公开(公告)号：DE10322757A1

公开(公告)日：2004-12-30

申请号：DE10322757

申请日：2003-05-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KILLER THOMAS ,  ALTHAUS HANS LUDWIG ,  WITTL JOSEF ,  HARTL ALFRED ,  WEBERPALS FRANK

IPC: G02B6/42 ,  H01L31/0203

Abstract: The arrangement has a surface mount optoelectronic component (1), a holding arrangement (3) for accommodating and aligning an optical fiber (4) for coupling to the component and a circuit board (2) with electrical leads on which the component can be surface mounted. The optical axis (5) of the component is perpendicular to the plane of the board and the holding arrangement connects to the side of the component facing away from the circuit board.

公开(公告)号：DE502004005146D1

公开(公告)日：2007-11-15

申请号：DE502004005146

申请日：2004-08-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HURT HANS ,  WITTL JOSEF ,  WEBERPALS FRANK ,  SCHUNK NIKOLAUS ,  AUBURGER ALBERT ,  PAULUS STEFAN ,  PRUCKER STEPHAN

IPC: H01S5/022 ,  B23K26/18

Abstract: A method for fabricating an optical or electronic module equipped with a plastics housing involves initially preparing at least one optical or electronic component or unit having an effective range (11) sufficient for active continuity of the component/unit with the ambience in the completed module, mounting a protective layer (12) on the component/unit (1), encapsulating the component or unit with at least one plastics compound (40) for forming the plastics housing (4) followed by partial removal of the plastics compound externally by laser device (13) so that the plastics compound between the protective layer (12) and the outer face of the housing (4) is removed and in which the protective layer is opaque to the radiation emanating from the laser device (13). An independent claim is included for an optical or electronic module.