Patent search ap:("INFINEON TECHNOLOGIES AG") AND inv:"FRITZ MARTIN" Page 1

1.

发明专利
未知

公开(公告)号：DE10152086B4

公开(公告)日：2007-03-22

申请号：DE10152086

申请日：2001-10-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MOECKEL JENS , FAERBER GERRIT , FRITZ MARTIN

IPC: H01L21/66 , G11C29/00 , G11C29/44

2.

发明专利
IC chip testing method compares voltage applied to one supply voltage terminal of each tested IC chip with detected voltage at different supply voltage terminal of IC chip 未知

公开(公告)号：DE10114291C1

公开(公告)日：2002-09-05

申请号：DE10114291

申请日：2001-03-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： WEBER FRANK , FAERBER GERRIT , HUEBNER MICHAEL , MOECKEL JENS , FRITZ MARTIN

IPC: G01R1/067 , G01R31/04 , G01R31/28 , H01L21/66 , H01L21/60

Abstract: The testing method uses a contact card (40) for application of a test voltage to one of the supply voltage terminals of each of a number of IC chips (12) incorporated in a semiconductor wafer (10) and measurement of the voltage at a second supply voltage terminal of each IC chip, for comparison with the applied voltage, for acceptance or rejection of the IC chip.

3.

发明专利
Appliance for electric contacting substrate, containing integrated circuit with exposed contacts and contacting assembly with counter contacts on contacting plate in spacing corresponding to circuit contacts 未知

公开(公告)号：DE10308916A1

公开(公告)日：2004-09-16

申请号：DE10308916

申请日：2003-02-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： FRITZ MARTIN

IPC: G01R1/073 , G01R3/00 , H01L21/66

Abstract: Substrate (10) comprises integrated circuit (11) with exposed contacts (12) and contacting assembly (30) with counter contacts (22) on contacting plate (20) in same spacing as substrate contacts. Contacting plate material has the same longitudinal expansion coefficient as substrate. Thus contacting plate provides temperature stable position adjusting of countercontacts, even at changeable temperature (T) of substrate and contacting plate with identical contact spacing. Preferably contacting plate and substrate are of same material.

4.

发明专利
Device testing method, involves separating connection between defective device and supply line, then applying test signal on common line to test remaining devices 未知

公开(公告)号：DE10152086A1

公开(公告)日：2003-05-08

申请号：DE10152086

申请日：2001-10-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MOECKEL JENS , FAERBER GERRIT , FRITZ MARTIN

IPC: G11C29/00 , G11C29/44 , H01L21/66

Abstract: The method involves separating a connection between a defective device and the supply line, which are arranged on the wafer and connected to common data lines. Applying a test signal to the common line in order to test the remaining devices. The response signals from the common line are then assessed.

Patent Agency Ranking