公开(公告)号：DE69114355D1

公开(公告)日：1995-12-14

申请号：DE69114355

申请日：1991-02-27

Applicant: IBM

Inventor： BUCHWALTER LEENA PAIVIKKI ,  BUCHWALTER STEPHEN LESLIE ,  O'TOOLE TERRENCE ROBERT ,  THOMAS RICHARD RONALD ,  VIEHBECK ALFRED

IPC: C08G73/10 ,  C08J7/12 ,  C09D179/08 ,  C09J5/02 ,  C23C18/20 ,  C23C18/22 ,  H05K3/38

Abstract: The surface modification of polyimide materials by a chemical process is disclosed to provide a variety of functional groups on the surface. The surface is treated to produce polyamic acid carboxyl groups which are subsequently reacted with epoxies, hydrazines, or alcohols. The carboxyl groups can also be subjected to other organic reactions, such as reduction with metal hydrides and the like. The versatility and controllability of this process lends itself to promoting adhesion of the polyimide to similarly treated polyimides, other polymers and other substrates as well as combining with metals such as metal catalysts used for depositing conductors on non-conductive surfaces such as circuit boards.

公开(公告)号：MY134716A

公开(公告)日：2007-12-31

申请号：MYPI9300721

申请日：1993-04-21

Applicant: IBM

Inventor： BRADY MICHAEL JOHN ,  RIELEY SHELDON COLE ,  WALKER GEORGE FREDERICK ,  FARRELL CURTIS EDWARD ,  KANG SUNG KWON ,  MARINO JEFFREY ROBERT ,  MIKALSEN DONALD JOSEPH ,  MOSKOWITZ PAUL ANDREW ,  O'SULLIVAN EUGENE JOHN ,  O'TOOLE TERRENCE ROBERT ,  PURUSHOTHAMAN SAMPATH

IPC: H01L21/60 ,  H01L23/485 ,  C23C18/50 ,  C25D3/54 ,  H01L21/288 ,  H01L21/603 ,  H01L21/768 ,  H01L23/495 ,  H01L23/498 ,  H01L23/532

Abstract: SILICON AND GERANIUM CONTAINING MATERIALS ARE USED AT SURFACE OF CONDUCTORS IN ELECTRONIC DEVICES. SOLDER CAN BE FLUXLESSLY BONDED AND WIRES CAN BE WIRED BONDED TO THESE SURFACES. THESE MATERIAL ARE USED AS A SURFACE COATING FOR LEAD FRAMES FOR PACKAGING INTEGRATED CIRCUIT CHIPS. THESE MATERIALS CAN BE DECAL TRANSFERRED ONTO CONDUCTOR SURFACES OR ELECTROLESSLY OR ELECTROLYTICALLY DISPOSED THEREON.(FIG. 1)