1.
    发明专利
    未知

    公开(公告)号:DE59510967D1

    公开(公告)日:2004-12-23

    申请号:DE59510967

    申请日:1995-03-07

    Abstract: This invention relates to chip-card comprising of plastic card in which semiconductor chip is placed. The chip card formed by plastic card in which semiconductor chip surrounded with plastic body is placed. The semiconductor chip is electrically connected to contact tabs connected to plastic card. The contact tabs are connected to the plastic card by means of glue substance with at least three layers. The middle layer of the glue substance is formed of flexible material. The contact tabs near the plastic body and outside it have flexible region.

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