公开(公告)号：JPH09181125A

公开(公告)日：1997-07-11

申请号：JP29996296

申请日：1996-11-12

Applicant: IBM

Inventor： PANAYOTEISU KONSUTANTEINUU AND ,  MADABU DATSUTA ,  HARIKURIA DERIJIYANNI ,  UIRUMA JIYAN HOOKANZU ,  SUN KUON KAN ,  KIISU TOMASU KUFUIETONIYAKU ,  GANGADAARA SUWAMI MATADO ,  SANPASU PURUSHIYOTAMAN ,  RIIZEN SHII ,  TON HOO MIN

IPC: B23K35/26 ,  B23K35/00 ,  B32B15/01 ,  C22C13/00 ,  C22C13/02 ,  H01L21/60 ,  H01L23/485 ,  H01L21/321

Abstract: PROBLEM TO BE SOLVED: To provide a connecting structure suitable for connecting a very small electronic circuit chip with a package. SOLUTION: This mutual connecting structure contains the following in order; an adhesion/barrier layer stuck on a passivated board (e.g. silicon wafer), an adhesion layer which is arbitrarily selected and added, a layer to which metal selected out of a group composed of Ni, Co, Fe, NiFe, NiCo, CoFe, NiCoFe can be soldered, and a leadless solder ball which contains a kind or a plurality of kinds of alloy elements selected out of tin, Bi, Ag and Sb which are main components and a kind or a plurality of kinds of elements arbitrarily selected out of a group composed of Zn, In, Ni, Co and Cu.