Abstract:
The invention relates to an interface circuit for connecting to an output of a frequency converter. Said circuit contains at least two current paths (10, 20), which are intercoupled in a parallel connection and respectively comprise at least one cascode stage (12, 13, 22, 23) for signal processing. Said circuit permits direct current offsets of the frequency converter to be compensated, in addition to a switchable amplification ratio for signals with a wide dynamic range and provides a large signal-to-noise margin. The inventive interface circuit is preferably for use in mobile radio telephone receivers.
Abstract:
PCT No. PCT/DE97/01933 Sec. 371 Date Jun. 4, 1999 Sec. 102(e) Date Jun. 4, 1999 PCT Filed Sep. 3, 1996 PCT Pub. No. WO98/13865 PCT Pub. Date Apr. 2, 1998In order to produce a MOS transistor with HDD profile and LDD profile, the HDD profile is firstly formed, followed by the LDD profile, in the area for the LDD profile in order to produce steep dopant profiles. The LDD profile is preferably produced by etching and in situ doped selective epitaxy.
Abstract:
A MOS transistor has a gate electrode (33) having a T-shaped cross-section. The gate length is defined in a first structuring step by a spacer technique. The area of the gate electrode in the upper region is defined in a second structuring step. The MOS transistor can be produced with a channel length of less than 100 nm.
Abstract:
In an interface circuit for connection to an output of a frequency converter, at least two current paths are coupled to one another in parallel. Each current path includes at least one cascode stage for signal processing. The circuit compensates for DC voltage offsets of the frequency converter, and has a gain ratio that can be changed over for signals with a large dynamic range.
Abstract:
The interface circuit has a signal input, a signal output, a first current path (10) that couples the signal input to the signal output and contains at least one cascode stage (12,13), a second current path (20) with a cascode stage (22,23) connected in parallel to the first cascode stage and a connection for providing a common mode signal (28) in the first or second current path.
Abstract:
Metal oxide semiconductor transistor comprises: sink doped with a first conductivity type in semiconductor substrate; epitaxial layer arranged in sink surface and having doping concentration of less than 10 cm ; and source/drain regions of second conductivity type and a channel region arranged in epitaxial layer. Depth of source/drain regions is less than or equal to epitaxial layer thickness. An Independent claim is also included for a process for the production of the metal oxide semiconductor (MOS) transistor comprising: producing a sink doped with a first conductivity type in the semiconductor substrate; growing an epitaxial layer on the surface of the sink; producing a gate dielectric on the surface of the epitaxial layer; forming a gate electrode on the surface of the gate dielectric; and producing source/drain regions doped with second conductivity type in the epitaxial layer.
Abstract:
The invention relates to a method for producing an HF-FET. According to said method, doped source and drain regions (7, 8) are created in a substrate (1). A gate-insulation layer (4) is applied via a channel region. A spacer structure (6) is created above the substrate (1) which separates the channel region from the source and drain regions. A continuous metal layer (10) is deposited using this structure and the thickness of the metal layer is reduced to such an extent that electrically separate self-aligned metal structures (10.2, 10.3, 10.1) are formed above the source, drain and channel regions.