公开(公告)号：DE10021865A1

公开(公告)日：2001-11-15

申请号：DE10021865

申请日：2000-05-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ALPERN PETER ,  SAUERT WOLFGANG ,  HERZOG THOMAS ,  SCHAUER HEINZ ,  TILGNER RAINER

IPC: H01L21/66 ,  H01L21/768 ,  H01L23/544 ,  H01L21/316

Abstract: A multilayer electronic component with a semiconductor chip (1) comprises conductive line (3,4,5), isolation (6-9) and planarizing layers (10), the last being a glass layer (11) with embedded adhesive regions (12) with adhesive faces (13,14) contacting neighboring isolation layers. Independent claims are also included for the following: (a) a component as above having a test structure; and (b) processes for making the component and test structure.

公开(公告)号：AT383662T

公开(公告)日：2008-01-15

申请号：AT01967197

申请日：2001-07-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： AIGNER ROBERT ,  ELBRECHT LUEDER ,  HERZOG THOMAS ,  MARKSTEINER STEPHAN ,  NESSLER WINFRIED

IPC: H01L37/02 ,  H01L41/22 ,  H01L41/319 ,  H03H3/02

公开(公告)号：DE10021865C2

公开(公告)日：2002-08-01

申请号：DE10021865

申请日：2000-05-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ALPERN PETER ,  SAUERT WOLFGANG ,  HERZOG THOMAS ,  SCHAUER HEINZ ,  TILGNER RAINER

IPC: H01L21/66 ,  H01L21/768 ,  H01L23/544 ,  H01L21/316

Abstract: An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.