号：DE3888608T2
公开(公告)日：1994-10-27
申请号：DE3888608
申请日：1988-08-23
Applicant: IBM
Inventor： BUCHWALTER STEPHEN LESLIE , KOVAC CAROLINE ANN , NGUYEN LUU THANH
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Patent Agency Ranking
公开(公告)号：DE69015878D1
公开(公告)日：1995-02-23
申请号：DE69015878
申请日：1990-03-21
Applicant: IBM
Inventor： BREGMAN MARK FIELDING , BUCHWALTER STEPHEN LESLIE , HERMANN KARL , KOVAC CAROLINE ANN , POORE PAIGE ADAMS , VIEHBECK ALFRED
IPC: H01L23/538 , H05K1/02 , H05K1/05 , H05K1/14 , H05K3/32 , H05K3/42 , H05K3/44 , H05K3/46 , H05K1/00
Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.
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公开(公告)号：DE69015878T2
公开(公告)日：1995-07-13
申请号：DE69015878
申请日：1990-03-21
Applicant: IBM
Inventor： BREGMAN MARK FIELDING , BUCHWALTER STEPHEN LESLIE , HERMANN KARL , KOVAC CAROLINE ANN , POORE PAIGE ADAMS , VIEHBECK ALFRED
IPC: H01L23/538 , H05K1/02 , H05K1/05 , H05K1/14 , H05K3/32 , H05K3/42 , H05K3/44 , H05K3/46 , H05K1/00
Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.
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公开(公告)号：BR8906690A
公开(公告)日：1990-09-11
申请号：BR8906690
申请日：1989-12-22
Applicant: IBM
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公开(公告)号：DE69114355D1
公开(公告)日：1995-12-14
申请号：DE69114355
申请日：1991-02-27
Applicant: IBM
Inventor： BUCHWALTER LEENA PAIVIKKI , BUCHWALTER STEPHEN LESLIE , O'TOOLE TERRENCE ROBERT , THOMAS RICHARD RONALD , VIEHBECK ALFRED
Abstract: The surface modification of polyimide materials by a chemical process is disclosed to provide a variety of functional groups on the surface. The surface is treated to produce polyamic acid carboxyl groups which are subsequently reacted with epoxies, hydrazines, or alcohols. The carboxyl groups can also be subjected to other organic reactions, such as reduction with metal hydrides and the like. The versatility and controllability of this process lends itself to promoting adhesion of the polyimide to similarly treated polyimides, other polymers and other substrates as well as combining with metals such as metal catalysts used for depositing conductors on non-conductive surfaces such as circuit boards.
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公开(公告)号：DE3888608D1
公开(公告)日：1994-04-28
申请号：DE3888608
申请日：1988-08-23
Applicant: IBM
Inventor： BUCHWALTER STEPHEN LESLIE , KOVAC CAROLINE ANN , NGUYEN LUU THANH
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