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公开(公告)号:DE102004044678B4
公开(公告)日:2006-08-31
申请号:DE102004044678
申请日:2004-09-09
Applicant: INFINEON TECHNOLOGIES AG
Inventor: KUNDALGURKI SRIVATSA , SCHUPKE KRISTIN , MANGER DIRK , SCHLOESSER TILL , MOLL PETER
IPC: H01L21/8242
Abstract: In a method for fabricating a capacitor that includes an electrode structure (80), an auxiliary layer (40) is formed over a substrate (10). A recess (60), which determines the shape of the electrode structure (80), is etched into the auxiliary layer (40), and the electrode structure of the capacitor is formed in the recess. As an example, the auxiliary layer can be a semiconductor layer (40).
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公开(公告)号:DE10353269B3
公开(公告)日:2005-05-04
申请号:DE10353269
申请日:2003-11-14
Applicant: INFINEON TECHNOLOGIES AG
Inventor: MOLL HANS-PETER , HEINECK LARS , SEITZ MIHEL , KUNDALGURKI SRIVATSA
IPC: H01L21/334 , H01L21/8242
Abstract: The production of a trench capacitor with an insulation collar (sic) in a substrate, which is electrically connected to the substrate via a trenched (sic) contact, especially for a semiconductor storage cell, and a selection transistor involves the provision of a trench in the substrate using a hard mask, a capacitor dielectric, an Si oxide liner, formation of a liner mask from part of the liner, and provision of an upper liner from undoped poly-Si or amorphous Si.
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公开(公告)号:DE102004063949A1
公开(公告)日:2006-06-08
申请号:DE102004063949
申请日:2004-09-09
Applicant: INFINEON TECHNOLOGIES AG
Inventor: KUNDALGURKI SRIVATSA , SCHUPKE KRISTIN , MANGER DIRK , SCHLOESSER TILL , MOLL PETER
IPC: H01L21/8242
Abstract: In a method for fabricating a capacitor that includes an electrode structure (80), an auxiliary layer (40) is formed over a substrate (10). A recess (60), which determines the shape of the electrode structure (80), is etched into the auxiliary layer (40), and the electrode structure of the capacitor is formed in the recess. As an example, the auxiliary layer can be a semiconductor layer (40).
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公开(公告)号:DE102004044678A1
公开(公告)日:2006-03-16
申请号:DE102004044678
申请日:2004-09-09
Applicant: INFINEON TECHNOLOGIES AG
Inventor: KUNDALGURKI SRIVATSA , SCHUPKE KRISTIN , MANGER DIRK , SCHLOESSER TILL , MOLL PETER
IPC: H01L21/8242
Abstract: In a method for fabricating a capacitor that includes an electrode structure (80), an auxiliary layer (40) is formed over a substrate (10). A recess (60), which determines the shape of the electrode structure (80), is etched into the auxiliary layer (40), and the electrode structure of the capacitor is formed in the recess. As an example, the auxiliary layer can be a semiconductor layer (40).
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