Abstract:
PROBLEM TO BE SOLVED: To provide an improved solid eletrolyte memory element which can increase the switching speed, and a method for manufacturing the solid electrolyte memory element. SOLUTION: The solid electrolite memory element is provided with an insoluble cathode electrode 210, an eluting anode electrode 240, and a solid electrolyte layer 230 having a defective portion between the above insoluble cathode electrode 210 and the eluting anode electrode 240, wherein its method for manufacturing the solid electrolyte memory element includes a process to form the desired defective portion in the above solid electrolyte matrix. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an electric switching device in which electric switching-on is performed by a track (101) established in a switching device (100). SOLUTION: The switching device (100) comprises a first electrode unit (201), a second electrode unit (202), and an electrolyte layer (203) which is arranged between the first and second electrode units (201, 202) to be connected with these electrode units in contact. The track (101) is formed between the first and second electrode units (201, 202) through the electrolyte layer (203) by a conductive element (102) spreading inside the electrolyte layer (203) from the first electrode unit (201). A heating device (400) heats the switching device (100) during switching operation. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
The invention relates to a semiconductor memory cell and a method for producing said cell. According to said method, the capacity (CFe) of a ferroelectric capacitor assembly, which is formed by the contact and/or a region of an essentially constant potential between the gate isolation region (GOX) and a ferroelectric region (16), the ferroelectric region (16) and an upper gate electrode (18), is configured in a reduced manner relative to conventional conditions and/or relative to the capacity (CGOX) of a gate insulation capacitor assembly, which is formed by the border surface between a channel region (K) and the gate insulation region (GOX), the gate insulation region (GOX) and the contact and/or the region of an essentially constant potential between the gate isolation region (GOX) and the ferroelectric region (16).
Abstract:
The invention concerns a method for producing a memory cell (1) comprising an organic storage layer (10), storing a digital information. Said method consists in carrying out a treatment of polycrystalline and monocrystalline semiconductor structures, during which said structures are subjected to high temperatures prior to applying the organic storage layer (10).
Abstract:
The object to develop a nonvolatile resistively switching memory system that can be manufactured on the basis of CMOS technology is solved by the present invention a method for manufacturing an electrolyte material layer with a chalcogenide material incorporated or deposited therein for using in semiconductor memory devices, in particular resistively switching memory devices or components, the method comprising at least the steps of producing a semiconductor substrate, depositing a binary chalcogenide layer onto the semiconductor substrate, depositing a sulfur containing layer onto the binary chalcogenide layer, and creating a ternary chalcogenide layer comprising at least two different chalcogenide compounds ASexSy, wherein one component A of the chalcogenide compounds ASexSy is constituted by materials of the IV elements main group, e.g. Ge, Si or of a transition metal, preferably of the group consisting of Zn, Cd, Hg, or a combination thereof.
Abstract:
The invention relates to a ferroelectric memory cell, comprising a ferroelectric tunnel layer (FeTL) which forms the ferroelectric memory cell together with a first electrical conducting region (1) and a second electrical conducting region (2). The ferroelectric tunnel layer (FeTL) is arranged between the both electrical conducting regions (1, 2).
Abstract:
The method involves coating a first electrode with a solid-state electrolyte layer under purposeful defect formation in partial crystalline solid-state electrolyte matrix, and then forming a second electrode on the solid-state electrolyte layer. Particle or ion irradiation is performed for the purposeful defect formation in the solid-state electrolyte matrix. An independent claim is included for the solid-state electrolyte memory.
Abstract:
The invention relates to a method for operating a switching or amplifier device ( 11, 111 ), and to a switching or amplifier device ( 11, 111 ) comprising: an active material ( 13, 113 ) adapted to be placed in a more or less conductive state by means of appropriate switching processes; and at least three electrodes or contacts ( 12 a, 12 b, 12 c).
Abstract:
The method involves production of a solid electrolyte memory cell which has a memory section. The cell has a solid electrolyte material area (11) made up of a solid electrolyte material (11'). The area is activated by doping it with a dopant (12) and then the cell is irradiated with ions or ion beam (30) either partly or completely.
Abstract:
The present invention relates to a reproducible conditioning during the manufacturing of a resistively switching CBRAM memory cell comprising a first electrode and a second electrode with an active material positioned therebetween. The active material is adapted to be placed in a more or less electroconductive state by means of electrochemical switching processes. A CBRAM memory cell manufactured pursuant to the method according to the invention has, due to the improved conditioning, more reliable and more distinctly evaluable electrical switching properties. Moreover, no more forming step is necessary with the method according to the present invention.