公开(公告)号：DE59705594D1

公开(公告)日：2002-01-10

申请号：DE59705594

申请日：1997-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DLUGOSCH DIETER ,  PRASS ROLAND ,  KIRSCHBAUER JOSEF ,  DIDSCHIES GUENTER

IPC: B42D15/10 ,  G06K19/077

Abstract: The invention concerns a chip card with a semiconductor chip (2) - lead frame (3) combination. To design a reliable chip card that can withstand bending and tensile loads, the connecting lugs of the lead frame (3) which constitute the galvanic contacts (9) extend outwards and are embedded in the plastic body of the card (1). Beads (10) are fitted to provide greater relief from mechanical stresses.

公开(公告)号：DE59510967D1

公开(公告)日：2004-12-23

申请号：DE59510967

申请日：1995-03-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KIRSCHBAUER JOSEF ,  HOPF ERICH ,  GROENNINGER GUENTHER ,  FISCHER JUERGEN ,  DIDSCHIES GUENTER ,  MUNDIGL JOSEF ,  ROGALLI MICHAEL

IPC: G06K19/077

Abstract: This invention relates to chip-card comprising of plastic card in which semiconductor chip is placed. The chip card formed by plastic card in which semiconductor chip surrounded with plastic body is placed. The semiconductor chip is electrically connected to contact tabs connected to plastic card. The contact tabs are connected to the plastic card by means of glue substance with at least three layers. The middle layer of the glue substance is formed of flexible material. The contact tabs near the plastic body and outside it have flexible region.

公开(公告)号：AT282858T

公开(公告)日：2004-12-15

申请号：AT95911211

申请日：1995-03-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KIRSCHBAUER JOSEF ,  HOPF ERICH ,  GROENNINGER GUENTHER ,  FISCHER JUERGEN ,  DIDSCHIES GUENTER ,  MUNDIGL JOSEF ,  ROGALLI MICHAEL

IPC: B42D15/10 ,  C09J7/02 ,  C09J153/02 ,  C09J177/00 ,  G06K19/077

公开(公告)号：AT209802T

公开(公告)日：2001-12-15

申请号：AT97935498

申请日：1997-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： DLUGOSCH DIETER ,  PRASS ROLAND ,  KIRSCHBAUER JOSEF ,  DIDSCHIES GUENTER

IPC: B42D15/10 ,  G06K19/077

Abstract: The invention concerns a chip card with a semiconductor chip (2) - lead frame (3) combination. To design a reliable chip card that can withstand bending and tensile loads, the connecting lugs of the lead frame (3) which constitute the galvanic contacts (9) extend outwards and are embedded in the plastic body of the card (1). Beads (10) are fitted to provide greater relief from mechanical stresses.