公开(公告)号：DE59510967D1

公开(公告)日：2004-12-23

申请号：DE59510967

申请日：1995-03-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KIRSCHBAUER JOSEF ,  HOPF ERICH ,  GROENNINGER GUENTHER ,  FISCHER JUERGEN ,  DIDSCHIES GUENTER ,  MUNDIGL JOSEF ,  ROGALLI MICHAEL

IPC: G06K19/077

Abstract: This invention relates to chip-card comprising of plastic card in which semiconductor chip is placed. The chip card formed by plastic card in which semiconductor chip surrounded with plastic body is placed. The semiconductor chip is electrically connected to contact tabs connected to plastic card. The contact tabs are connected to the plastic card by means of glue substance with at least three layers. The middle layer of the glue substance is formed of flexible material. The contact tabs near the plastic body and outside it have flexible region.

公开(公告)号：ES2182279T3

公开(公告)日：2003-03-01

申请号：ES98909358

申请日：1998-02-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOUDEAU DETLEF ,  PUSCHNER FRANK ,  STAMPKA PETER ,  HUBER MICHAEL ,  HEITZER JOSEF ,  MUNDIGL JOSEF

IPC: B42D15/10 ,  G06K19/077

Abstract: A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

公开(公告)号：DE59805191D1

公开(公告)日：2002-09-19

申请号：DE59805191

申请日：1998-02-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOUDEAU DETLEF ,  PUESCHNER FRANK ,  STAMPKA PETER ,  HUBER MICHAEL ,  HEITZER JOSEF ,  MUNDIGL JOSEF

IPC: B42D15/10 ,  G06K19/077

Abstract: A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

公开(公告)号：AT222387T

公开(公告)日：2002-08-15

申请号：AT98909358

申请日：1998-02-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOUDEAU DETLEF ,  PUESCHNER FRANK ,  STAMPKA PETER ,  HUBER MICHAEL ,  HEITZER JOSEF ,  MUNDIGL JOSEF

IPC: B42D15/10 ,  G06K19/077

Abstract: A smart card module includes a semiconductor chip that is electrically conductively connected to a metallic lead frame in which contact areas are formed. The semiconductor chip and the contact areas are electrically conductively contacted through connection areas disposed on a surface of an electrically insulating protective layer applied to the semiconductor chip. That surface faces away from the semiconductor chip. Contact can be established between the connection areas and the contact areas through the use of soldered joints or electrically conductive adhesive bonds. A smart card including the smart card module is also provided.

公开(公告)号：DE59801682D1

公开(公告)日：2001-11-15

申请号：DE59801682

申请日：1998-01-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  PUESCHNER FRANK ,  MUNDIGL JOSEF ,  FISCHER JUERGEN ,  HOUDEAU DETLEF

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077

Abstract: A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.

公开(公告)号：AT282858T

公开(公告)日：2004-12-15

申请号：AT95911211

申请日：1995-03-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KIRSCHBAUER JOSEF ,  HOPF ERICH ,  GROENNINGER GUENTHER ,  FISCHER JUERGEN ,  DIDSCHIES GUENTER ,  MUNDIGL JOSEF ,  ROGALLI MICHAEL

IPC: B42D15/10 ,  C09J7/02 ,  C09J153/02 ,  C09J177/00 ,  G06K19/077

公开(公告)号：DE19738588B4

公开(公告)日：2004-11-25

申请号：DE19738588

申请日：1997-09-03

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MUNDIGL JOSEF

IPC: H01F27/29 ,  H01L23/31 ,  H01L23/48 ,  H01L21/60 ,  H01L23/50

公开(公告)号：AT206835T

公开(公告)日：2001-10-15

申请号：AT98904010

申请日：1998-01-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  PUESCHNER FRANK ,  MUNDIGL JOSEF ,  FISCHER JUERGEN ,  HOUDEAU DETLEF

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077

Abstract: A smart card with a card carrier on which a data processing circuit and also a connection assembly for the contactless communication of data between the data processing circuit and an external data processing station are provided. In the course of producing a prior art smart card, an integrated circuit is applied to a card carrier made of plastic. Afterwards, a transmitting/receiving coil connected to corresponding terminals of the integrated circuit is applied along the outer edges of the prior art smart card. In the case of the prior art smart card, the fact that defective prior art smart cards have to be destroyed is disadvantageous. According to the invention, the data processing circuit and the connection assembly are provided in a region of at least one module carrier and the card carrier has a region for accommodating the module carrier. This makes it possible firstly to test the completed module carrier in respect of its proper functioning before it is incorporated into a card carrier.