公开(公告)号：WO03085727A2

公开(公告)日：2003-10-16

申请号：PCT/DE0301149

申请日：2003-04-08

Applicant: INFINEON TECHNOLOGIES AG ,  BEYER VOLKER ,  FISCHER JUERGEN ,  HEINEMANN ERIK ,  MARBACH-FISCHBACH IDA

Inventor： BEYER VOLKER ,  FISCHER JUERGEN ,  HEINEMANN ERIK ,  MARBACH-FISCHBACH IDA

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/31

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/3185 ,  H01L24/28 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01033 ,  H01L2924/01052

Abstract: The invention relates to the flip-chip mounting of semiconductor chips. In order to protect against mechanical stress or damage and to electrically insulate, a protective layer (7) is applied to the rear side of the semiconductor chip (2). This protective layer can also be provided on the flanks (8) of the semiconductor chip. The protective layer can be applied before starting the entire assembly process sequence or when the semiconductor is fixed upside down to a support (1).

Abstract translation: 在倒装芯片安装的半导体芯片：对于抗机械应力或损坏，保护和电绝缘性，在半导体芯片（2）的背面上的保护层（7）被施加。 该保护层也可以存在于半导体芯片的侧面（8）。 该保护层可以在整个装配过程链之前，或者只在所述半导体芯片的固定被施加在基板1上颠倒。

公开(公告)号：DE50015980D1

公开(公告)日：2010-10-14

申请号：DE50015980

申请日：2000-07-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PUESCHNER FRANK ,  FISCHER JUERGEN

IPC: G06K19/077

公开(公告)号：AT479963T

公开(公告)日：2010-09-15

申请号：AT00115075

申请日：2000-07-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PUESCHNER FRANK ,  FISCHER JUERGEN

IPC: G06K19/077

公开(公告)号：DE50301046D1

公开(公告)日：2005-09-29

申请号：DE50301046

申请日：2003-01-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHER JUERGEN ,  PALM HERBERT ,  PUESCHNER FRANK ,  WILLER JOSEF

IPC: G06K19/077

Abstract: The structure includes a cover (20) over a recess (11). When the cover (20) is connected, the substrate (30) is held in the recess, along the base (12, 14, 15).

公开(公告)号：AT291259T

公开(公告)日：2005-04-15

申请号：AT00965790

申请日：2000-08-24

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PUESCHNER FRANK ,  HEINEMANN ERIK ,  FISCHER JUERGEN

IPC: H01L23/28 ,  G06K19/077 ,  H01L21/56 ,  H01L21/60 ,  H01L23/12

公开(公告)号：DE59510967D1

公开(公告)日：2004-12-23

申请号：DE59510967

申请日：1995-03-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KIRSCHBAUER JOSEF ,  HOPF ERICH ,  GROENNINGER GUENTHER ,  FISCHER JUERGEN ,  DIDSCHIES GUENTER ,  MUNDIGL JOSEF ,  ROGALLI MICHAEL

IPC: G06K19/077

Abstract: This invention relates to chip-card comprising of plastic card in which semiconductor chip is placed. The chip card formed by plastic card in which semiconductor chip surrounded with plastic body is placed. The semiconductor chip is electrically connected to contact tabs connected to plastic card. The contact tabs are connected to the plastic card by means of glue substance with at least three layers. The middle layer of the glue substance is formed of flexible material. The contact tabs near the plastic body and outside it have flexible region.

公开(公告)号：DE10137872C1

公开(公告)日：2003-06-05

申请号：DE10137872

申请日：2001-08-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHER JUERGEN ,  PUESCHNER FRANK ,  HEITZER JOSEF

IPC: H01L21/603 ,  H01R4/02 ,  H01R43/02 ,  H01L23/49

Abstract: The contact has a contact surface (1), an intermediate contact (2) and a wire end (3) that is flattened relative to the wire, whereby the contact surface, intermediate contact and wire end are permanently electrically connected together and the intermediate contact is wedge-shaped. A transition (6) between the flattened wire end and the wire is near the surface (5) of the intermediate contact on which the electrically conducting surface is formed. .

公开(公告)号：DE59904947D1

公开(公告)日：2003-05-15

申请号：DE59904947

申请日：1999-01-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIES MANFRED ,  FISCHER JUERGEN ,  HOUDEAU DETLEF

IPC: A61B5/117 ,  G06K9/00 ,  G06K19/077 ,  G06T1/00 ,  G07C9/00

Abstract: In a smart card module for biometric sensors for installation in smart cards, a support has at least one through opening or window in the region of a sensor chip. The sensor chip is mounted on the support such that an active surface of the sensor chip is directed toward the support and is situated in the region of the window, so that it can be accessed through the window in the support.

公开(公告)号：AT233418T

公开(公告)日：2003-03-15

申请号：AT98943710

申请日：1998-07-21

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PUESCHNER FRANK ,  FISCHER JUERGEN ,  HEINEMANN ERIK

IPC: B42D15/10 ,  G06K19/077 ,  H01L23/12 ,  H01L23/28 ,  H01L23/50

Abstract: A method for producing a chip module includes punching a chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by slots defining a given distance. The given distance is subsequently reduced to a dimension preventing a flow through of a sealing mass by a swaging operation carried out at least in a region close to the slots.

公开(公告)号：DE10138659A1

公开(公告)日：2003-03-06

申请号：DE10138659

申请日：2001-08-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FISCHER JUERGEN ,  PUESCHNER FRANK ,  STAMPKA PETER ,  PAULUS STEFAN

IPC: G06K19/077 ,  H01L21/48 ,  H01L23/31 ,  H01Q1/22 ,  H01L21/60 ,  H01L25/065 ,  H01Q23/00

Abstract: With this method a track structure (2) is by etching on the upper surface of a metal plate or depositing on a motherboard (6). A semiconductor chip (1) is then attached to the track structure and connected to it by the contact surfaces (3) provided on the tracks, e.g. by bond wiring or flip chip assembly. After encapsulation (5) the rear surface of the motherboard is removed down to the track structure. The track structure already include any required antenna structure.