1.
    发明专利
    未知

    公开(公告)号:DE102004044678B4

    公开(公告)日:2006-08-31

    申请号:DE102004044678

    申请日:2004-09-09

    Abstract: In a method for fabricating a capacitor that includes an electrode structure (80), an auxiliary layer (40) is formed over a substrate (10). A recess (60), which determines the shape of the electrode structure (80), is etched into the auxiliary layer (40), and the electrode structure of the capacitor is formed in the recess. As an example, the auxiliary layer can be a semiconductor layer (40).

    3.
    发明专利
    未知

    公开(公告)号:DE102004063949A1

    公开(公告)日:2006-06-08

    申请号:DE102004063949

    申请日:2004-09-09

    Abstract: In a method for fabricating a capacitor that includes an electrode structure (80), an auxiliary layer (40) is formed over a substrate (10). A recess (60), which determines the shape of the electrode structure (80), is etched into the auxiliary layer (40), and the electrode structure of the capacitor is formed in the recess. As an example, the auxiliary layer can be a semiconductor layer (40).

    4.
    发明专利
    未知

    公开(公告)号:DE102004044678A1

    公开(公告)日:2006-03-16

    申请号:DE102004044678

    申请日:2004-09-09

    Abstract: In a method for fabricating a capacitor that includes an electrode structure (80), an auxiliary layer (40) is formed over a substrate (10). A recess (60), which determines the shape of the electrode structure (80), is etched into the auxiliary layer (40), and the electrode structure of the capacitor is formed in the recess. As an example, the auxiliary layer can be a semiconductor layer (40).

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