公开(公告)号：DE60202208D1

公开(公告)日：2005-01-13

申请号：DE60202208

申请日：2002-06-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIESE GERALD

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/58

Abstract: A structure for a bond pad used on a semiconductor device, in accordance with the present invention, includes a metal layer, an interconnect formed through a dielectric layer connecting to the metal layer and a bond pad having a first portion disposed over the metal layer and the interconnect, and a second portion disposed over the dielectric layer. The first portion includes a bond area for providing an attachment point for a connection, and the second portion includes a probe area for providing contact with a probe.

公开(公告)号：DE60202208T2

公开(公告)日：2005-12-15

申请号：DE60202208

申请日：2002-06-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRIESE GERALD

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/58

Abstract: A structure for a bond pad used on a semiconductor device, in accordance with the present invention, includes a metal layer, an interconnect formed through a dielectric layer connecting to the metal layer and a bond pad having a first portion disposed over the metal layer and the interconnect, and a second portion disposed over the dielectric layer. The first portion includes a bond area for providing an attachment point for a connection, and the second portion includes a probe area for providing contact with a probe.

公开(公告)号：DE10311368A1

公开(公告)日：2003-11-20

申请号：DE10311368

申请日：2003-03-14

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ROBL WERNER ,  BRINTZINGER AXEL ,  FRIESE GERALD ,  GOEBEL THOMAS

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L21/28

Abstract: Disclosed is a method of ball grid array packaging, comprising the steps of providing a semiconductor die having a metal conductors thereon, covering said metal conductors with an insulative layer, etching through said insulative layer so as to provide one or more openings to said metal conductors, depositing a compliant material layer, etching through said compliant material layer so as to provide one or more openings to said metal conductors, depositing a substantially homogenous conductive layer, patterning said conductive layer so as to bring at least one of said metal conductors in electrical contact with one or more pads, each said pad comprising a portion of said conductive layer disposed upon said compliant material, and providing solder balls disposed upon said pads. Also disclosed is the apparatus made from the method.

公开(公告)号：AU2002250505A1

公开(公告)日：2003-10-20

申请号：AU2002250505

申请日：2002-04-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BARTH HANS-JOACHIM ,  FELSNER PETRA ,  FRIESE GERALD ,  KALTALIOGLU ERDEM

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L21/82 ,  H01L23/485 ,  H01L23/525 ,  H01L23/532